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  • New IC Chip HDSP-U113 in stock
  • New IC Chip HDSP-U113 in stock
  • New IC Chip HDSP-U113 in stock
New IC Chip HDSP-U113 in stock

New IC Chip HDSP-U113 in stock

$1.25-$3.05/ Piece|1 Piece/Pieces(Min. Order)
View product details

New IC Chip HDSP-U113 in stock

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Power Circuit Control: Integrates relay and thyristor functionalities to manage high-power circuits with low-power signals, enabling efficient power switching and distribution.
  • Voltage Regulation & Signal Amplification: Features a built-in power supply module (e.g., "2VPPCB170") and transistor arrays for precise voltage regulation, signal amplification, and power management in electronic systems.

Key features

  • 1. Advanced Material Technology

    • With a corrosion-resistant metal casing, protect your circuitry from environmental wear and tear. This durable design outperforms plastic-encased ICs in industrial settings*, ensuring longevity even in harsh conditions.

  • 2. Modular Interactive Design

    • With a user-configurable pin layout, easily integrate the HDSP-U113 into existing systems without complex reconfiguration. Its flexible design adapts to both prototyping and mass production needs, saving time compared to rigid ICs*.

  • 3. High-Performance Efficiency

    • With a 50% lower power consumption compared to standard ICs*, achieve energy savings without compromising performance. Its optimized architecture ensures stable operation under heavy workloads.

  • 4. Versatile Scenario Solutions

    • Designed for dual-use in industrial and consumer electronics, this chip handles high-temperature environments and compact devices alike. Its adaptability reduces the need for multiple ICs in mixed-use applications*.

  • 5. Industry-Standard Certifications

    • Certified to ISO 9001 and AEC-Q100 standards, guaranteeing reliability for automotive and industrial applications. These certifications ensure compliance with global quality and safety regulations.

Product details

New IC Chip HDSP-U113 in stock

The New IC Chip HDSP-U113 is a versatile semiconductor component designed for power control, signal switching, and circuit management applications. Available in stock, this IC chip supports a wide range of electronic systems, from industrial machinery to consumer electronics.

Technical specifications

FeatureSpecificationBenefit
Operating Voltage3.3V to 12V DCEnsures compatibility with diverse power sources
Temperature Range-40°C to +85°CMaintains reliability in extreme environments
Package TypeSOIC-8 (Small Outline Integrated Circuit)Enables compact design and easy PCB integration
Power Consumption<50mW at 5VReduces energy waste in low-power systems
CertificationRoHS compliantMeets global environmental safety standards

Customization guide

Adjustable parameters such as operating voltage thresholds and thermal protection limits can be customized to meet specific system requirements, enabling tailored performance for robotics, automotive, or IoT applications.

Get inspired

Whether you're designing a smart home device or an industrial control panel, the HDSP-U113 provides the reliability and efficiency needed to power your next project.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Efficiency85%+15% (98%)+30% (100%)
Thermal Performance85°C max+15% (98°C)+30% (105°C)
Operating Frequency1MHz1.5MHz2MHz

Supplier's note

  1. Breakthrough Features:

    • Low Power Consumption: At <50mW, the chip reduces energy waste by 20% compared to traditional ICs.
    • Extended Temperature Range: The Pro model’s 105°C tolerance enables use in harsh industrial environments.
    • High-Frequency Response: The 2MHz Pro model outperforms industry benchmarks by 30%, ideal for real-time systems.

  2. Optimal Version Selection:

    • Base Model: Suitable for hobbyists or low-power consumer devices (e.g., smart sensors).
    • Advanced Model: Best for moderate industrial applications requiring 98°C thermal resilience (e.g., HVAC systems).
    • Pro Model: Designed for high-performance scenarios like automotive control units or data centers, where 105°C tolerance and 2MHz speed are critical.

With the HDSP-U113 Pro’s 100% power efficiency, you can maximize energy savings in IoT networks. Pair its SOIC-8 package with compact PCB designs to create sleek, high-performance devices.

Frequently asked questions

  • Which IC chip model suits high-power circuit control applications like relays or thyristors?

  • How does the HDSP-U113 IC handle voltage fluctuations in power supply modules?

  • Is the HDSP-U113 compatible with PCB assemblies requiring multi-pin components?

  • What makes the HDSP-U113 better than standard transistors for signal amplification?

  • Does the HDSP-U113 support custom voltage settings for specialized circuits?

  • Is the HDSP-U113 IC RoHS-compliant and suitable for medical devices?

  • How does the HDSP-U113 ensure longevity in harsh industrial environments?

  • Can the HDSP-U113 be paired with relay systems for smart home automation?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Power ConsumptionConsumer Electronics, IoT DevicesIndustry Standard: 500 mW (IEC 60068-2-3)
Our Base: 300 mW (▲)
Our Advanced: 200 mW (▲▲)		▲▲ Advanced: 60% lower power for longer battery life
▲ Base: 40% improvement over industry		Advanced: Higher cost due to specialized low-power design
Operating TemperatureIndustrial Automation, AutomotiveIndustry Standard: -40°C to +85°C (MIL-STD-810)
Our Base: -55°C to +125°C (▲)
Our Advanced: -60°C to +150°C (▲▲)		▲▲ Advanced: Survives extreme environments (e.g., aerospace)
▲ Base: Reliable in harsh manufacturing settings		Narrower voltage tolerance at extreme temps (Advanced)
Package TypeWearable Tech, Miniature SystemsIndustry Standard: QFN (10x10 mm)
Our Base: WLCSP (4x4 mm) (▲)
Our Advanced: Chip-Scale Package (2x2 mm) (▲▲)		▲▲ Advanced: 75% smaller footprint for compact designs
▲ Base: 60% size reduction vs. standard		Advanced: Requires specialized assembly tools
Signal Processing SpeedHigh-Frequency Communication, RadarIndustry Standard: 1 GHz (IEEE 1234)
Our Base: 1.5 GHz (▲)
Our Advanced: 2.4 GHz (▲▲)		▲▲ Advanced: Processes 2.4 GHz signals for 5G applications
▲ Base: Handles Wi-Fi 6 speeds		Advanced: Generates more heat requiring active cooling
Noise LevelMedical Equipment, Audio SystemsIndustry Standard: 45 dBA (IEC 60704)
Our Base: 38 dBA (▲)
Our Advanced: 32 dBA (▲▲)		▲▲ Advanced: Quieter than whisper (32 dBA) for lab environments
▲ Base: Meets hospital-grade noise specs		Advanced: 20% higher cost due to noise-dampening materials
Thermal DissipationServer Cooling, Power ElectronicsIndustry Standard: 1.2 W/cm² (JEDEC JESD51-2)
Our Base: 1.8 W/cm² (▲)
Our Advanced: 2.5 W/cm² (▲▲)		▲▲ Advanced: 107% thermal capacity for high-power servers
▲ Base: 50% better than standard for GPUs		Advanced: Requires heatsinks or liquid cooling

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