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The Optical Alignment BGA Chips Reballing Machine is designed for precision and efficiency, ideal for those in the electronics repair and manufacturing industry. With its advanced optical alignment system, it ensures accurate reballing of BGA chips, enhancing the reliability of your electronic assemblies.
| Feature | Specification | Benefit |
|---|---|---|
| Alignment System | Optical | Ensures precision in chip placement |
| Temperature Control | Adjustable 50-300°C | Suitable for various solder types |
| Size Compatibility | Up to 50mm x 50mm | Versatile for different chip sizes |
Adjustable temperature and alignment settings to meet specific reballing needs, catering to different chip sizes and solder types.
With the Optical Alignment BGA Chips Reballing Machine, achieve unparalleled precision in your electronic repair projects. Its versatility and accuracy make it an indispensable tool for professionals seeking reliability and efficiency.
| Parameter | Base Model | Advanced Model | Pro Model |
|---|---|---|---|
| Alignment Accuracy | Standard | [+15%] | [+30%]* |
| Temperature Range | 50-250°C | 50-275°C | 50-300°C |
| Chip Size Support | Up to 40mm | Up to 45mm | Up to 50mm |
Recent advancements in optical alignment technology have significantly enhanced the reballing accuracy of BGA chips, ensuring minimal error and reducing failure rates. The Pro Model, with its industry-leading alignment accuracy, is ideal for high-precision tasks where reliability is paramount. When coupled with its broad temperature range, it offers unmatched versatility for diverse applications. The Pro Model's superior chip size support makes it the optimal choice for users handling a variety of chip dimensions. With these features, you can ensure high-quality outcomes in every project.
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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.
