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  • OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic
  • OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic
  • OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic
  • OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic
  • OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic
  • OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic
OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic

OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Precision Signal Processing: The OP97F DIP8 integrated circuit delivers robust analog signal amplification and conditioning, ideal for applications requiring low noise and high bandwidth.
  • Versatile Control Capabilities: Designed to interface with a wide range of electronic systems, enabling functions like data processing, sensor signal regulation, and circuit control in both simple and complex setups.

Key features

  • 1. Corrosion-Resistant Gold-Plated Pins (Material Technology)

    • With corrosion-resistant gold-plated pins, you can ensure reliable performance in high-stress environments, outperforming non-gold-plated alternatives*

  • 2. User-Friendly DIP8 Package Design (Interactive Design)

    • With a DIP8 package design, you can easily integrate into circuits for rapid prototyping, unlike surface-mount packages that require specialized tools*

  • 3. Precision-Engineered Circuitry (Performance Parameters)

    • With precision-engineered circuitry, you can achieve 20% higher signal accuracy compared to generic ICs, ensuring optimal performance in critical applications*

  • 4. Multi-Application Adaptability (Scenario Solutions)

    • With multi-application adaptability, you can deploy in both consumer electronics and industrial equipment, surpassing single-purpose chips in versatility*

  • 5. Compliance with Industry Standards (Certification Standards)

    • With compliance to industry standards (e.g., RoHS), you can ensure reliable operation in certified applications, meeting global regulatory requirements*

Product details

OP97F DIP8 new OriginalBOM Inventory Supporting Service OP97F Chip ic

The OP97F DIP8 is a high-performance integrated circuit (IC) housed in a DIP8 package, featuring 8 gold-plated pins for reliable connectivity. Designed for versatility, it supports a wide range of applications from consumer electronics to industrial control systems. With compliance to industry standards, this IC ensures durability and compatibility in demanding environments.

Technical specifications

FeatureSpecificationBenefit
MaterialSilicon core with metal leadsEnsures high conductivity and thermal stability
Package TypeDIP8 (Dual In-line Package)Easy integration into PCBs and prototyping
Pin Configuration8 gold-plated pinsCorrosion resistance and long-term reliability
Standard ComplianceMeets industry-grade certificationsEnsures safety and interoperability
Operating Voltage5V ±10%Stable performance across variable power sources

Customization guide

Adjustable parameters include pin spacing (to fit custom PCB layouts) and material coatings (e.g., enhanced gold plating for harsh environments). For specialized applications, the internal circuit design can be modified to prioritize specific functions like high-frequency processing or low-power consumption.

Get inspired

The OP97F DIP8 is ideal for prototyping electronic circuits, industrial automation systems, or consumer devices requiring precise signal processing. With its robust DIP package, engineers can easily integrate this IC into existing designs while ensuring long-term reliability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp.-20°C to +70°C-40°C to +85°C-55°C to +125°C*
Power Consumption150mW120mW (20% lower)90mW (40% lower)
Signal Frequency1MHz5MHz (+300%)10MHz (+900%)

Supplier's note

  1. Technical Breakthroughs:

    • Gold-Plated Pins: Reduces contact resistance by 30% compared to standard tin-plated pins, ensuring stable connections in corrosive environments.
    • DIP8 Package: Enables 20% faster prototyping than surface-mount alternatives due to manual soldering compatibility.
    • Low-Temperature Drift: Maintains ±1% accuracy at -40°C, outperforming industry benchmarks by 2x in extreme cold.

  2. Version Selection Guide:

    • Base Model: Best for hobbyists or low-power applications (e.g., IoT sensors) where cost efficiency is prioritized.
    • Advanced Model: Ideal for industrial automation systems requiring reliable operation in harsh temperatures (-40°C to +85°C).
    • Pro Model: Suited for high-performance computing or aerospace applications demanding 10MHz signal processing and extreme thermal resilience.

With the Pro Model’s 10MHz signal frequency, you can process data 9x faster than baseline systems, enabling real-time control in robotics. The Advanced Model’s low power consumption (120mW) makes it 20% more energy-efficient than competitors, reducing operational costs for 24/7 industrial setups.

Frequently asked questions

  • Which integrated circuit model is best suited for small electronics projects requiring easy prototyping?

  • How do I clean and maintain the pins of the OP97F DIP8 to prevent corrosion?

  • Why choose the DIP8 package over SMD for prototyping electronic circuits?

  • Can the OP97F DIP8 be customized for specific interface or functional requirements?

  • Is the OP97F DIP8 compliant with industry standards for electronic components?

  • What operating temperature range does the OP97F DIP8 support?

  • Can the OP97F DIP8 be used in both commercial and industrial applications?

  • Which features make the OP97F DIP8 ideal for high-speed data processing tasks?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Operational AmplifiersAudio Equipment, InstrumentationBandwidth: 2 MHz (Advanced ▲) vs 1 MHz (Base) vs 0.5 MHz (Industry Standard)
(Enables real-time signal processing)		High bandwidth for fast signal processing; Low input offset voltage (0.5 mV)Advanced version requires higher power supply voltage (±15V)
MicrocontrollersIoT Devices, Embedded SystemsClock Speed: 60 MHz (Advanced ▲) vs 40 MHz (Base) vs 32 MHz (Industry Standard)
(Supports complex algorithms)		Enhanced computational power for AI/ML tasks; 512 KB Flash (Advanced)Higher cost for Advanced tier; Steeper learning curve for FPGA integration
Digital Signal Processors (DSP)Audio/Video Streaming, Radar SystemsSignal-to-Noise Ratio (SNR): 95 dB (Advanced ▲) vs 85 dB (Base) vs 75 dB (Industry Standard)
(Reduces background noise)		Superior noise suppression; Parallel processing capabilityLimited GPIO flexibility; Power consumption increases with Advanced tier
Field-Programmable Gate Arrays (FPGA)Prototyping, High-Speed ComputingLogic Cells: 100K (Advanced ▲) vs 50K (Base) vs 20K (Industry Standard)
(Supports custom hardware configurations)		Reconfigurable architecture; High throughput for parallel tasksComplex design tools required; Higher thermal dissipation challenges
Voltage RegulatorsPower Supply Units, Automotive SystemsEfficiency: 95% (Advanced ▲) vs 90% (Base) vs 85% (Industry Standard)
(Minimizes energy loss)		Ultra-low quiescent current (1 μA); Wide input voltage range (4.5–32 V)Advanced versions require heatsinks for high-power applications
ComparatorsSensor Interfaces, Alarm SystemsPropagation Delay: 0.5 μs (Advanced ▲) vs 1 μs (Base) vs 2 μs (Industry Standard)
(Ensures rapid response times)		Rail-to-rail input/output; Low power consumption (10 μA)Limited hysteresis adjustment in Base tier; Sensitive to EMI in noisy environments

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