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Original Integrated Circuit Computing Chip Cpu Ic G86-740-A2 INTEL

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Computing: The Original Integrated Circuit Computing Chip (G86-740-A2) is designed to handle complex computational tasks, including scientific simulations, data analysis, and machine learning, leveraging its optimized CPU architecture.
  • Multi-Component Connectivity: Equipped with contact pins and a grid of solderable contacts, the chip seamlessly integrates with motherboards and circuit boards for versatile hardware compatibility.

Key features

  • 1. Advanced Material Technology

  • With a high-quality silicon semiconductor core and copper-aluminum heat dissipation layer, achieve superior thermal management and longevity compared to aluminum alloy-based chips*.

  • 2. Customizable Architecture Design

  • With customizable architecture, tailor clock speeds and cache configurations to optimize performance for specific applications like servers, gaming PCs, or embedded systems*.

  • 3. Optimized Performance Parameters

  • With an optimized multi-core design, process complex workloads up to 30% faster than standard CPUs while maintaining energy efficiency*.

  • 4. Versatile Scenario Solutions

  • With robust computational capabilities, seamlessly handle high-performance tasks such as AI training and data analysis while ensuring low power consumption for portable devices.

  • 5. Compliance with Certification Standards

  • With CE certification, ensure compliance with EU safety and electromagnetic compatibility standards, guaranteeing reliable operation in certified environments.

Product details

Original Integrated Circuit Computing Chip Cpu Ic G86-740-A2 INTEL

The Original Integrated Circuit Computing Chip CPU IC G86-740-A2 is a high-performance microprocessor designed for advanced computing applications. Built with premium semiconductor materials and optimized thermal management, it balances power efficiency and computational capability. CE-certified for global compliance, this chip is ideal for computers, servers, and energy-sensitive devices like laptops.

Technical specifications

FeatureSpecificationBenefit
Semiconductor MaterialSilicon with copper/aluminum CPU surfaceEnhanced conductivity and heat dissipation
Contact Pins1,200+ evenly spaced metallic pinsSecure connectivity to motherboards
Passive ComponentsResistors/capacitors on both sidesRegulates electrical signals and heat
CertificationCE-compliantEnsures safety and reliability worldwide
ApplicationComputers, servers, portable devicesVersatile for diverse computing needs

Customization guide

Adjustable parameters include clock speed (up to 3.25 GHz) and cache size (up to 16 MB) to meet specialized requirements. For instance, gaming systems can prioritize higher clock speeds, while servers benefit from expanded cache.

Get inspired

With its silicon semiconductor core and customizable performance parameters, this chip unlocks seamless execution of complex tasks—from AI-driven simulations to energy-efficient mobile computing.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Clock Speed2.5 GHz+15% (2.875 GHz)+30% (3.25 GHz)*
Cache Size8 MB12 MB16 MB
Thermal ResistanceStandardEnhancedTriple industry benchmark
Power Efficiency65W TDP55W TDP45W TDP

Supplier's note

  1. Technical Breakthroughs:

    • Triple Thermal Resistance (Pro Model): Enables safe operation in extreme environments, such as data centers.
    • Low TDP (Pro Model): Reduces energy consumption by 30% compared to traditional chips, ideal for portable devices.
    • Customizable Cache/Clock Speed: Tailors performance to specific workloads, from gaming to cloud computing.
  2. Optimal Version Selection:

    • Pro Model: Engineers handling high-heat scenarios (e.g., supercomputing) benefit from its triple thermal resistance and low TDP.
    • Advanced Model: Gamers and professionals need the 12 MB cache and 2.875 GHz clock speed for multitasking.
    • Base Model: General users and budget systems gain reliable performance at an accessible price.

*Pro Model’s clock speed is 30% faster than industry-standard base models.

Frequently asked questions

  • Which Intel G86-740-A2 model suits high-performance computing tasks like data analysis?

  • How to ensure proper installation of the Intel G86-740-A2 chip on a motherboard?

  • Why is silicon chosen over other materials for the Intel G86-740-A2’s CPU?

  • Can the Intel G86-740-A2 be customized for specific clock speeds or cache sizes?

  • Is the Intel G86-740-A2 certified for commercial use?

  • How does the Intel G86-740-A2 manage heat efficiently in compact devices?

  • Is the Intel G86-740-A2 energy-efficient for battery-powered devices?

  • What makes the Intel G86-740-A2 compatible with diverse motherboards?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing PowerHigh-Performance ComputingIndustry Standard: 100 GFLOPS (FP32)
Our Base: 120 GFLOPS (▲20%)
Our Advanced: 150 GFLOPS (▲50%)
Enables faster simulations/data analysis (Advanced: 150 GFLOPS ≈ 3x faster than basic GPUs).Higher power draw (Advanced: 40W vs Industry Standard 30W).
Thermal Design PowerLaptops/TabletsIndustry Standard: 45W
Our Base: 35W (▲10W reduction)
Our Advanced: 30W (▲5W further reduction)
Better energy efficiency (Advanced: 33% cooler than competitors).May throttle under extreme loads (Advanced: 30W limit).
Memory SupportGaming/MultitaskingIndustry Standard: DDR4-2666
Our Base: DDR4-3200 (▲21%)
Our Advanced: DDR4-3600 (▲35%)
Faster data access (Advanced: 3600 MT/s ≈ 10% faster than AMD Ryzen 5 5600H).Requires premium RAM modules (DDR4-3600: ~$50 more).
Manufacturing ProcessCompact DevicesIndustry Standard: 14nm
Our Base: 10nm (▲40% smaller transistors)
Our Advanced: 7nm (▲57% smaller)
Smaller form factor (Advanced: 7nm ≈ iPhone A14 chip density).Higher manufacturing costs (Advanced: 25% costlier than Base).
Customization OptionsOverclocking/Embedded SystemsIndustry Standard: Limited clock adjustments
Our Base: Voltage + clock tuning
Our Advanced: Full BIOS unlock (▲Unlocked PCIe lanes)
Tailored performance (Advanced: Overclock to 5.0GHz vs Base 4.5GHz).Requires technical expertise (Advanced: BIOS flashing risks).
Compliance CertificationsGlobal MarketsIndustry Standard: CE/FCC
Our Base: CE/RoHS
Our Advanced: CE/RoHS/Energy Star (▲Eco-certified)
Wider market access (Advanced: EU/US/Asia compliance).Longer certification timelines (Advanced: +2 months).

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