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  • PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen
  • PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen
  • PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen
  • PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen
  • PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen
  • PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen
PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen

PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen

  • 1 - 499 Pieces
    $3.60
  • 500 - 2999 Pieces
    $1.89
  • >= 3000 Pieces
    $0.95

Customization:

Customized logo(Min.Order: 10 pieces)
Customized packaging(Min.Order: 10 pieces)
Graphic customization(Min.Order: 10 pieces)

PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Digital Temperature Control: Designed to precisely regulate temperature in consumer electronics and electronic devices, supporting applications such as smart home appliances, industrial equipment, and environmental control systems.
  • Modular Assembly Flexibility: Offers both Surface Mount Technology (SMT) and Dual Inline Package (DIP) assembly options, enabling customization for diverse electronic projects and scalable production needs.

Key features

  • 1. Durable Material Construction

  • With a FR-4 substrate and corrosion-resistant solder mask, ensure long-lasting performance in demanding environments, outperforming standard PCB materials*.

  • 2. Modular Design Flexibility

  • With a modular 2x2 grid design, customize configurations by adding/removing sections to suit specific project needs, offering unmatched adaptability compared to rigid PCB layouts*.

  • 3. Hybrid Assembly Compatibility

  • With support for both SMT and DIP assembly technologies, integrate high-density components while maintaining compatibility with through-hole components, enhancing design flexibility*.

  • 4. UL and EPR Certification Compliance

  • With UL safety and EPR environmental certifications, meet stringent international standards, ensuring market readiness in regulated regions where many competitors fall short*.

  • 5. Scalable Application Solutions

  • With scalable modular sections, deploy in compact consumer electronics or expand for industrial systems, addressing both small-scale and large-scale operational requirements*.

Product details

PCB PCBA Printed Circuit Board W1209 Digital Temperature Controller SMT DIP Assembly Service in Shenzhen

The W1209 Digital Temperature Controller PCB is a modular, high-performance printed circuit board designed for consumer electronics and electronic devices. Certified to UL and EPR_Germany_Packing standards, it features a 2x2 grid modular design, SMT/DIP assembly compatibility, and robust FR-4 material with a green solder mask. Its scalable architecture and edge-mounted connectors enable flexible customization for diverse thermal management applications.

Technical specifications

FeatureSpecificationApplication Scenario
Modular Design4-section 2x2 grid, scalableCustomizable IoT devices, industrial sensors
Component PlacementBalanced IC/resistor/capacitor layoutEfficient power distribution in compact devices
Connectors12 edge-mounted (power/data/communication)Seamless integration with external systems
MaterialFR-4 substrate with green solder maskHigh thermal stability in harsh environments
SilkscreenWhite contrast labelsSimplified assembly and troubleshooting

Customization guide

Adjustable parameters:

  • Section Count: Add/remove modular segments to match project size (e.g., 2x2 → 1x1 for compact devices).
  • Connector Types: Swap standard connectors for high-speed USB-C or ruggedized IEC variants.
  • Thermal Layers: Optimize copper thickness for extreme temperature ranges.

Get inspired

With its modular design, you can rapidly prototype temperature controllers for smart home appliances. Using FR-4 material, you can ensure long-term durability in industrial settings. With 12 edge connectors, you can integrate real-time data logging modules for precision monitoring.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Modularity Level2-section core3-section expandable4-section full grid
Connector Density8 standard ports12 hybrid ports16 high-speed ports*
Thermal Performance70°C max90°C (+28%)*110°C (+57%)*
CertificationsULUL + RoHSUL + EPR + ISO 13485

*Comparative to industry benchmarks.

Supplier's note

  1. Technical Breakthroughs:

    • Modular Architecture: Enables 40% faster prototyping vs. monolithic designs.
    • Thermal Efficiency: Pro Model’s 110°C rating outperforms 80% of competitors.
    • Connector Flexibility: Hybrid ports reduce external adapter needs by 30%.
  2. Version Selection Guidance:

    • Base Model: Ideal for hobbyists or low-volume projects requiring basic temperature control (e.g., smart plugs).
    • Advanced Model: Targets mid-tier industrial applications needing multi-device connectivity (e.g., HVAC systems).
    • Pro Model: Designed for high-stakes environments like medical devices or aerospace, leveraging triple-certified materials and extreme thermal resilience.

With the Pro version’s 110°C tolerance, you can safely handle industrial-grade thermal fluctuations. Paired with its 16 high-speed connectors, this creates a unified solution for real-time data transmission and control in critical systems.

Frequently asked questions

  • Which PCB design suits modular temperature control systems for consumer electronics?

  • How to maintain the solder mask on a digital temperature controller PCB?

  • FR-4 vs. epoxy PCB material: Which is better for temperature controllers?

  • Can this PCB be customized for specific temperature sensor integration?

  • Is the W1209 PCB certified for EU consumer electronics?

  • What assembly services are available for the W1209 temperature controller PCB?

  • Which PCB layout ensures efficient power distribution for temperature control?

  • How does the silkscreen improve PCB assembly for temperature controllers?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Modular PCBCustomizable electronics, IoT devices4 modular sections (W1209 design ▲2x vs Industry Standard 2 sections)
FR-4 substrate (1.6mm thickness)
8 edge connectors (20-pin each)
Scalable design ▲ (easily expandable for complex systems)
Certified UL/EPR (safety/environmental compliance)
Higher cost (▲15% vs Standard PCB)
Requires specialized assembly tools
Standard PCBLow-complexity devices (e.g., LED lights)2-layer design (basic configuration)
2 edge connectors (10-pin each)
Cost-effective (▲30% cheaper than Modular PCB)
Easy to manufacture
Limited customization ▼
Lower performance (e.g., slower signal transmission)
High-Density Interconnect (HDI) PCBHigh-speed devices (smartphones, medical gear)8+ layers (▲4x vs Standard 2 layers)
Microvias (0.1mm diameter)
High-speed data transfer ▲
Compact form factor (ideal for miniaturized devices)
Expensive (▲50% cost vs Standard PCB)
Complex manufacturing (longer lead times)
Flexible PCBWearables, automotive sensorsFlexible substrate (PET/PI material)
Bend radius: 5mm (ISO 14971 compliant)
Lightweight ▲
Space-saving design (curved surfaces)
Lower durability (▲10% lifespan vs Rigid PCB)
Higher cost (▲25% vs Standard PCB)
Rigid PCBIndustrial equipment, appliancesFR-4 substrate (1.6mm)
Rigid structure (IEC 60068 tested)
Durable ▲ (withstands vibration/shock)
Stable performance in harsh environments
Non-modular ▼
Less compact (bulky compared to HDI)
Multilayer PCBServers, telecommunications4–16 layers (▲2x+ vs Standard)
High layer density (10+ layers supported)
Complex circuit integration ▲
High functionality (handles advanced systems)
Costly (▲40% vs Standard PCB)
Difficult to repair/debug

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