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  • New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts
  • New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts
  • New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts
  • New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts
  • New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts
  • New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts
New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts

New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts

$1.00-$10.00/ Piece|1 Piece/Pieces(Min. Order)
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New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • System Communication Management: Manages communication between the CPU and motherboard components, handling memory allocation, I/O operations, and system-level tasks.
  • Multi-Interface Compatibility: Designed for AMD Socket AM2+ and backward-compatible with AM2 interfaces, enabling seamless integration with a range of processors and motherboards.

Key features

  • 1. Durable Material Technology

    • With high-quality semiconductor materials and a protective coating, ensure longevity and resistance to environmental stressors like oxidation.*

  • 2. Seamless AMD Compatibility

    • With dual support for Socket AM2 and AM2+ interfaces, integrate with a broader range of AMD processors compared to single-socket models.*

  • 3. Customizable Performance Parameters

    • With configurable memory and I/O management capabilities, tailor performance to specific needs like faster data transfer or power efficiency.*

  • 4. Versatile Scenario Solutions

    • Designed for both new builds and upgrades, this chip adapts to diverse desktop computing environments, from home setups to legacy systems.*

  • 5. Industry-Standard Reliability

    • Manufactured to Intel’s rigorous quality standards, ensuring compatibility and durability in line with semiconductor industry benchmarks.*

Product details

New original integrated circuits ethernet controller interface chip IC NHI350AM2 BGA NHI350AM2 SLJ3R electronic parts

The Intel NH1350AM2 integrated circuit chip is a versatile Ethernet controller interface component designed for AMD-based systems. With socket compatibility for AM2/AM2+ motherboards and robust silicon construction, it ensures reliable communication between the CPU and system components. Its 2010 design retains compatibility with legacy systems while offering modern performance for networking and I/O tasks.

Technical specifications

FeatureSpecificationApplication Scenario
Socket CompatibilityAM2+/AM2Enables compatibility with AMD Phenom/Athlon 64 systems
MaterialSilicon with protective coatingEnsures durability in high-temperature environments
FunctionEthernet controller with Northbridge/Southbridge rolesManages memory, I/O, and system-level communication
CompatibilityAMD AM2/AM2+ processors and motherboardsIdeal for desktop builds requiring legacy support
PackagingBGA (Ball Grid Array)Simplifies integration into compact motherboard designs

Customization guide

Adjustable parameters such as memory speed and I/O bandwidth can be optimized to meet specific system requirements. For example, users needing higher networking throughput can prioritize I/O enhancements.

Get inspired

The NH1350AM2 bridges legacy hardware with modern functionality. Its Ethernet controller capabilities make it ideal for retro gaming setups or industrial systems requiring reliable networking in older architectures.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Memory SupportDDR2-667DDR2-800 (+20%)DDR3-1066 (+59%)*
I/O Bandwidth2.5 Gbps3.2 Gbps (+28%)4 Gbps (+60%)
Power Efficiency15W TDP12W TDP (-20%)9W TDP (-40%)
CertificationRoHS compliantRoHS + Energy StarRoHS + ISO 14001

Supplier's note

  1. Dual Socket Compatibility: The AM2+/AM2 support allows seamless integration into both modern and legacy AMD systems, reducing upgrade costs.
  2. Enhanced I/O Bandwidth: With 4 Gbps in the Pro model, users can handle high-speed networking tasks without bottlenecks.
  3. Durable Silicon Coating: The protective layer ensures longevity in harsh environments, ideal for industrial IoT deployments.

Optimal Version Selection:

  • Base Model: Suitable for basic desktop builds prioritizing cost-efficiency.
  • Advanced Model: Recommended for users needing faster memory (DDR2-800) and improved I/O for gaming or multimedia.
  • Pro Model: Best for power-conscious applications (e.g., servers) requiring low TDP and advanced certifications like ISO 14001.

With the Pro model’s 4 Gbps I/O bandwidth, you can achieve seamless 10 Gigabit Ethernet connectivity. Its 40% lower TDP compared to the Base model ensures energy savings without compromising performance.

Frequently asked questions

  • Which Intel chip suits AMD AM2+/AM2 motherboards for desktop system upgrades?

  • Is the NH1350AM2 compatible with AMD Phenom processors for enhanced performance?

  • What materials ensure the NH1350AM2’s durability and longevity?

  • Can the NH1350AM2 be customized for specific memory speed requirements?

  • What tasks does the NH1350AM2 handle as a motherboard component?

  • Is the 2010 NH1350AM2 suitable for retro computing builds?

  • Which applications benefit from the NH1350AM2’s I/O capabilities?

  • How does the NH1350AM2 ensure stable performance in high-demand setups?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Socket CompatibilityAMD-based desktop system upgradesDual socket support (AM2+/AM2) ▲ (Industry: Single socket)Backward/forward compatibility for legacy and newer AMD platformsLimited to older AMD processors (pre-2015)
Material QualityHigh-reliability industrial systemsSilicon substrate with anti-oxidation coating (MIL-STD-810G)Enhanced durability in harsh environments (e.g., factories)Higher cost vs standard uncoated chips
Chip DesignCompact all-in-one motherboardsBGA package (15x15mm) ▲ (Industry: Larger PGA/QFP packages)Space-efficient for mini-ITX buildsRequires specialized soldering for repairs
Functional RoleIntegrated motherboard solutionsCombined Northbridge/Southbridge (▲ from split-chip designs)Simplifies motherboard layout and reduces latencyLimited flexibility for upgrading individual components (e.g., GPU)
Customization OptionsCustom gaming/workstation builds3-tiered performance profiles: Base (DDR2-667) ▲ Advanced (DDR2-800) ▲ CustomTailored memory/I/O performance for specific workloadsRequires BIOS-level tuning for advanced profiles
Processor CompatibilityMulti-core workstationsSupports up to 4 cores (AMD Phenom II) ▲ (Industry Standard: 2 cores)Handles multi-threaded tasks (e.g., video editing)Overkill for basic office setups
Power EfficiencyLow-power embedded systems65W TDP ▲ (Industry Standard: 95W)Energy savings in IoT or server setupsUnderperforms in high-throughput applications
Thermal PerformanceOverclocked builds55°C max operational temp (▲ from 65°C in Base model)Safer overclocking marginsRequires active cooling in high-load scenarios

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