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Original Integrated Circuit Computing Chip Cpu Ic C7-M 1600/400 INTEL

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Central Processing: This Original Integrated Circuit Computing Chip CPU IC is designed to execute instructions and perform computations efficiently, acting as the core processing unit in computing systems.
  • Signal Regulation: Equipped with passive components, it regulates electrical signals to maintain stability and performance.

Key features

  • 1. Advanced Material Technology

  • With BGA technology, achieve a more compact and efficient connection, ideal for space-constrained high-performance computing environments.

  • 2. Interactive Design

  • With customizable passive components, tailor the chip's performance for specific applications, enhancing functionality for diverse computing needs.

  • 3. Enhanced Performance Parameters

  • With a robust CPU core and reliable contact pins, ensure high-speed computing and efficient heat dissipation, making it suitable for demanding tasks.

  • 4. Versatile Scenario Solutions

  • With its compact design, this chip is perfectly suited for mobile devices, balancing performance with weight and space constraints for optimal mobile use.

  • 5. Certified Standards

  • With CE certification, trust in the chip's compliance with essential safety and environmental standards, ensuring reliability in various applications.

Product details

Original Integrated Circuit Computing Chip Cpu Ic C7-M 1600/400 INTEL

The Original Integrated Circuit Computing Chip CPU IC C7-M 1600/400 INTEL is a high-performance component designed for diverse computing applications. Utilizing advanced BGA technology, it ensures a compact and efficient connection to motherboards, making it suitable for integrated circuits in computers. Certified with CE standards, this chip exemplifies reliability and quality.

Technical specifications

FeatureSpecificationBenefit
CPU CoreSquare-shaped, centralEfficient execution of instructions
Contact PinsEvenly spacedReliable connections to motherboard
BGA TechnologyBall Grid ArrayCompact, robust connectivity
Passive ComponentsResistors, capacitorsElectrical stability, prevents overheating

Customization guide

With customizable passive components, you can optimize the chip's performance for high-speed computing or power management needs.

Get inspired

Imagine transforming your computing setup with a chip that offers both high performance and a compact design, suitable for everything from mobile devices to high-performance computing systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
CPU Speed1600 MHz+15% increase+30% increase*
ConnectivityStandard BGAEnhanced BGAPremium BGA
Electrical StabilityStandardImprovedSuperior

Supplier's note

The Pro version's BGA technology – double the density of industry standards – ensures superior connectivity and heat management, ideal for high-performance computing. When paired with enhanced passive components, this chip delivers unmatched reliability and efficiency.

Choosing the right model depends on your application scenario: the Base Model suits general computing, the Advanced Model fits power users, while the Pro Model is perfect for high-demand environments requiring exceptional performance and stability.

Frequently asked questions

  • Which computer chip model is best suited for high-performance computing tasks?

  • How should I maintain the C7-M 1600/400 INTEL CPU IC for optimal performance?

  • What are the advantages of BGA technology in the C7-M 1600/400 INTEL integrated circuit?

  • Can the C7-M 1600/400 INTEL CPU IC be customized for specific applications?

  • Is the C7-M 1600/400 INTEL CPU IC CE certified for safety and performance standards?

  • How does the passive component design enhance the performance of the C7-M 1600/400 INTEL chip?

  • What makes the C7-M 1600/400 INTEL CPU IC suitable for mobile devices?

  • How does the C7-M 1600/400 INTEL integrated circuit contribute to efficient computing?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
High-Performance ComputingData centers, supercomputingBGA technology (compact connections)Efficient heat dissipationRequires precise installation
Mobile DevicesSmartphones, tabletsCompact design (space-saving)Lightweight, robust connectionsLimited upgrade options
Consumer ElectronicsLaptops, desktopsCPU Core (fast processing)High computational powerGenerates significant heat
Industrial AutomationRobotics, control systemsPassive components (signal stability)Reliable operation under stressHigh initial cost
Networking EquipmentRouters, switchesCustomizable design (performance tuning)Optimized for specific tasksComplexity in customization
Embedded SystemsIoT devices, smart appliancesIntegrated circuit (application flexibility)Versatile in various applicationsLimited by processing capacity

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