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PCBA
  • PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB
  • PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB
  • PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB
  • PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB
  • PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB
  • PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB
PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB

PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB

  • 1 - 99 Pieces
    $10
  • 100 - 499 Pieces
    $5
  • 500 - 999 Pieces
    $2
  • >= 1000 Pieces
    $1

Customization:

Graphic customization（Min.Order: 1 pieces）
View product details

PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Multilayer PCB Design: Supports complex circuit configurations for industrial control, data acquisition, and specialized electronic systems, leveraging a well-organized layout with integrated circuits (ICs), connectors, and power management components.
  • Custom Surface Finishing Options (HASL/ENIG): Choose between cost-effective HASL (Lead-free Hot Air Solder Leveling) or high-reliability ENIG (Electroless Nickel Immersion Gold) for enhanced durability and compatibility with diverse environmental conditions.

Key features

  • 1. Advanced Material Technology

    • With FR-4 material and ENIG surface finishing, achieve superior corrosion resistance and compatibility with fine-pitch components compared to traditional HASL-coated PCBs*. The ENIG (Electroless Nickel Immersion Gold) plating ensures long-term reliability in high-stress environments.

  • 2. Configurable Interactive Design

    • With customizable jumpers and headers, adapt functionality to meet specific application needs*, enabling rapid prototyping and reconfiguration. This flexibility surpasses rigid, non-modular PCB designs.

  • 3. High-Performance Multilayer Architecture

    • With a multilayer design, enhance signal integrity and component density over single-layer PCBs*, supporting complex circuitry and high-speed data transmission. The optimized power/ground planes minimize interference.

  • 4. Versatile Scenario Solutions

    • With a modular layout and diverse connectivity options (e.g., D-sub connectors), deploy in industrial control systems, data acquisition setups, and prototyping*, outperforming PCBs limited to niche applications.

  • 5. Eco-Friendly Compliance

    • With RoHS-compliant ENIG plating, meet global environmental standards for lead-free electronics*, ensuring suitability for markets prioritizing sustainability.

Product details

PCB PCBA Design, Bom Gerber Files Multilayer PCB, Prototype PCB

The PCB PCBA Design offers a versatile multilayer solution with customizable configurations, built on FR-4 material for durability and reliable performance. Surface finishing options (HASL and ENIG) ensure compatibility with diverse applications, from prototyping to industrial systems.

Technical specifications

FeatureSpecificationBenefit
MaterialFR-4 epoxy laminateHigh thermal stability and mechanical strength
Surface FinishingHASL (Lead-free), ENIG (Immersion Gold)Enhanced solderability and corrosion resistance
Layers4-16 layers (configurable)Supports complex circuit designs and signal integrity
ConnectivityD-sub connectors, headers, jumpersFlexible interface options for system integration
CertificationsRoHS, ISO 9001Compliance with global manufacturing standards

Customization guide

Adjust component placement, layer count, or connector types to meet specific design requirements. For example:

  • HASL finishing: Ideal for cost-sensitive prototyping.
  • ENIG finishing: Opt for high-reliability applications requiring fine pitch components.

Get inspired

With its modular design and multilayer capability, this PCB is perfect for industrial control systems, data acquisition devices, or IoT prototypes. Its organized layout ensures easy maintenance and scalability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Surface FinishHASL (Lead-free)ENIGENIG + Gold Plating
Layer Count4-8 layers8-12 layers12-16 layers
Thermal PerformanceStandard+15% heat dissipation+30% heat dissipation*
Component DensityLow-to-moderateHighUltra-high

Supplier's note

  1. Technical Breakthroughs:

    • ENIG Surface Finish: Triple the corrosion resistance of HASL, enabling use in harsh environments.
    • 16-Layer Architecture: Reduces signal interference by 40% compared to 8-layer boards.
    • Gold Plating Option: Extends connector longevity in high-vibration industrial settings.

  2. Version Selection Guide:

    • Base Model: Best for prototyping or low-complexity projects with budget constraints.
    • Advanced Model: Targets mid-range applications requiring higher component density (e.g., IoT gateways).
    • Pro Model: Ideal for mission-critical systems (e.g., aerospace or medical devices) demanding extreme reliability and thermal performance.

With ENIG surface finishing, you can achieve long-term durability in corrosive environments. The Pro Model’s 16-layer design ensures 20% faster signal transmission than industry benchmarks, making it perfect for high-speed data systems.

Frequently asked questions

  • Which PCB design suits prototyping projects requiring quick turnaround?

  • How to store multilayer PCBs to prevent oxidation during long-term storage?

  • HASL vs ENIG: Which surface finish is better for high-reliability industrial applications?

  • Can I customize the PCB design with my own Gerber files for a specific application?

  • Are the surface finishes RoHS-compliant for EU electronics manufacturing?

  • What applications are suitable for ENIG-finished multilayer PCBs?

  • Is the PCB’s FR-4 material flame-retardant and heat-resistant for industrial use?

  • What’s the lead time for prototype PCB production with ENIG finish?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Surface FinishHigh-density BGA/Chip-on-Board assembliesIndustry Standard: HASL (25-35 µm, cost-effective)
Our Base: HASL (same as industry)
Our Advanced: ENIG (3-5 µm Ni + 0.05 µm Au ▲)
Advanced: Corrosion-resistant, compatible with fine-pitch components.
Base: Economical for standard assemblies.		Advanced: 20% higher cost vs Base.
Material CompositionHigh-temperature industrial equipmentIndustry Standard: FR-4 (TG 130°C)
Our Base: FR-4 (TG 130°C)
Our Advanced: FR-4 with TG 170°C ▲
Advanced: Withstands temperatures up to 170°C (ideal for harsh environments).
Base: Standard thermal stability.		Advanced: Slightly more brittle; requires precision handling.
Layer CountComplex multi-functional devicesIndustry Standard: 4 layers
Our Base: 4 layers
Our Advanced: 6 layers ▲
Advanced: Enables denser routing for high-pin-count ICs.
Base: Cost-effective for moderate complexity.		Advanced: 30% higher fabrication cost vs Base.
Thermal ManagementHigh-power LED or motor control systemsIndustry Standard: 1 oz copper (35 µm)
Our Base: 1 oz copper
Our Advanced: 2 oz copper ▲
Advanced: 40% better heat dissipation (ideal for power electronics).
Base: Sufficient for low-to-moderate power.		Advanced: Adds weight and thickness; requires thicker boards.
Signal IntegrityHigh-speed data transmission (e.g., PCIe)Industry Standard: ±10% impedance tolerance
Our Base: ±10%
Our Advanced: ±5% ▲
Advanced: Reduces crosstalk by 50%, enabling GHz frequencies.
Base: Adequate for standard digital signals.		Advanced: Requires tighter manufacturing tolerances (longer lead times).
Customization OptionsRapid prototyping for niche applicationsIndustry Standard: Limited to standard finishes/layouts
Our Base: Standard options
Our Advanced: Custom coatings (e.g., RoHS, UL认证) + 48-hour prototyping ▲
Advanced: Supports specialized certifications and faster iterations.
Base: Meets basic customization needs.		Advanced: 15% markup for non-standard requests.

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