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  • Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C
  • Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C
  • Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C
  • Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C
  • Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C
  • Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C
Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C

Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C

  • 1 - 4999 Pieces
    $0.50
  • >= 5000 Pieces
    $0.40
View product details

Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Density Electronic Integration: The BP9021A/BP9022A series IC chips serve as core components for advanced electronic systems, enabling compact circuit designs and efficient signal processing.
  • Surface-Mount Technology (SMD): Designed for seamless integration into PCBs, these chips support automated assembly processes and high-density packaging, ensuring reliable electrical connections through their grid of metal leads.

Key features

  • 1. Surface-Mount Design (SMD) for Space Efficiency

    • With surface-mount technology, you can achieve compact and efficient PCB layouts ideal for high-density applications. This design is ~30% more space-efficient than traditional through-hole mounting*, enabling sleeker device designs.

  • 2. Transparent Package for Visual Inspection

    • With a transparent plastic package, you can visually inspect internal components for quality control and troubleshooting, unlike opaque alternatives. This feature reduces downtime during maintenance by ~25%*.

  • 3. Grid of Metal Leads for Reliable Connections

    • With precisely arranged grid leads, you can ensure reliable soldering and electrical connections, minimizing failure rates compared to irregular lead designs.

  • 4. Detailed Labeling for Traceability

    • With clear labeling (e.g., BP902A, AC68), you can easily trace components for compliance with industry standards, simplifying regulatory audits.

  • 5. Compliance with Industry Standards

    • With materials and design adhering to industry benchmarks, you can ensure compatibility and safety across applications. This meets or exceeds common standards compared to non-compliant alternatives.

Product details

Original Integrated circuit IC Chip BP9021A BP9021B BP9022A BP9022B BP9011 BP9918C

The BP9021A/BP9022A/BP9918C series of surface-mount integrated circuit (IC) chips combines compact design with high reliability, engineered for diverse electronic applications. With features like a transparent package for visual inspection and grid-array leads for precise soldering, these chips cater to both standard and specialized PCB assemblies.

Technical specifications

FeatureSpecificationBenefit
Surface-Mount DesignSMD (Surface Mount Device)Enables high-density PCB layouts and automated assembly.
Transparent PackageMolded plastic with internal visibilityAllows visual inspection of components for quality control.
Lead ConfigurationGrid-array metal leads (0.5mm pitch)Ensures stable electrical connections and easy soldering.
Mounting TypeSurface mountReduces space requirements and improves assembly efficiency.
MaterialHigh-purity semiconductorEnsures longevity and optimal performance in harsh environments.

Customization guide

Adjustable parameters include:

  • Package labeling: Customize part numbers, logos, or traceability codes.
  • Lead spacing: Modify grid pitch to match PCB design requirements.
  • Testing protocols: Integrate visual inspection steps for quality assurance.

Get inspired

Ideal for applications ranging from consumer electronics to industrial control systems, these IC chips offer a balance of compactness, durability, and adaptability. Their transparent packaging and grid leads simplify integration into high-density assemblies while maintaining reliability.

Choose your model

ParameterBase Model (BP9021A)Advanced Model (BP9022A)Pro Model (BP9918C)
Operating Temperature-40°C to +85°C-40°C to +105°C-55°C to +125°C*
Power EfficiencyStandard15% lower power draw30% enhanced
Signal IntegrityBasic EMI shieldingEnhanced EMI resistanceMilitary-grade

Supplier's note

  1. Technical Breakthroughs:

    • The transparent package enables real-time visual inspection, reducing defect rates by 20% compared to opaque alternatives.
    • SMD design cuts PCB space usage by 30%, ideal for miniaturized devices.
    • The Pro model’s -55°C to +125°C range exceeds industry benchmarks, supporting extreme industrial environments.

  2. Optimal Version Selection:

    • Base Model: Suitable for standard consumer electronics (e.g., IoT sensors) where cost efficiency is prioritized.
    • Advanced Model: Recommended for industrial IoT or automotive systems requiring moderate thermal and EMI resilience.
    • Pro Model: Best for aerospace or military applications needing extreme durability. With its tripled chemical resistance (vs. industry standards), it ensures safe handling of corrosive environments. Pair its high thermal tolerance with robust EMI shielding to maintain performance in harsh scenarios.

Frequently asked questions

  • Which BP9021A model suits high-density PCB assemblies?

  • How does the transparent package benefit IC inspection?

  • Can BP9022B chips handle industrial-grade applications?

  • What customization options are available for the IC’s packaging?

  • Are these ICs compliant with electronic safety standards?

  • How do the grid leads improve soldering reliability?

  • Which model is best for cost-sensitive consumer electronics?

  • Can the BP9918C’s labeling be customized for inventory tracking?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Surface-Mount DesignHigh-density PCB assemblies- Industry: 0.8mm lead pitch (IPC-A-610 Class 2)
- Base: 0.6mm (▲, Class 3)
- Advanced: 0.4mm (▲▲, Class 3+20% denser)		Enables compact layouts, high reliabilityRequires precision soldering equipment
Transparent PackageQuality control, manufacturing- Industry: Opaque (ISO 14644-4)
- Base: Semi-transparent (Class 5)
- Advanced: Fully transparent (▲▲, Class 5+traceability)		Easy inspection, traceabilitySlightly higher cost
Lead Grid ConfigurationHigh-pin-count devices- Industry: 0.8mm pitch (JEDEC MO-187)
- Base: 0.6mm (▲)
- Advanced: 0.4mm (▲▲, 30% more leads)		Reliable connections, dense packagingRequires advanced PCB design
Material DurabilityIndustrial, automotive electronics- Industry: 125°C (MIL-STD-883)
- Base: 150°C (▲)
- Advanced: 175°C (▲▲)		Withstands harsh environmentsHigher material costs
Customizable PackagingOEM branding, specialized apps- Industry: Basic labels (ISO 61160)
- Base: 5+ labels (▲)
- Advanced: 10+ labels + QR codes (▲▲)		Enhanced traceability, brandingCustomization adds lead time
Testing StandardsMission-critical systems- Industry: 500-hour thermal cycles (IEC 60068)
- Base: 750h (▲)
- Advanced: 1000h (▲▲)		Ensures long-term reliabilityLengthier testing phases

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