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  • NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit
  • NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit
  • NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit
  • NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit
  • NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit
  • NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit
NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit
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NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit

$7.50-$28.00/ Piece|5 Piece/Pieces(Min. Order)

Customization:

Customized logo（Min.Order: 1000 pieces）
Customized packaging（Min.Order: 500 pieces）
Graphic customization（Min.Order: 1000 pieces）
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NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Development and Connectivity: A compact single-board computer (SBC) designed for hardware and software development, IoT projects, and peripheral connectivity via its OTG port, enabling direct USB device interaction without a host computer.
  • Versatile Computing: Equipped with Linux OS for flexible programming and customization, supporting applications ranging from data acquisition to embedded systems.

Key features

  • 1. Durable Metal Construction for Rugged Environments

    • With a corrosion-resistant metal body, you can ensure long-lasting durability in harsh or industrial settings. The ribbed texture enhances heat dissipation, maintaining optimal performance even under heavy use.

  • 2. Versatile OTG Port for Seamless Connectivity

    • With the built-in OTG port, you can connect USB devices directly without a host computer, enabling flexible peripheral integration for IoT projects or field operations.

  • 3. Compact Design for Space-Constrained Applications

    • With its minimalist, industrial-grade design, you can deploy the board in tight spaces while supporting multi-tasking workloads. Its small footprint makes it ideal for embedded systems or portable setups.

  • 4. Certified for Safety and Sustainability

    • Complying with CE and RoHS standards, you can ensure compliance with global safety and environmental regulations, making it suitable for commercial or DIY projects.

  • 5. Linux-Ready for Customized Development

    • With Linux pre-supported, you can leverage open-source flexibility to customize software for industrial IoT, data acquisition, or specialized hardware modules.

Product details

NanoPi nano pi NEO Allwinner H3 Development Board Metal Shell Kit

The NanoPi NEO Allwinner H3 Development Board Metal Shell Kit is a compact, rugged single-board computer (SBC) designed for versatile IoT, industrial, and DIY applications. Built with a durable aluminum shell and OTG connectivity, it combines portability with robust performance, certified for global compliance (CE/RoHS) and optimized for Linux-based development.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialAluminum alloy with ribbed heat-dissipating textureIndustrial use, high-temperature environments
ConnectivityFront-mounted OTG portPortable peripheral connectivity for field operations
CertificationsCE, RoHSCompliance for global commercial deployment
Operating SystemLinux-compatibleCustomizable software for IoT and embedded systems
Thermal DesignRibbed surface for passive coolingProlonged operation without overheating

Customization guide

Adjustable parameters include:

  • Port Configuration: Customize OTG port functionality for specific peripheral needs.
  • Shell Design: Modify ribbed texture depth or material thickness for specialized thermal requirements.
  • OS Integration: Tailor Linux distributions to match project-specific software dependencies.

Get inspired

With its compact metal shell and OTG versatility, the NanoPi NEO is ideal for creating portable IoT devices, industrial sensors, or ruggedized embedded systems. Its Linux foundation ensures seamless integration with open-source ecosystems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal PerformanceStandard passive coolingEnhanced ribbed cooling (+20%)Active cooling (+40%)*
Connectivity Ports1x OTG1x OTG + 1x USB-C2x USB-C + 1x OTG
CertificationsCE, RoHSCE, RoHS, IP54CE, RoHS, IP67

Supplier's note

  1. Technical Breakthroughs:

    • The aluminum shell with ribbed texture achieves 30% better thermal efficiency than plastic enclosures.
    • The OTG port enables direct peripheral connectivity without a host computer, reducing system complexity.
    • Linux compatibility simplifies cross-platform development for IoT applications.

  2. Optimal Version Selection:

    • Base Model: Ideal for hobbyists or basic IoT projects requiring standard durability.
    • Advanced Model: Suited for industrial prototyping needing IP54 dust/water resistance.
    • Pro Model: Best for rugged environments (e.g., outdoor sensors) with its IP67 rating and active cooling. Example: The Pro’s enhanced thermal performance ensures stable operation in automotive or outdoor deployments.

Frequently asked questions

  • Which NanoPi model is best for IoT projects with limited space?

  • How do I clean the metallic surface of the NanoPi NEO H3 Metal Shell Kit?

  • Metal vs. Plastic Shells: Why choose the NanoPi NEO H3 Metal Shell Kit?

  • Can the NanoPi NEO H3 support custom projects requiring USB OTG?

  • Is the NanoPi NEO H3 compliant with industrial safety standards?

  • How does the NanoPi NEO H3 compare to Raspberry Pi for embedded systems?

  • Does the NanoPi NEO H3 support Linux kernel customization?

  • How to prevent overheating in the NanoPi NEO H3 Metal Shell Kit?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material & DurabilityIndustrial IoT, rugged environmentsAluminum chassis with ribbed texture (tested to 40°C ambient) ▲▲▲▲▲▲ Superior heat dissipation vs plastic-based boards (Industry Standard)Higher cost than plastic alternatives
Connectivity PortsPortable data hubs, field deploymentsOTG USB 2.0 port + 40-pin GPIO ▲▲ Direct peripheral connectivity without host PC (e.g., USB drives/cameras)Limited to USB 2.0 speeds (Advanced version adds USB 3.0 ▲▲)
Thermal ManagementHigh-load computing tasksRibbed aluminum cooling (ΔT ≤15°C under load) vs. passive plastic enclosures▲▲ Reduces throttling in continuous use (Industry Standard: 25°C+ ΔT)No fan = silent operation but limited in extreme heat (e.g., 50°C ambient)
CertificationsGlobal market complianceCE, RoHS, FCC Class B ▲▲ (Advanced adds MIL-STD-810G ruggedness)▲▲▲ Meets EU/US safety standards + military-grade durability (Advanced)Compliance testing adds 15% to base model cost
OS & SoftwareEmbedded Linux projectsPre-flashed Linux (Debian/Ubuntu) with kernel 5.4 ▲▲ Ready-to-use OS with broad driver supportAdvanced version adds Windows IoT Core support ▲ but requires 2x storage space
Expansion CapabilitiesDIY robotics, sensor networks40-pin GPIO + I2C/SPI headers ▲▲ (Advanced adds PCIe M.2 slot ▲▲▲)▲▲ Direct hardware integration for sensors/actuatorsLimited expansion in Base model (e.g., no PCIe)

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