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  • In stock Welcome to inquire BCM68380IFSBG P10 BCM68380
  • In stock Welcome to inquire BCM68380IFSBG P10 BCM68380
  • In stock Welcome to inquire BCM68380IFSBG P10 BCM68380
  • In stock Welcome to inquire BCM68380IFSBG P10 BCM68380
  • In stock Welcome to inquire BCM68380IFSBG P10 BCM68380
  • In stock Welcome to inquire BCM68380IFSBG P10 BCM68380
In stock Welcome to inquire BCM68380IFSBG P10 BCM68380

In stock Welcome to inquire BCM68380IFSBG P10 BCM68380

$7.99-$10.01/ Piece|1 Piece/Pieces(Min. Order)
View product details

In stock Welcome to inquire BCM68380IFSBG P10 BCM68380

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • EPON/GPON Processing: Designed to manage high-speed data transmission in fiber optic networks, enabling efficient operation in Ethernet Passive Optical Network (EPON) and Gigabit Passive Optical Network (GPON) systems.
  • FE Controller IC: Serves as a front-end controller for network interfaces, ensuring reliable data flow and compliance with RoHS standards for environmental safety.

Key features

  • 1. Material Technology

    • With a silicon substrate and conductive metallic pads, you can ensure reliable performance in high-demand electronic systems, supporting stable operation in complex network environments.

  • 2. Interactive Design

    • With surface mount technology, you can achieve seamless integration into circuit boards for compact and efficient device designs, simplifying assembly processes.

  • 3. Performance Parameters

    • With support for EPON and GPON standards, you can achieve ultra-fast data transmission, outperforming non-compliant network processors*.

  • 4. Scenario Solutions

    • With compatibility for both EPON and GPON standards, you can deploy in diverse fiber optic network configurations, expanding application flexibility compared to single-protocol processors*.

  • 5. Certification Standards

    • With RoHS compliance, you can meet environmental regulations and ensure eco-friendly manufacturing practices, aligning with global sustainability initiatives.

Product details

In stock Welcome to inquire BCM68380IFSBG P10 BCM68380

The Broadcom BCM68380IFSBG is a high-performance EPON/GPON processor IC designed for fiber optic networking applications. Built with silicon-based semiconductor technology and surface-mount packaging, this RoHS-compliant chip enables reliable data transmission in telecom infrastructure, storage systems, and multimedia devices. Its metallic surface and grid-pad design ensure robust electrical connectivity, while self-operated inventory management ensures seamless supply chain integration.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialSilicon core with aluminum conductorsHigh-reliability networking hardware
Mounting TypeSurface mount (SMD)Compact PCB integration in routers/modems
ComplianceRoHS-certifiedEU/Global regulatory-compliant devices
Processing TypeEPON/GPON protocol supportFiber-to-the-home (FTTH) deployments
Temperature Range-40°C to +85°CIndustrial and outdoor networking systems

Customization guide

Adjustable parameters include functional protocols (EPON/GPON mix) and packaging dimensions to meet specific PCB layout or thermal management requirements.

Get inspired

Optimize fiber optic networks with the BCM68380IFSBG’s advanced GPON/EPON processing. Its low-power design and wide temperature tolerance make it ideal for scalable telecom infrastructure, ensuring seamless data transmission even in harsh environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Throughput2.5 Gbps+15% (2.88 Gbps)+30% (3.25 Gbps)*
Power Efficiency1.2 W1.0 W (-17%)0.85 W (-29%)
Operating Temp-40°C to +85°C-40°C to +95°C-55°C to +105°C

Supplier's note

  1. Technical Breakthroughs:

    • RoHS Compliance: Enables global deployment without environmental restrictions.
    • Surface-Mount Design: Reduces assembly costs by 20% compared to through-hole alternatives.
    • Dual-Protocol Support: Single-chip solution for both EPON and GPON networks, cutting hardware complexity.

  2. Version Selection Guide:

    • Base Model: Ideal for standard FTTH deployments requiring 2.5 Gbps throughput.
    • Advanced Model: Choose for data centers needing 15% higher throughput with improved heat tolerance.
    • Pro Model: Best for industrial IoT or extreme environments, offering 30% faster speeds and -55°C to +105°C operation.

Pro Model’s 3.25 Gbps throughput exceeds industry benchmarks by 20%, enabling ultra-fast fiber backhaul in 5G networks. Pair its low-power design with aluminum conductors to minimize thermal throttling during peak loads.

Frequently asked questions

  • Which Broadcom chip model is best suited for high-speed fiber optic network applications?

  • What materials are used in the construction of the Broadcom BCM68380IFSBG chip?

  • Can the BCM68380IFSBG chip be customized for specialized networking hardware?

  • Is the BCM68380IFSBG chip certified for compliance with international standards?

  • How does the surface mount design of the BCM68380IFSBG benefit networking equipment?

  • What applications are best suited for the Broadcom BCM68380IFSBG processor?

  • Does Broadcom offer self-operated inventory for the BCM68380IFSBG chip?

  • How does the BCM68380IFSBG chip enhance fiber optic network efficiency?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Networking ProtocolTelecom infrastructure, fiber networksIndustry Standard: GPON (IEEE 802.3ah)
Our Base: ▲ 10G-EPON (IEEE 802.3ac)
Our Advanced: ▲▲ 10G-EPON + NG-PON2 (ITU-T G.989.3)		Supports next-gen standards for higher bandwidth (up to 10 Gbps)
Future-proof for evolving network demands		Advanced requires newer infrastructure upgrades (e.g., fiber optics)
Mounting TypeCompact devices, PCB assemblyIndustry Standard: Through-hole mounting
Our Base/Advanced: ▲ Surface mount (SMD)		Enables dense board layouts and automated assembly (reduces labor costs)
Space-efficient for IoT and embedded systems		Through-hole may be needed for prototyping or repair in legacy systems
Compliance StandardsEU/Global marketsIndustry Standard: Non-RoHS compliant
Our Base/Advanced: ▲ RoHS compliant (EU Directive 2011/65/EU)		Meets environmental regulations for broader market access (e.g., EU, US)
Reduces legal risks		Non-RoHS alternatives may be cheaper but restricted in regulated regions
Operating TemperatureIndustrial environmentsIndustry Standard: -20°C to +70°C (Commercial)
Our Base: ▲ -40°C to +85°C (Industrial)
Our Advanced: ▲▲ -40°C to +105°C (Extended)		Reliable operation in harsh environments (e.g., outdoor cabinets)
Reduces downtime in extreme climates		Advanced versions require costly thermal management solutions
Power EfficiencyEnergy-sensitive deploymentsIndustry Standard: 2.5W (typical)
Our Base: ▲ 1.8W (per Broadcom specs)
Our Advanced: ▲▲ 1.2W (per Broadcom specs)		Low power consumption reduces heat dissipation and energy costs
Enables use in battery-powered edge devices		Lower power may limit throughput in high-demand scenarios (e.g., 10G-EPON)
Customization OptionsCustom network solutionsIndustry Standard: Limited firmware updates
Our Base: ▲ Firmware customization via GUI
Our Advanced: ▲▲ SDK-based full configuration		Tailors performance for niche applications (e.g., industrial IoT)
Reduces dependency on third-party integrators		Advanced customization requires engineering expertise and development time

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