Material Composition | High-power electronics, audio amplifiers | Industry Standard: FR-4 epoxy-glass (2.0 W/m·K thermal conductivity) Our Base: FR-4 + aluminum backing (▲▲▲) Our Advanced: Aluminum-reinforced FR-4 (180 W/m·K▲▲▲▲) | Enhanced heat dissipation (▲▲▲▲ vs Standard) Lightweight durability | Higher cost for Advanced tier (▲▲▲▲) |
Thermal Performance | Industrial equipment, thermal-sensitive devices | Standard: 85°C max operating temp Base: 105°C (▲▲) Advanced: 125°C (▲▲▲) | Supports high-temperature applications (e.g., amplifiers) Reduced thermal expansion (IPC-6012 compliant) | Requires active cooling for Advanced tiers |
Noise Level | Audio systems, medical devices | Standard: 35 dBA (typical PCB) Base: 28 dBA (▲) Advanced: 5.1 dBA (▲▲▲▲) (quieter than a whisper) | Optimal for noise-sensitive environments (e.g., studios) Meets ISO 10302 acoustic standards | Advanced tier adds cost for noise-dampening materials |
Customization Options | IoT devices, prototyping | Standard: Limited layer customization Base: 2-layer design flexibility (IPC-6012) Advanced: 4-layer + full trace customization (▲▲▲) | Scalable for complex circuits (e.g., 5.1-channel amplifiers) Fast prototyping | Advanced requires specialized tooling (▲▲▲ lead time) |
Weight/Thickness | Wearable tech, portable devices | Standard: 1.6 mm (ISO 1181) Base: 1.2 mm (▲) Advanced: 0.8 mm (▲▲▲) (lighter than a business card) | Improved portability Reduces device bulk (ideal for headphones) | Thinner PCBs may compromise durability (▲ reduced layer count) |
Durability/Electrical | Harsh environments, industrial controls | Standard: 50+ chemical exposures (ASTM D543) Base: 100+ (▲▲) Advanced: 200+ (▲▲▲) + 50V insulation (IEC 60664) | Withstands extreme conditions (e.g., chemical plants) High voltage tolerance | Advanced materials increase fragility during assembly (▲▲ handling required) |