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  • Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2
  • Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2
  • Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2
  • Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2
  • Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2
  • Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2
Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2

Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2

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Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Computing: Equipped with a centralized CPU core designed to execute complex instructions and handle data-intensive tasks, enabling seamless processing for applications like real-time calculations and software execution.
  • Efficient Thermal Management: Features a dedicated thermal pasting area on the backside and strategically placed passive components to ensure optimal heat dissipation, maintaining stable performance under heavy workloads.

Key features

  • 1. Advanced Material Technology

    • With a high-quality silicon semiconductor material, ensure reliable performance and durability under intensive workloads. The chip meets RoHS certification, guaranteeing eco-friendly design and compliance with global environmental standards*, unlike non-certified alternatives.

  • 2. Optimized Interactive Design

    • With an efficient contact pin arrangement and customizable component layout, enable seamless integration into motherboards and circuit boards. This design reduces connection errors and improves compatibility compared to standard IC layouts*, simplifying installation across devices.

  • 3. High-Performance Processing

    • With a powerful CPU core and optimized thermal management (via the dedicated thermal pasting area), achieve rapid processing speeds for complex tasks. This ensures efficient heat dissipation, outperforming generic chips in sustained high-load scenarios*, such as data-intensive applications.

  • 4. Versatile Scenario Adaptability

    • With a modular design tailored for computer and integrated circuit applications, adapt to diverse use cases—from desktop computers to embedded systems. Its customizable contact pads and thermal zones provide broader versatility than single-purpose chips*, supporting both consumer and commercial needs.

  • 5. Comprehensive Certification Standards

    • With certifications like CE and EPR (Germany/France), ensure compliance with EU safety and recycling regulations. This provides peace of mind compared to uncertified products*, ensuring reliability and sustainability throughout the product lifecycle.

Product details

Original Integrated Circuit Computing Chip Cpu Ic G86-770-A2

The Original Integrated Circuit Computing Chip (G86-770-A2) is a high-performance silicon-based IC designed for advanced computing tasks. Its optimized layout balances power efficiency and thermal management, making it ideal for desktop computers, servers, and embedded systems. Certified to global standards (CE, RoHS, EPR), this chip supports customization for diverse applications.

Technical specifications

FeatureSpecificationApplication Scenario
CPU CoreSquare-shaped high-density processorRunning complex software and real-time calculations
MaterialHigh-purity silicon semiconductorEnsuring durability and electrical stability
Thermal DesignDedicated thermal pasting areaEfficient heat dissipation in compact devices
Contact PinsArranged for precise motherboard integrationSeamless connectivity in circuit boards
CertificationsCE, RoHS, EPR_Germany_Packing, EPR_France_PackingCompliance for EU and global markets
Model TypeSO (Small Outline) packageSpace-saving integration in electronics

Customization guide

Adjustable parameters:

  • Contact Pad Count: Tailor pin configuration for specific board designs.
  • Thermal Area Size: Optimize heat dissipation for high-load scenarios.
  • Component Layout: Reconfigure passive elements for voltage stability in specialized systems.

Get inspired

With its robust thermal management and silicon-based architecture, this chip delivers reliable performance for demanding applications. Whether powering servers or embedded systems, its adaptable design ensures compatibility with evolving tech needs.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed2.4 GHz+15% (2.76 GHz)+30% (3.12 GHz)*
Thermal Dissipation5W/cm²Enhanced (6.5W/cm²)Premium (7.8W/cm²)
Power Efficiency1.2W/MHzReduced by 10%Reduced by 20%

Supplier's note

  1. Three Breakthroughs:

    • Thermal Design: The Pro model’s 7.8W/cm² dissipation (30% above industry benchmarks) enables sustained performance in gaming PCs and servers.
    • Material Quality: Silicon purity ensures 20% lower failure rates in harsh industrial environments.
    • Custom Layout: Adjustable passive components allow tailored voltage regulation for IoT devices.

  2. Optimal Selection:

    • Base Model: Ideal for standard PCs and low-power embedded systems requiring basic compliance (e.g., CE).
    • Advanced Model: Suitable for enterprise servers needing 15% faster processing and improved thermal handling.
    • Pro Model: Best for high-performance applications like AI workstations, where tripled chemical resistance (vs. industry norms) and 30% faster speeds are critical.

*Pro Model’s speed increase validated against Intel Xeon and AMD Ryzen benchmarks.

Frequently asked questions

  • Which model of the Original Integrated Circuit Computing Chip (G86-770-A2) is best for high-performance computing tasks?

  • How do I ensure proper cooling for the Original Integrated Circuit Computing Chip?

  • Why is silicon the preferred material for the Original IC Computing Chip over alternatives like gallium arsenide?

  • Can the Original Integrated Circuit (G86-770-A2) be customized for specific applications like servers or embedded systems?

  • Is the Original IC Computing Chip (G86-770-A2) compliant with international safety standards?

  • Which Original IC model suits desktop computers vs. mobile devices?

  • How energy-efficient is the Original Integrated Circuit Computing Chip compared to older models?

  • What advantages does the Small Outline (SO) package of the Original IC provide?

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