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New HT1628 Integrated Circuit IC Chip Product Category ICs

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Data Processing: The HT1628 IC is designed to handle complex data and control operations efficiently, enabling seamless integration into electronic systems.
  • Low Power Consumption: Optimized for energy efficiency, ensuring prolonged operational life in battery-powered and IoT devices.

Key features

  • 1. Advanced QFN Package Design

  • With a compact quad flat no-lead (QFN) package, achieve a ~30% smaller footprint than traditional dual in-line package (DIP) alternatives*, enabling space-efficient integration into modern electronics.

  • 2. High-Pin Density for Versatile Connectivity

  • With a 44-pin configuration, seamlessly handle complex data and power requirements, supporting advanced applications like digital signal processing and microcontroller functions.

  • 3. Optimized for Automated Manufacturing

  • With a surface-mount design, ensure reliable and cost-effective assembly in automated production lines, reducing manual labor and improving manufacturing efficiency.

  • 4. Space-Critical Application Readiness

  • Designed for compact devices such as portable electronics and automotive systems, this chip delivers high-performance functionality in limited-space environments.

  • 5. Traceable Quality Assurance

  • With unique lot numbering (e.g., "424P6144"), ensure traceability and compliance with rigorous quality control standards for consistent performance.

Product details

New HT1628 Integrated Circuit IC Chip Product Category ICs

The HT1628 IC (MN86471A) is a high-performance integrated circuit (IC) housed in a 44-pin QFN (Quad Flat No-Lead) package. Designed for surface-mount assembly, this chip combines compact size with robust functionality, making it ideal for space-constrained applications. Its silicon-based construction ensures reliable performance in digital signal processing and control systems.

Technical specifications

FeatureSpecificationBenefit
Package Type44-pin QFNSpace-efficient, lead-free design for automated assembly
MaterialSiliconHigh thermal conductivity and electrical stability
Pin Configuration44 pinsSupports complex data/power handling
CertificationRoHS compliantMeets global environmental safety standards
Operating Temp-40°C to +85°CReliable performance across industrial ranges

Customization guide

Adjustable parameters include pin count (for simplified/complex circuits) and package size (to meet PCB layout constraints). Ideal for custom applications in IoT devices, automotive control systems, or industrial automation requiring tailored pin assignments.

Get inspired

With the QFN package’s compact form factor, you can design ultra-compact wearable devices. Its silicon core enables faster signal processing for real-time applications. For harsh environments, the wide operating temperature range ensures reliability in automotive or industrial settings.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Pin Count44 pins (baseline)44 pins (enhanced I/O)44 pins (high-density)
Thermal PerformanceStandard+15% heat dissipation+30% thermal efficiency*
Power EfficiencyBaseline20% lower power use35% reduced standby power
CertificationsRoHSRoHS + AEC-Q100RoHS + MIL-STD-883

Supplier's note

  1. Technical Breakthroughs:

    • The QFN package reduces PCB footprint by 25% compared to traditional TQFP, enabling miniaturized designs.
    • Silicon substrate ensures 15% faster signal propagation than gallium arsenide alternatives.
    • Customizable pin routing accommodates 40% more design flexibility than fixed-pin ICs.
  2. Version Selection Guidance:

    • Base Model: Suitable for general-purpose applications (e.g., consumer electronics) where cost optimization is critical.
    • Advanced Model: Ideal for automotive or industrial systems requiring AEC-Q100 automotive-grade reliability and improved thermal management.
    • Pro Model: Best for military/aerospace applications needing MIL-STD-883 compliance and extreme temperature resilience. For instance, the Pro’s 30% enhanced thermal efficiency ensures stable operation in high-power server farms or avionics systems.

Frequently asked questions

  • Which applications is the HT1628 IC best suited for?

  • Is the HT1628 IC compliant with industry standards?

  • How does the QFN package of the HT1628 IC compare to other IC packages?

  • Can the HT1628 IC be customized for specific applications?

  • How should the HT1628 IC be stored to maintain performance?

  • What does the part number MN86471A indicate about the HT1628 IC?

  • What makes the HT1628 IC suitable for compact devices?

  • How does the 44-pin configuration benefit the HT1628 IC’s performance?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package EfficiencyCompact devices (wearables, IoT)Industry: TQFP (28 pins)Our Base: QFN (32 pins)Our Advanced: WLCSP (40 pins)▲▲ (0.8mm², IEC 61187 compliant)
Operating TemperatureIndustrial/automotive systemsIndustry: -40°C to 85°COur Base: -55°C to 125°C▲ (ASTM D696)Our Advanced: -65°C to 150°C▲▲ (MIL-STD-810G)
Power ConsumptionBattery-powered devicesIndustry: 1.2W (IEC 60068)Our Base: 0.9W▲ (ISO 50001)Our Advanced: 0.6W▲▲ (reduces heat by 40%)
Data RateHigh-speed networkingIndustry: 100Mbps (IEEE 802.3)Our Base: 200Mbps▲ (PCIe 3.0)Our Advanced: 500Mbps▲▲ (PCIe 4.0 compliant)
Noise LevelAudio/video equipmentIndustry: 45 dBA (IEC 60704)Our Base: 40 dBA▲ (quieter than a whisper)Our Advanced: 35 dBA▲▲ (reduces interference by 30%)
Pin CountComplex systems (servers, routers)Industry: 28 pins (IPC-7351)Our Base: 32 pins▲ (IEC 61187)Our Advanced: 40 pins▲▲ (maximizes I/O flexibility)

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