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  • OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer
  • OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer
  • OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer
  • OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer
  • OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer
  • OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer
OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer

OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer

  • 1 - 149 Pieces
    $5
  • 150 - 999 Pieces
    $3.98
  • >= 1000 Pieces
    $0.98

Customization:

Customized logo(Min.Order: 50 pieces)
Customized packaging(Min.Order: 50 pieces)
Graphic customization(Min.Order: 50 pieces)

OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Thermal Efficiency: Aluminum substrate design ensures superior heat dissipation, ideal for high-power applications.
  • Certified Compliance: Meets EPR Germany Packing, RoHS, and EPR France Packing standards, ensuring environmental and safety regulations are adhered to.

Key features

  • 1. Material Technology: Aluminum Substrate for Enhanced Thermal Management

  • With an aluminum core substrate, achieve superior heat dissipation compared to traditional FR-4 boards*, enabling reliable performance in high-temperature applications.

  • 2. Certification Standards: Compliance with European Environmental Regulations

  • With EPR Germany Packing, EPR France Packing, and RoHS certifications, ensure compliance with strict European environmental and safety standards*, distinguishing it from non-certified competitors.

  • 3. Performance Parameters: High Thermal Conductivity for Power-Dense Applications

  • With a thermal conductivity rating of up to 2-5 W/mK, support higher power densities than standard PCBs*, making it ideal for LED lighting and industrial electronics.

  • 4. Scenario Solutions: Versatile for High-Heat Environments

  • Designed for applications like automotive electronics and power supplies, this PCB maintains stability in harsh thermal conditions*, outperforming conventional boards in demanding scenarios.

  • 5. Customization Solutions: Flexible Design for Project-Specific Needs

  • Customizable with surface-mount components and adaptable layouts, it offers tailored solutions compared to pre-configured generic PCBs*, ensuring alignment with unique project requirements.

Product details

OEM PCB Circuit Board Assembly Production Aluminum PCB Manufacturer

Our OEM Aluminum PCB Circuit Board Assembly Production combines robust thermal management with compliance certifications for global markets. Designed for versatility, these boards are ideal for applications requiring heat dissipation, such as LED lighting, automotive systems, and industrial electronics.

Technical specifications

FeatureSpecificationBenefit
MaterialAluminum-based substrate with FR-4 cladEnhanced thermal conductivity and durability
Surface FinishImmersion Gold (ENIG)Solderable, corrosion-resistant surface
CertificationsEPR Germany Packing, RoHS, EPR France PackingMeets EU environmental and packaging standards
Thermal Conductivity1.5–6 W/mK (adjustable)Efficient heat dissipation for high-power components
Max Operating Temp-40°C to +150°CReliable performance in extreme conditions

Customization guide

Adjustable parameters:

  • Thermal conductivity levels (1.5–6 W/mK) to match heat dissipation needs.
  • Component density (up to 300 components/cm²) for complex designs.
  • Layer count (1–8 layers) for multi-functional applications.

Get inspired

With our Aluminum PCBs, you can build energy-efficient LED panels, automotive control systems, or industrial sensors. Their lightweight design and customizable thermal properties make them adaptable to nearly any electronic project.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Conductivity1.5–2.5 W/mK3.0–4.5 W/mK5.0–6.0 W/mK*
Component Density50 components/cm²150 components/cm²300 components/cm²
Layer Support1–4 layers1–6 layers1–8 layers
CertificationsEPR Germany/France, RoHS+UL94 V-0 flame retardant+ISO 13485 (medical-grade)

Supplier's note

  1. Technical Breakthroughs:

    • Enhanced Thermal Conductivity (Pro Model): At 6.0 W/mK, it outperforms standard aluminum PCBs by 30%, enabling safe operation in high-power environments.
    • Multi-Certification Compliance: EPR Germany/France and RoHS certifications ensure seamless entry into EU markets without retesting.
    • Layer Flexibility: The Pro Model’s 8-layer support allows complex circuit designs for IoT and medical devices.
  2. Optimal Version Selection:

    • Base Model: Ideal for low-power projects (e.g., consumer electronics) where cost efficiency is critical.
    • Advanced Model: Best for mid-range applications like LED lighting or automotive sensors, balancing thermal performance and cost.
    • Pro Model: Tailored for high-power industrial systems or medical devices requiring extreme durability and certification compliance. With its 6.0 W/mK thermal conductivity, it safely handles components generating 50% more heat than standard designs.

Example comparative hint: The Pro Model’s thermal conductivity is 20% higher than industry benchmarks for aluminum PCBs.

Frequently asked questions

  • Which Aluminum PCB model suits high-temperature industrial applications?

  • How to clean and maintain an Aluminum PCB’s solder mask?

  • Aluminum PCB vs FR-4: Which is better for thermal management?

  • Can I customize the component layout on OEM Aluminum PCBs?

  • Is this Aluminum PCB RoHS-compliant for EU markets?

  • What certifications ensure the PCB’s safety for medical devices?

  • Can this PCB handle high-power applications like server cooling systems?

  • Does the PCB support surface-mount technology (SMT) components?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material & ComplianceEU Electronics ManufacturingIndustry: RoHS (EU Directive 2011/65/EU) ▲Base: +EPR Germany (Packaging Law) ▲Advanced: +EPR France (Packaging Law) (complies with EU regulations)Ensures regulatory compliance, reduces environmental impactCompliance adds ~5-10% production cost
Thermal ConductivityHigh-Power LED Lighting, Automotive ElectronicsIndustry: 3.0 W/m·K (ISO 10456) ▲Base: 3.2 W/m·K (▲7%) ▲Advanced: 3.5 W/m·K (▲17%) (exceeds automotive thermal standards)Enhanced heat dissipation improves component longevityAdvanced versions require complex thermal management systems
Surface FinishAutomated Soldering ProductionIndustry: Solder mask 20 µm (ISO 17638) ▲Base: 25 µm (▲25%) ▲Advanced: 30 µm (▲50%) (reduces oxidation by 40%)Reduces oxidation, improves soldering accuracyThicker masks limit trace spacing (▲Advanced: -15% trace density)
ThicknessRugged Industrial EquipmentIndustry: 1.6mm (IEC 61249-2-20) ▲Advanced: 1.8mm (▲12%) (meets MIL-STD-883G durability)Increased mechanical durability (resists 10N bending force)Thicker boards may complicate assembly in compact devices
Customization OptionsPrototyping, Specialized ElectronicsIndustry: Standard SMT components ▲Base: +Custom trace routing (IPC-A-610) ▲Advanced: +High-Density Interconnect (HDI) (▲ adds 50% trace density)Flexibility for complex designs (e.g., 5G modules)HDI requires specialized equipment, increasing lead time by 30%
WeightPortable ElectronicsIndustry: 285g/m² (ISO 3801) ▲Advanced: 300g/m² (▲5%) (trade-off for durability)Base maintains lightweight portability (ideal for drones)Advanced versions may add ~150g to compact devices

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