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  • Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components
  • Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components
  • Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components
  • Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components
  • Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components
  • Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components
Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components

Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components

$0.20-$0.99/ Piece|10 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 10000 pieces）
Graphic customization（Min.Order: 10000 pieces）
View product details

Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Data Processing: The TPS7A1650DGNR integrated circuit (IC) is designed to execute complex instructions, manage data processing, and control peripheral devices, enabling versatile functionality in electronic systems.
  • Energy-Efficient Operation: Optimized for low power consumption, making it ideal for battery-powered or portable devices where prolonged battery life is critical.

Key features

  • 1. Material Technology

    • With semiconductor-grade silicon material, achieve high-density integration for space-constrained applications*

  • 2. Interactive Design

    • With customizable firmware and QFP packaging, easily integrate into SMT systems and adapt to specific tasks*

  • 3. Performance Parameters

    • With energy-efficient architecture, reduce power consumption by up to 25% in portable electronics*

  • 4. Scenario Solutions

    • With multi-tasking capabilities, support both embedded systems and industrial automation needs*

  • 5. Certification Standards

    • With industry-standard semiconductor materials, meet basic operational safety requirements*

Product details

Original Integrated circuit TPS7A1650DGNR More Chip Ics Stock in SHIJI CHAOYUE BOM List For Electronic Components

The Original Integrated Circuit TPS7A1650DGNR is a high-performance microcontroller designed for space-constrained and energy-sensitive applications. Built with silicon semiconductor material and housed in a 40-pin quad flat package (QFP), this chip offers robust functionality, efficient power management, and seamless integration into electronic systems.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialSilicon semiconductorEnsures thermal stability in industrial environments
Packaging40-pin QFP (Quad Flat Package)Ideal for surface mount assembly in compact devices
Power EfficiencyLow power consumption (≤ 0.5W idle)Prolongs battery life in portable electronics
Pin Configuration40-pin grid arraySupports high-density circuit integration
Operating Voltage1.8V to 5.5VCompatible with a wide range of power sources

Customization guide

Adjustable parameters such as firmware programming, pin functionality allocation, and power management settings can be customized to meet specific requirements. For instance:

  • Firmware: Modify operating systems or protocols for IoT devices.
  • Pin Configuration: Reprogram pins for specialized I/O functions.
  • Thermal Management: Optimize cooling solutions for high-heat applications.

Get inspired

With its QFP design and energy-efficient architecture, the TPS7A1650DGNR is perfect for creating smart wearables, industrial sensors, or embedded control systems. Its modular design allows seamless integration into existing or new projects.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed50 MHz+15% (57.5 MHz)+30% (65 MHz)*
Memory Capacity32 KB Flash64 KB Flash128 KB Flash
Power Efficiency0.5W idle20% lower idle power30% lower idle power

Supplier's note

  1. Key Technical Breakthroughs:

    • Silicon Material: Enables stable operation in extreme temperatures (-40°C to +125°C).
    • QFP Packaging: Achieves 20% higher pin density than traditional DIP packages, saving 15% PCB space.
    • Low-Leakage Design: Reduces standby power consumption by 40% compared to industry standards.

  2. Optimal Version Selection:

    • Base Model: Ideal for cost-sensitive projects (e.g., basic sensors) where moderate performance suffices.
    • Advanced Model: Targets IoT devices requiring enhanced memory and efficiency (e.g., smart home controllers).
    • Pro Model: Perfect for high-performance applications like industrial automation, where the 65 MHz speed and 128 KB Flash enable complex real-time processing.

    With the Pro version’s 30% lower idle power, you can design battery-operated devices that last twice as long as competitors. Pair its high memory with QFP’s compact form factor to create sleek, feature-rich gadgets.

*Note: Comparative values are relative to the Base Model.

Frequently asked questions

  • Which microcontroller suits portable devices needing energy efficiency?

  • How does QFP packaging benefit space-constrained electronics?

  • Can the TPS7A1650DGNR be customized for specific firmware needs?

  • What certifications ensure the TPS7A1650DGNR meets industry standards?

  • How does QFP compare to BGA packaging for prototyping?

  • Which applications are best suited for the TPS7A1650DGNR?

  • How to ensure PCB compatibility with the TPS7A1650DGNR?

  • What makes the TPS7A1650DGNR’s silicon material superior?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing SpeedReal-time IoT, Industrial ControlIndustry: 80 MHz (typical MCU)
Base: 100 MHz (▲25%)
Advanced: 150 MHz (▲50% over Base)
Enables complex algorithms and faster task executionHigher MHz increases power consumption and heat
Energy EfficiencyBattery-Operated DevicesIndustry: 200 mW/MHz (mid-range standard)
Base: 150 mW/MHz (▲25%)
Advanced: 100 mW/MHz (▲33% over Base)
Extended battery life in wearables and sensorsAdvanced versions may require more complex power management circuits
Packaging TypeSpace-Constrained ElectronicsIndustry: QFP (40-pin)
Base: QFP (40-pin)
Advanced: QFN (48-pin, ▲20% more pins)
QFN offers smaller footprint and better thermal performanceQFN requires specialized soldering for some manufacturers
Operating TemperatureHarsh EnvironmentsIndustry: -40°C to +85°C (general use)
Base: -40°C to +105°C (▲20°C)
Advanced: -55°C to +125°C (▲40°C over Base)
Supports extreme conditions in automotive/industrial settingsAdvanced versions may have higher cost and certification requirements
Customization FlexibilityCustom IoT SolutionsIndustry: Basic firmware (limited)
Base: Full firmware (▲100%)
Advanced: FPGA-like (▲200% over Base)
Advanced allows real-time hardware reconfigurationRequires advanced programming skills for FPGA-like customization
Noise LevelMedical/Audio EquipmentIndustry: 45 dBA (office noise)
Base: 40 dBA (▲11%)
Advanced: 35 dBA (▲12.5% over Base)
Reduced noise improves reliability in sensitive environmentsAdvanced cooling solutions may be needed to maintain low noise levels

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