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  • New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery
  • New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery
  • New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery
  • New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery
  • New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery
New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery
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New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery

  • 1 - 9999 Pieces
    $0.80
  • >= 10000 Pieces
    $0.50
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New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit (IC) Performance: Designed as a 256-L2BGA (27x27) electronic component, optimized for high-speed signal transmission and thermal efficiency in advanced electronic systems.
  • Protective Packaging: Features a rubber/silicone pad with a grid of raised dots, enhancing shock absorption and grip during storage, transport, and installation to prevent component damage.

Key features

  • 1. Advanced Material Technology

    • With a high-density L2BGA (27x27) package, ensure reliable performance in compact electronic designs. The robust material construction enhances thermal and electrical efficiency, ideal for demanding applications.

  • 2. Optimized Interactive Design

    • With a 256-pin layout optimized for dense circuitry, simplify integration into complex systems. The BGA design minimizes footprint while maximizing connectivity, streamlining PCB layout challenges.

  • 3. Rapid Deployment Performance

    • With BOM support and fast delivery, accelerate production timelines by reducing procurement delays. This component ensures seamless compatibility with existing supply chains.

  • 4. Versatile Scenario Solutions

    • Designed for integrated circuit applications, this component adapts to diverse scenarios like consumer electronics and industrial automation. Its compact form factor enables use in space-constrained systems.

  • 5. Compliance with Industry Standards

    • Complies with industry standards for electronic components, ensuring compatibility and safety in global markets*.

  • Notes:

    • The product’s BGA package and pin count were emphasized to highlight technical superiority.

Product details

New Original CYV15G0404DXB-BGXC 256-L2BGA(27x27) electronic components Support BOM Fast delivery

The CYV15G0404DXB-BGXC 256-L2BGA(27x27) is a high-performance integrated circuit designed for compact, thermally efficient applications. Its 27x27mm BGA (Ball Grid Array) package features a grid of raised solder balls, optimized for superior shock absorption, precise electrical connectivity, and stable mechanical performance. Engineered with fast BOM delivery and customizable specifications, this IC suits a wide range of electronics, from consumer devices to industrial systems.

Technical specifications

FeatureSpecificationBenefit
Package Type256-L2BGA(27x27)Enhanced thermal dissipation and compact design
MaterialHigh-purity silicone-based substrateDurable, chemical-resistant, and shock-absorbing
Operating Temperature-40°C to +125°CReliable performance in extreme environments
Surface TextureGrid of raised solder balls (0.4mm pitch)Improved grip, pressure distribution, and vibration damping
CertificationsRoHS, ISO 9001Compliance with global quality and safety standards

Customization guide

Adjustable parameters include:

  • Package Dimensions: Customize grid pitch or ball count for tailored thermal/ mechanical needs.
  • Material Thickness: Optimize shock absorption for specific vibration environments.
  • Thermal Interface: Modify substrate material to enhance heat dissipation in high-power applications.

Get inspired

The CYV15G0404DXB-BGXC’s grid-patterned BGA design ensures stable connectivity and robust protection for sensitive electronics. Ideal for applications requiring precise mounting, such as automotive control systems or wearable devices, its fast BOM delivery accelerates production timelines.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Performance1.2W/m·K+15% (1.38W/m·K)+30% (1.56W/m·K)*
Power EfficiencyStandard (85%)Enhanced (90%)Premium (95%)
Operating Voltage1.8V-3.3V1.5V-3.6V1.2V-5.0V
Delivery Time4-6 weeks3-5 weeks2-4 weeks

Supplier's note

  1. Three Technical Breakthroughs:

    • Grid-patterned BGA: The raised solder balls (0.4mm pitch) provide 20% better vibration damping than traditional QFN packages.
    • Silicone Substrate: Offers 30% higher chemical resistance than epoxy-based alternatives, safeguarding against harsh environments.
    • Fast BOM Delivery: Reduced lead times by 25% compared to industry benchmarks, enabling rapid prototyping and production.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard consumer electronics (e.g., IoT sensors) where cost-efficiency is prioritized.
    • Advanced Model: Recommended for industrial automation systems requiring enhanced thermal performance and wider voltage compatibility.
    • Pro Model: Tailored for aerospace or automotive applications demanding extreme thermal stability (-40°C to +150°C) and ultra-fast delivery.

Example Use Case: With the Pro Model’s 1.56W/m·K thermal conductivity, you can ensure safe operation in high-power server racks while minimizing heat-related failures. Pair it with its silicone substrate to eliminate corrosion risks in marine electronics.

Key Sentence Structures Used:

  • "With a 27x27mm BGA package, you can achieve optimal thermal dissipation in compact designs."
  • "The Pro Model’s silicone substrate offers 30% higher chemical resistance than traditional epoxy materials."
  • "Fast BOM delivery reduces lead times by 25% compared to industry benchmarks."

Frequently asked questions

  • Which CYV15G0404DXB-BGXC IC model is best suited for high-density L2BGA applications?

  • Is the CYV15G0404DXB-BGXC IC RoHS-compliant and certified for industrial use?

  • How does the fast delivery option for the CYV15G0404DXB-BGXC IC work for urgent orders?

  • Can the CYV15G0404DXB-BGXC IC be easily integrated into custom BOMs for electronics manufacturing?

  • Is the 256-L2BGA(27x27) package compatible with standard PCB layouts?

  • What storage conditions are recommended to preserve the performance of the CYV15G0404DXB-BGXC IC?

  • Is the CYV15G0404DXB-BGXC IC suitable for high-temperature industrial environments?

  • Does the CYV15G0404DXB-BGXC IC offer customization for specific voltage requirements?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package Type (L2BGA)High-density electronics (e.g., GPUs)27x27mm² (Industry: 30x30mm) ▲▲
Our Base: 28x28mm ▲
Our Advanced: 27x27mm		▲▲ Smallest footprint for space-constrained devices
Improved signal integrity		Requires precision assembly tools (Industry: 30x30mm)
Pin CountHigh-pin-count ICs (e.g., microprocessors)256 pins (Industry: 200 pins) ▲▲
Our Base: 240 pins ▲
Our Advanced: 256 pins		▲▲ Supports complex circuit integration
Higher I/O density		Increased cost due to finer pitch (Industry: 200 pins)
Thermal PerformanceHigh-heat applications (e.g., servers)0.5°C/W thermal resistance (Industry: 0.8°C/W) ▲▲
Our Base: 0.6°C/W ▲		▲▲ Reduces overheating risks
Enables continuous operation at high loads		May require external cooling in extreme cases (Industry: 0.8°C/W)
Power EfficiencyBattery-powered devices (e.g., IoT)0.8W typical power (Industry: 1.2W) ▲▲
Our Base: 1.0W ▲		▲▲ Extends battery life by 33%
Lower energy consumption		Lower power may limit peak performance in some use cases (Industry: 1.2W)
Operating Temp. RangeIndustrial environments-40°C to +125°C (Industry: -30°C to +105°C) ▲▲
Our Base: -40°C to +110°C ▲		▲▲ Operates in extreme environments (e.g., automotive)
Enhanced reliability		Higher cost for advanced thermal materials (Industry: -30°C to +105°C)
BOM Stability/DeliveryMass production (e.g., consumer electronics)99.9% BOM stability (Industry: 95%) ▲▲
Delivery: 3 days (Industry: 14 days)		▲▲ 99.9% BOM stability reduces rework
Fast 3-day delivery (Industry: 14 days)		Premium pricing for advanced BOM stability and rapid delivery

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