New and original integrated circuit BROADCOM IC package BGA BCM20734UA1KFFB3G BCM20734

Technical specifications

Customization guide

Adjustable parameters include:

• Protocol prioritization (Bluetooth/Wi-Fi bandwidth allocation) to optimize for specific use cases.
• Power management settings to balance performance and energy efficiency.
• Temperature tolerance thresholds for specialized industrial applications.

Get inspired

With its compact BGA form factor and multi-protocol support, this chip is ideal for designing smart wearables, IoT gateways, or industrial sensors. Its low power consumption ensures longevity in battery-operated devices, while its wide temperature range enables deployment in harsh environments.

Choose your model

Supplier's note

1. Three Breakthroughs:

   • Multi-Protocol Integration: Combines Bluetooth and Wi-Fi into a single SoC, reducing design complexity by 40% compared to dual-chip solutions.
   • Extreme Temperature Tolerance: Operates reliably at -40°C, enabling use in industrial IoT and automotive applications.
   • Low Power Architecture: Achieves 50% lower standby power than industry benchmarks, extending battery life in wearables.

2. Optimal Version Selection:

   • Base Model: Ideal for standard consumer devices (e.g., smart speakers) where cost and basic performance are priorities.
   • Advanced Model: Targets IoT hubs or medical devices requiring extended range (e.g., +50% Bluetooth range for hospital asset tracking).
   • Pro Model: Best for industrial IoT or smart city infrastructure, leveraging Thread/Zigbee for mesh networks and ultra-low power for remote sensors.

With the Pro Model’s 600 Mbps Wi-Fi speed, you can stream high-resolution video in smart security systems. Its Thread support also enables self-healing mesh networks for critical infrastructure.