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Original New ABB AGDR-71C Insulated Gate Bipolar Transistor (IGBT) Driver Board Paired Specific IGBT Modules

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Power IGBT Module Control: Designed to drive specific ABB IGBT modules, enabling precise and efficient power conversion in high-demand applications.
  • Real-Time Signal Processing: Equipped with integrated circuits (ICs) and robust components to manage voltage regulation, switching, and thermal management.

Key features

  • 1. Material Technology

  • With a robust aluminum heatsink and FR4 substrate, ensure reliable operation in high-temperature environments*.

  • 2. Interactive Design

  • With modular connectors and a standardized layout, easily integrate into industrial systems for flexible configuration*.

  • 3. Performance Parameters

  • With high-speed signal processing ICs, achieve precise control and rapid response in power conversion applications*.

  • 4. Scenario Solutions

  • With a ruggedized design optimized for industrial and automotive applications, you can maintain stable performance under continuous operation and harsh conditions*.

  • 5. Certification Standards

  • With compliance to EPR France and Germany packaging standards, you can ensure eco-friendly disposal and adhere to EU environmental regulations*.

Product details

Original New ABB AGDR-71C Insulated Gate Bipolar Transistor (IGBT) Driver Board Paired Specific IGBT Modules

The ABB AGDR-71C Insulated Gate Bipolar Transistor (IGBT) Driver Board is a high-reliability control solution designed for industrial and automotive applications. Built with robust FR4 material and a heat-dissipating metal bracket, it ensures stable performance in harsh environments. Certified under EPR France and Germany Packing standards, this original new board offers a 1-year warranty and modular design for seamless integration into custom systems.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialFR4 Glass Fiber Reinforced Polyester, Aluminum Heat Dissipation BracketIndustrial machinery, automotive electronics
Component TypesIntegrated Circuits (ICs), Resistors, Capacitors, Inductors, Durable ConnectorsSignal processing, voltage regulation, power filtering
CertificationsEPR_France_Packing, EPR_Germany_PackingCompliance with European environmental regulations
Warranty1 YearFull coverage for manufacturing defects
DesignModular with customizable connectors and mounting pointsCustom configurations for specific systems

Customization guide

Adjustable parameters include connector types, component density, and heat dissipation bracket design to meet specialized needs such as enhanced thermal performance or compact form factors.

Get inspired

With its modular architecture and industrial-grade materials, the AGDR-71C enables scalable solutions for applications ranging from electric vehicle inverters to industrial motor control systems. Its robust construction ensures reliability even under prolonged stress.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal PerformanceStandard heat dissipation+20% Enhanced Bracket+40% Premium Aluminum
Component Density500 Components/m²800 Components/m²1,200 Components/m²
Customization LevelBasic connector optionsAdjustable component zonesFull modular reconfiguration

Supplier's note

  1. Technical Breakthroughs:

    • FR4 Material: Offers superior insulation and mechanical strength for harsh environments.
    • Heat Dissipation Bracket: Reduces thermal stress by 30% compared to standard designs.
    • Modular Design: Enables 50% faster system integration than non-modular boards.
  2. Version Selection Guidance:

    • Base Model: Ideal for standard industrial applications requiring cost-effective, reliable performance.
    • Advanced Model: Targets applications needing higher component density, such as EV inverters, with 20% improved thermal management.
    • Pro Model: Best for high-stress scenarios (e.g., aerospace systems) with triple the industry-standard chemical resistance and customizable layouts.

With the Pro version’s premium aluminum bracket, you can achieve 40% better heat dissipation than competitors, ensuring longevity in extreme conditions. Pair this with its dense component layout to maximize power output in compact spaces.

Frequently asked questions

  • Which IGBT driver board suits automotive or industrial machinery applications?

  • How to clean the metal heatsink on the ABB AGDR-71C driver board?

  • FR4 vs other materials: Why is FR4 used in the AGDR-71C driver board?

  • Can the AGDR-71C IGBT driver board be customized for specific systems?

  • Is the ABB AGDR-71C EPR-certified for European compliance?

  • Which IGBT modules are compatible with the AGDR-71C driver board?

  • What’s the warranty period for the ABB AGDR-71C driver board?

  • How does the AGDR-71C ensure long-term performance in harsh conditions?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
ABB AGDR-71C AdvancedIndustrial machinery, automotiveFR4 material (ISO 17025), Aluminum bracket (85°C ▲), Modular connectors (IEC 60601)Enhanced heat dissipation (▲ vs Industry Standard), customizable design, EPR certifications (France/Germany)Higher cost, requires expert installation
Industry Standard IGBT DriverGeneral industrial controlFR2 material, Passive cooling (70°C), Fixed connectorsLower cost, simpler designLimited heat tolerance (▲-), non-modular, no EPR certifications
Modular Control SystemsCustom industrial setupsInterchangeable modules (DIN rail ▲), Scalable architectureHighly adaptable (▲ vs Standard), scalable solutionsRequires technical expertise, higher initial investment
High-Reliability PLCsHarsh industrial environmentsStainless steel housing (IP67), Reinforced insulation (IEC 60664)Extreme durability (▲ vs Compact Modules), long operational lifespanBulky design, expensive
Automotive-Grade ControllersVehicle electronicsVibration-resistant mounting (ISO 16750), Wide temp range (-40°C to 85°C)Withstands harsh conditions (▲ vs Standard), temperature resilienceLimited customization, specialized use case
Compact IGBT ModulesSpace-constrained applicationsMiniaturized design (10x10cm), Integrated cooling finsSpace-efficient (▲ vs PLCs), easy installationLower power capacity (▲-), less heat dissipation (▲- vs ABB Advanced)

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