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  • One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer
  • One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer
  • One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer
  • One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer
  • One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer
  • One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer
One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer

One Stop OEM Custom Polyimide FPC Rigid Flex PCB FR4 PI Stiffener PCB Manufacturer

  • 10 - 99 Pieces
    $12
  • 100 - 999 Pieces
    $3.80
  • 1000 - 99999 Pieces
    $2.60
  • >= 100000 Pieces
    $1.12

Customization:

Custom LOGO(Min.Order: 100 pieces)
Customized logo(Min.Order: 100 pieces)
Customized packaging(Min.Order: 100 pieces)
Graphic customization(Min.Order: 100 pieces)

One Stop OEM Custom Polyimide FPC Rigid Flex PCB FR4 PI Stiffener PCB Manufacturer

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Flexible Design & Durability: Constructed with polyimide material, enabling bendable and compact configurations ideal for dynamic devices requiring flexibility (e.g., wearable tech, automotive electronics) or space-constrained environments.
  • High-Temperature Resistance: FR4 PI stiffener integration ensures stability in high-heat applications like power electronics, industrial control systems, and high-performance computing.

Key features

  • 1. Material Technology

  • With polyimide material and FR4 PI stiffener, achieve high-temperature resistance and flexibility, outperforming traditional rigid PCBs*.

  • 2. Modular Design

  • With a modular layout featuring parallel tracks and customizable slots, adapt to diverse circuit requirements while reducing weight and enhancing scalability*.

  • 3. Performance Parameters

  • With enhanced thermal dissipation slots and high-current handling capabilities, sustain performance in high-power environments like industrial systems or data centers*.

  • 4. Scenario Solutions

  • Designed for demanding applications such as power electronics and high-performance computing, ensuring reliability in environments requiring continuous operation*.

  • 5. Certification Standards

  • Complies with EPR packaging standards in France and Germany, ensuring eco-friendly compliance and reduced environmental impact*.

Product details

One Stop OEM Custom Polyimide FPC Rigid Flex PCB  FR4 PI Stiffener PCB Manufacturer

The One Stop OEM Custom Polyimide FPC Rigid Flex PCB combines polyimide flexibility with FR4 PI stiffener durability, designed for high-performance applications requiring thermal resilience and mechanical strength. Certified for EPR compliance in France and Germany, it supports OEM customization for diverse electronics needs.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialPolyimide substrate with FR4 PI stiffenerHigh-temperature environments (e.g., automotive, aerospace)
Surface FinishingENIG (Electroless Nickel Immersion Gold)Ensures solderability and corrosion resistance for SMT components
CertificationsEPR_France_Packing, EPR_Germany_PackingCompliance for European environmental regulations
Thermal ManagementModular slots for enhanced heat dissipationPower electronics, industrial control systems
Mechanical StrengthReinforced parallel tracks and slotsPortable devices, space-constrained applications
Electrical PerformanceHigh-current/voltage handlingData centers, high-performance computing

Customization guide

Adjustable parameters:

  • Track spacing/slot dimensions to optimize thermal dissipation or mechanical stability for specific environments.
  • Material thickness to balance flexibility and rigidity for unique application requirements.

Get inspired

With its rigid-flex design and polyimide-FR4 hybrid structure, this PCB enables seamless integration of flexible and rigid sections. Ideal for wearable tech, medical devices, or robotics where compactness and durability are critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
FlexibilityModerate bend radius+15% flexibility+30% flexibility*
Thermal DissipationStandard slotsEnhanced slot designAdvanced airflow channels
Current Capacity3A4.5A (+50%)6A (+100%)

Supplier's note

  1. Technical Breakthroughs:

    • Polyimide substrate: Withstands temperatures up to 400°C, outperforming standard FR4.
    • Modular design: Slots reduce weight by 20% while maintaining structural integrity.
    • ENIG finishing: Reduces solder joint failures by 30% in humid environments.
  2. Optimal Version Selection:

    • Base Model: Suitable for general electronics (e.g., consumer devices) requiring basic thermal and mechanical resilience.
    • Advanced Model: Ideal for industrial IoT or automotive systems needing 15% higher flexibility and 50% increased current handling.
    • Pro Model: Engineered for high-stress applications like aerospace or data centers, where tripled current capacity and 30% enhanced flexibility ensure reliability under extreme conditions.

Example benefit: "With the Pro Model’s 6A current capacity, you can power high-density server racks while maintaining thermal stability—critical for 24/7 data center operations."

Frequently asked questions

  • Which One Stop OEM Polyimide FPC model suits high-temperature applications?

  • Polyimide vs FR4: Which material is better for flexible PCBs in industrial devices?

  • Can I customize the PI stiffener design for medical device applications?

  • Is the FR4 PI Stiffener PCB EPR-certified for European markets?

  • How does ENIG surface finishing improve flexible PCB reliability in automotive environments?

  • What applications benefit most from One Stop's Polyimide FPC's flexibility and thermal resistance?

  • Is the PCB design modular for scalable industrial control systems?

  • Does the rigid flex PCB include thermal management features for high-power electronics?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionHigh-temperature electronics, aerospacePolyimide substrate (Tg ≥ 400°C, ASTM E648) vs FR-4 (Tg ~130–180°C)▲▲ Superior thermal stability for extreme environments (e.g., automotive)Higher cost vs FR-4 (polyimide is 30–50% pricier)
Flexibility & DurabilityWearables, medical devicesBend Radius: 0.5mm (ISO 14967) vs rigid PCBs (no flex)▲▲ Enables compact, bendable designs (e.g., foldable smartphones)Limited mechanical lifespan (5,000 bends vs 10,000 for advanced variants)
Thermal PerformancePower electronics, LED lightingThermal Conductivity: 0.2–0.5 W/m·K (polyimide) vs 0.3 W/m·K (FR-4)▲▲ Enhanced heat dissipation via vertical slots (reduces hotspots by 40%)Requires additional cooling in ultra-high-power setups
Surface FinishingSolderable components, IoT devicesENIG (3μm Ni/0.05μm Au, IPC-4552) vs HASL (lead-containing)▲ Lead-free compliance (RoHS) + 2x better corrosion resistanceHigher process complexity (adds 15% to manufacturing time)
Environmental ComplianceEU-regulated marketsEPR France/Germany Packing certifications vs generic compliance▲▲ Direct access to EU markets (no third-party EPR mediation required)Certification costs add ~5% to base pricing
Customization & ScalabilityIndustrial automation, roboticsModular design (ISO 9001-certified scalability) vs fixed layouts▲▲ Rapid prototyping + 50% faster time-to-market for custom ordersLimited stock availability (requires 2-week lead time for standard parts)

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