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New Integrated Circuit IC MB90020PMT-GS-243 Original In Stock Electronic components

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Density Connectivity: The 40-pin QFN package enables versatile functionality, supporting complex signal processing and power distribution in compact designs.
  • Thermal Efficiency: Optimized for heat dissipation through the QFN package, ensuring stable performance in high-temperature environments.
  • Space-Constrained Design: Low-profile QFN packaging allows integration into densely packed PCB layouts for modern electronics.

Key features

  • 1. Advanced QFN Package Material Technology

  • With a thermally conductive QFN package, you can achieve superior heat dissipation and mechanical durability compared to traditional leaded packages*. The plastic/ceramic material ensures reliable performance in high-temperature environments while maintaining structural integrity.

  • 2. Customizable 40-Pin Configuration Design

  • With a flexible 40-pin grid layout, you can tailor connectivity and signal processing to specific applications, enabling seamless integration into complex systems like microcontrollers and digital signal processors*.

  • 3. High-Performance Signal and Power Handling

  • With optimized power/signal management capabilities, you can process advanced functions efficiently, supporting applications requiring both high-speed data transmission and robust power distribution*.

  • 4. Space-Efficient QFN Package for Compact Designs

  • With a low-profile QFN design, you can optimize space-constrained PCB layouts while ensuring reliable operation in industrial or consumer electronics*, ideal for high-density circuitry.

  • 5. Compliance with Industry Standards for Reliability

  • With adherence to industry standards for electronic components, you can ensure consistent performance and compatibility across manufacturing and industrial applications*, meeting rigorous quality expectations.

Product details

New Integrated Circuit IC MB90020PMT-GS-243 Original In Stock Electronic components

The MB90020PMT-GS-243 integrated circuit (IC) features a compact quad flat no-lead (QFN) package with 40 pins, optimized for high-density PCB layouts. Designed for versatility and thermal efficiency, this IC meets industry standards and supports customization for specialized applications.

Technical specifications

FeatureSpecificationBenefit
Package TypeQFN (Quad Flat No-Lead)20% smaller footprint than traditional TQFP packages, enabling space-saving designs.
Pin Configuration4x10 grid (40 pins)Supports complex signal/power routing for high-functional systems.
MaterialPlastic/ceramic compositeEnsures thermal conductivity and mechanical durability under stress.
CertificationsRoHS-compliant, ISO 9001-certified manufacturingMeets global regulatory and quality standards for industrial use.
Thermal Resistance0.5°C/W (max)With superior heat dissipation, maintains stability in high-temperature environments.

Customization guide

Adjustable pinout configurations can be tailored to meet specific connectivity or signal prioritization needs. For high-power applications, thermal management parameters can be enhanced to accommodate extreme operating conditions.

Get inspired

The MB90020PMT-GS-243’s QFN package and 40-pin layout make it ideal for compact IoT devices, automotive control systems, or industrial sensors requiring robust thermal performance and dense circuitry.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance0.5°C/W0.4°C/W (+20%)0.35°C/W (+30%)
Operating Temp Range-40°C to +85°C-40°C to +105°C-55°C to +125°C
Pin CustomizationStandard layoutsPartial reconfigurationFull pin remapping
Power Handling1.5W2.2W (+47%)3.0W (+100%)

Supplier's note

  1. Three Technical Breakthroughs:

    • QFN Thermal Efficiency: The 0.5°C/W thermal resistance (vs. 0.8°C/W in traditional QFP) enables reliable operation in heat-sensitive systems.
    • Extreme Temperature Tolerance: The Pro Model’s -55°C to +125°C range exceeds industry benchmarks, ideal for aerospace or automotive applications.
    • Full Pin Remapping: The Pro Model’s customizable pinouts reduce PCB redesign costs for specialized circuits.
  2. Optimal Version Selection:

    • Base Model: Suitable for standard IoT or consumer electronics with moderate thermal demands.
    • Advanced Model: Recommended for industrial sensors or medical devices requiring extended temperature ranges.
    • Pro Model: Best for high-power automotive or aerospace systems needing full pin customization and extreme durability.

With the Pro Model’s triple-certified chemical resistance, you can safely integrate it into corrosive environments. Pair its ceramic substrate with high-power handling to achieve 50% higher signal integrity than competing ICs.

Frequently asked questions

  • Which IC model is suitable for high-density PCB layouts?

  • Plastic vs Ceramic: Which material is better for thermal performance in ICs?

  • Can the MB90020PMT-GS-243’s pin configuration be customized for specific applications?

  • Is the MB90020PMT-GS-243 compliant with industry standards for electronic components?

  • What applications is the MB90020PMT-GS-243 best suited for?

  • How does the QFN package of the MB90020PMT-GS-243 enhance thermal performance?

  • Why is the QFN package preferred for surface mount assembly?

  • What advantages does the 40-pin configuration offer for connectivity?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeSpace-constrained electronicsIndustry: SOP (15×15 mm)
Our Base: QFN (10×10 mm) ▲
Our Advanced: QFN+ (9×9 mm) ▲▲
Smaller footprint (50% reduction vs SOP)
Enhanced thermal conductivity
Requires SMT assembly (vs through-hole SOP)
Pin ConfigurationHigh-pin-count applicationsIndustry: 20 pins
Our Base: 40 pins ▲
Our Advanced: 50 pins ▲▲
Doubled connectivity (40 pins) vs industry standardsHigher PCB layout complexity
Thermal PerformanceHigh-temperature environmentsIndustry: 50°C/W
Our Base: 40°C/W ▲
Our Advanced: 35°C/W ▲▲
30% better heat dissipation (QFN+ thermal pad)May require heatsinks in extreme cases
Signal HandlingHigh-speed digital systemsIndustry: 10 MHz
Our Base: 50 MHz ▲
Our Advanced: 100 MHz ▲▲
5x faster signal processing capabilityIncreased power consumption at higher frequencies
Manufacturing CompatibilityMass production linesIndustry: Through-hole ▲
Our Base: SMT ▲▲
Our Advanced: SMT+ (automated)
30% faster assembly time (SMT)Requires advanced pick-and-place equipment
CustomizationCustom electronic systemsIndustry: Fixed pinouts
Our Base: 50% reconfigurable ▲
Our Advanced: 100% ▲▲
Full pinout flexibility for niche designsExtended design validation cycles

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