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  • Original New CS2004CP in stock bom
  • Original New CS2004CP in stock bom
  • Original New CS2004CP in stock bom
  • Original New CS2004CP in stock bom
  • Original New CS2004CP in stock bom
  • Original New CS2004CP in stock bom
Original New CS2004CP in stock bom

Original New CS2004CP in stock bom

  • 1 - 99 Pieces
    $1.47
  • 100 - 999999 Pieces
    $0.86
  • >= 1000000 Pieces
    $0.37
View product details

Original New CS2004CP in stock bom

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Surface-Mount Design: The CS2004CP is a 20-pin SMD DIP package optimized for compact PCB layouts, enabling efficient assembly and space-saving integration in electronic devices.
  • Versatile Application: Supports a wide range of standard applications, from basic logic circuits to advanced systems, thanks to its durable black plastic/ceramic material and standardized pin configuration.

Key features

  • 1. Corrosion-Resistant Metal Pins

    • With corrosion-resistant metal pins, ensure durable electrical contact in harsh environments. This design extends longevity compared to models with oxidizable materials*.

  • 2. Surface-Mount Design for Simplified Assembly

    • With a surface-mount design, simplify PCB assembly and reduce soldering defects compared to through-hole components*. The compact layout enables efficient space utilization on circuit boards.

  • 3. Compact 20-Pin SMD DIP Package

    • With a compact 20-pin SMD DIP package, optimize space on PCBs for high-density applications like portable devices and automotive electronics.

  • 4. Versatile Application Adaptability

    • Suitable for both portable and automotive electronics, this IC adapts to diverse scenarios, offering reliable performance in standard electronic systems.

  • 5. Compliance with Industry Standards

    • Compliant with standard electronic industry specifications, ensuring reliable performance in certified applications.

Product details

Original New CS2004CP in stock bom

The Original New CS2004CP is a 20-pin surface-mount dual in-line package (SMD DIP) IC designed for compact, high-density PCB layouts. Crafted from durable black plastic/ceramic material with 20 evenly spaced pins, it offers reliable electrical performance and simplified installation. Ideal for standard applications in portable electronics, automotive systems, and industrial control circuits, this IC combines versatility with robust functionality.

Technical specifications

FeatureSpecificationApplication Scenario
Package Type20-pin SMD DIPHigh-density PCB layouts for space-constrained devices
MaterialBlack plastic/ceramicEnsures thermal stability in consumer and industrial electronics
Pin Configuration2 rows of 10 pins, standard pitchSimplifies automated assembly in mass production
Surface Mount DesignDirect PCB attachmentReduces soldering defects in automotive and IoT devices

Customization guide

  • Adjustable Pin Pitch: Customize pin spacing to optimize PCB routing for high-frequency circuits.
  • Material Upgrades: Select ceramic substrates for enhanced thermal conductivity in high-power applications.
  • Surface Treatment: Add conformal coating for moisture resistance in outdoor equipment.

Get inspired

The CS2004CP’s compact SMD DIP design and robust materials make it a go-to for engineers seeking reliable performance in tight spaces. Whether you’re designing wearable tech or automotive control systems, this IC balances precision and scalability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance50°C/W (Standard)+15% (42.5°C/W)+30% (35°C/W)*
Pin Count20 pins (Fixed)24 pins (Custom)28 pins (Custom)
Material GradePlasticCeramic + PlasticPremium Ceramic
CertificationMIL-STD-883MIL-STD-883 + AEC-Q100MIL-STD-883 + IEC 61508

Supplier's note

  1. Technical Breakthroughs:

    • Surface Mount Design: Reduces PCB footprint by 20% compared to through-hole alternatives.
    • Ceramic Material: The Pro Model’s ceramic substrate improves heat dissipation by 30% over plastic.
    • Pin Customization: Adjustable pin counts enable compatibility with legacy and next-gen PCB designs.

  2. Version Selection Guide:

    • Base Model: Ideal for standard consumer electronics (e.g., remote controls, basic sensors).
    • Advanced Model: Suitable for automotive and industrial applications requiring AEC-Q100 compliance.
    • Pro Model: Best for high-reliability systems (e.g., aerospace, medical devices) needing triple the industry-standard chemical resistance. With its ceramic substrate, the Pro Model ensures stable operation in extreme thermal environments.

Frequently asked questions

  • Which SMD DIP IC is suitable for compact electronic devices with limited space?

  • How do I clean the pins of the CS2004CP SMD DIP IC before soldering?

  • Ceramic vs Plastic: Which material is better for high-temperature environments?

  • Can the CS2004CP’s pin configuration be adjusted for custom PCB designs?

  • Is the CS2004CP compliant with industry standards for electronic assemblies?

  • What’s the recommended storage method for unused CS2004CP ICs?

  • Can the CS2004CP’s surface treatment enhance corrosion resistance?

  • Which IC suits high-density PCB layouts for consumer electronics?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeCompact electronics, high-density PCBsIndustry: Through-hole DIP (24-pin)
Base: 20-pin SMD DIP (▲15% smaller)
Advanced: 16-pin QFN (▲30% smaller, ▲50% thermal)		Base: Reduces PCB space, improves reliability.
Advanced: Smaller size, better thermal performance.		Base: Requires SMT assembly.
Advanced: Higher cost, specialized equipment needed.
Thermal PerformanceHigh-power applicationsIndustry: 50°C/W
Base: 40°C/W (▲20% improvement)
Advanced: 30°C/W (▲33% improvement)		Base: Better heat dissipation than standard.
Advanced: Superior thermal management.		Advanced: Higher cost due to advanced materials.
Power EfficiencyBattery-operated devicesIndustry: 1.2W @ 5V
Base: 0.9W (▲25% lower)
Advanced: 0.6W (▲50% lower)		Base: Longer battery life.
Advanced: Ultra-low power consumption.		Advanced: Requires optimized power supplies.
Signal IntegrityHigh-speed data applicationsIndustry: 20dB SNR
Base: 25dB (▲25% improvement)
Advanced: 30dB (▲50% improvement)		Base: Reduced noise for stable signals.
Advanced: Best-in-class signal clarity.		Advanced: Sensitive to electromagnetic interference.
Operating TemperatureIndustrial environmentsIndustry: -20°C to +70°C
Base: -40°C to +125°C (▲30% range)
Advanced: -55°C to +150°C (▲50% range)		Base: Operates in extreme conditions.
Advanced: Ruggedized for harsh environments.		Advanced: Requires additional thermal protection.
Pin ConfigurationComplex circuit designsIndustry: 24-pin (0.1" pitch)
Base: 20-pin (0.05" pitch, ▲50% denser)
Advanced: 16-pin (0.025" pitch, ▲100% denser)		Base: More compact layout.
Advanced: Ultra-dense packaging for miniaturized systems.		Advanced: Requires precision assembly tools.

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