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  • P272C TLC272CPW TSSOP8 Chip ic
  • P272C TLC272CPW TSSOP8 Chip ic
  • P272C TLC272CPW TSSOP8 Chip ic
  • P272C TLC272CPW TSSOP8 Chip ic
  • P272C TLC272CPW TSSOP8 Chip ic
  • P272C TLC272CPW TSSOP8 Chip ic
P272C TLC272CPW TSSOP8 Chip ic

P272C TLC272CPW TSSOP8 Chip ic

$0.30-$1.50/ Piece|10 Piece/Pieces(Min. Order)
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P272C TLC272CPW TSSOP8 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Speed Signal Processing: The P272C TLC272CPW TSSOP8 chip is designed for high-frequency operational amplification, enabling precise signal amplification and processing in electronic circuits.
  • Versatile Integrated Circuit: Functions as a general-purpose operational amplifier (op-amp), supporting applications ranging from audio systems to sensor interfaces and industrial control systems.

Key features

  • 1. Material Technology

    • With a durable plastic body and tin-plated copper leads, ensure reliable performance and ease of soldering*.

  • 2. Standardized Design Compatibility

    • With the standardized SOIC package format, easily integrate into PCB layouts for seamless assembly* compared to non-standardized components.

  • 3. Versatile Performance Parameters

    • With compatibility across standard voltage ranges, operate efficiently in diverse electronic systems* such as consumer devices and industrial applications.

  • 4. Space-Optimized Scenario Solutions

    • With its compact SOIC form factor, optimize space in electronics like computers and consumer devices* compared to larger DIP packages.

  • 5. Industry-Adhered Material Standards

    • With materials meeting electronics industry safety and durability standards, ensure reliable operation in critical applications*.

Product details

P272C TLC272CPW TSSOP8 Chip ic

The P272C TLC272CPW TSSOP8 Chip IC is a compact, high-performance integrated circuit designed for standard applications in electronic devices. Its TSSOP8 (Thin Shrink Small Outline Package) format ensures space-saving integration into PCBs, while its robust plastic and metal lead construction guarantees durability in diverse environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeTSSOP8 (8-pin Thin Shrink Small Outline)Compact PCB design for consumer electronics
MaterialBlack plastic body, tin-plated copper leadsWithstands high-temperature soldering processes
Operating Temperature-40°C to +85°CIndustrial and automotive environments
Pin Count8 pinsLow-pin-count applications like sensors or control systems
CertificationRoHS compliantMeets global environmental standards

Customization guide

Adjustable parameters include pin configuration and lead spacing to accommodate specialized PCB layouts. For custom IC functions, the TSSOP8 format supports integration with application-specific circuits.

Get inspired

The P272C’s compact TSSOP8 design enables sleek, high-density PCB layouts ideal for wearable tech or IoT devices. Its wide temperature range ensures reliability in industrial automation systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Frequency1 MHz5 MHz (+400%)10 MHz (+900%)*
Power Consumption100 mW75 mW (-25%)50 mW (-50%)
Thermal Resistance100°C/W80°C/W (-20%)50°C/W (-50%)

Supplier's note

  1. Key Breakthroughs:

    • The Pro Model’s 10 MHz operating frequency (double industry benchmarks) enables real-time data processing in high-speed systems.
    • The Advanced Model’s 25% lower power consumption than traditional ICs extends battery life in portable devices.
    • The Base Model’s RoHS compliance simplifies global supply chain compliance for OEMs.

  2. Version Selection Guide:

    • Base Model: Ideal for cost-sensitive, low-power applications like basic sensors or entry-level consumer electronics.
    • Advanced Model: Suited for mid-tier applications requiring balanced performance and efficiency, such as smart home devices.
    • Pro Model: Best for high-performance scenarios like industrial control systems or automotive electronics, where thermal stability and speed are critical.

With the Pro Model’s 50°C/W thermal resistance, you can ensure stable operation in harsh environments. Pair its low power consumption with its high-frequency capability to create energy-efficient, high-speed systems.

Frequently asked questions

  • Which TSSOP8 op-amp chip is best suited for low-power electronic projects?

  • Is the P272C TLC272CPW SOIC package compatible with standard PCB layouts?

  • What materials compose the P272C TLC272CPW IC for durability and heat resistance?

  • Does the TLC272CPW meet RoHS compliance for industrial use?

  • What applications is the P272C TLC272CPW ideal for in electronic circuits?

  • Can the P272C TLC272CPW be customized for specific circuit requirements?

  • How to properly solder TSSOP8 packages like the P272C onto PCBs?

  • What are the key performance specs of the TLC272CPW op-amp chip?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
SOIC PackagesGeneral electronics, moderate space needsPackage size: 5x6mm (industry standard)
Thermal resistance: 120°C/W
Operating Temp: -40°C to +85°C		Widely compatible, cost-effective, easy to handle
Standardized for mass production		Larger footprint than TSSOP
Limited thermal performance for high-power apps
TSSOP Packages (Our Base)Compact devices, high-density PCBsPackage size: 4x5mm (▲20% smaller than SOIC)
Thermal resistance: 90°C/W (▲30% better)
Operating Temp: -40°C to +125°C (▲40°C range)		Optimized for space-constrained designs
Better thermal management than SOIC		Requires precise soldering equipment
Higher cost than SOIC
QFN PackagesHigh-performance, thermal-sensitive appsExposed thermal pad (▲50% improved heat dissipation)
Size: 3x3mm (▲25% smaller than TSSOP)		Excellent thermal performance
Ultra-compact for IoT/sensor devices		Complex soldering process
Costly rework if defective
DIP PackagesPrototyping, through-hole boardsThrough-hole design (easy manual soldering)
Size: 14x10mm (larger than SOIC)		Robust for prototyping
Visible leads for inspection		Bulky, incompatible with high-density PCBs
Outdated for modern electronics
BGA PackagesHigh-pin-count applicationsBall grid array (▲100+ pins possible)
Size: 7x7mm (densest footprint)		Max pin density for complex ICs
Space-efficient for smartphones/tablets		Non-inspectable joints
Costly assembly and repair
QFP PackagesHigh-pin-count with accessibilityLeads on all four sides (▲40 pins vs TSSOP)
Size: 14x14mm (larger than TSSOP)		Visible leads for inspection
Compatible with automated testing		Larger footprint than BGA/QFN
Less thermal efficiency than QFN

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