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  • PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL
  • PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL
  • PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL
  • PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL
  • PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL
  • PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL
PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL

PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL

  • 1 - 99 Pieces
    $0.38
  • 100 - 999 Pieces
    $0.30
  • >= 1000 Pieces
    $0.14

Customization:

PCB（Min.Order: 1 pieces）
View product details

PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Embedded Control & Digital Logic: A 8-bit microcontroller designed for embedded applications, supporting digital logic operations, data processing, and real-time control in electronic systems.
  • Versatile Connectivity: Equipped with multiple I/O pins (14-pin SOIC package) for interfacing with sensors, actuators, and peripheral devices, enabling applications like IoT, automation, and industrial control.

Key features

  • 1. Material Technology

    • With a durable plastic encapsulation and tin alloy pins, ensure reliable soldering and resistance to thermal stress, outperforming standard through-hole components*.

  • 2. Interactive Design

    • With in-circuit programming support, enable seamless firmware updates and debugging without removing the chip from the PCB, streamlining development workflows*.

  • 3. Performance Parameters

    • With a compact SOIC14 surface-mount design, achieve a 40% smaller footprint compared to DIP packages, optimizing space in high-density circuit boards*.

  • 4. Scenario Solutions

    • Designed for embedded systems and IoT applications, deliver robust performance in compact devices like smart sensors or industrial controls, ensuring reliability in commercial and industrial environments.

  • 5. Certification Standards

    • CE-certified, guarantee compliance with EU safety and electromagnetic compatibility standards, simplifying market entry for global projects.

Product details

PIC16F1824T-I SL SOIC14 IC Chip PIC16F1824T-I ST PIC16F1824-ISL PIC16F1824 PIC16F1824T-I SL

The PIC16F1824T-I SL SOIC14 IC chip is a versatile surface-mount microcontroller designed for embedded systems and IoT applications. Its compact SOIC-14 package, CE certification, and wide operating voltage range make it suitable for a variety of industrial and consumer electronics.

Technical specifications

FeatureSpecificationBenefit
Package TypeSOIC-14Compact design for space-constrained PCBs
CertificationCEEnsures compliance with EU regulations
Operating Voltage2.0V to 5.5VFlexible power supply compatibility
Mounting TypeSurface Mount (SMT)Enables automated assembly and reliability
Operating Temperature-40°C to +85°CReliable performance in harsh environments
Pin MaterialTin AlloyEnsures durable soldering and electrical contact

Customization guide

Adjustable operating voltage and temperature thresholds to meet specific project requirements. Ideal for applications needing cost-effective embedded control solutions.

Get inspired

With its 14-pin SOIC package and wide voltage tolerance, this IC is perfect for compact devices like smart sensors, home automation systems, and industrial control units.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Flash Memory14KB18KB (+28.6%)22KB (+57.1%)*
Operating Temperature-40°C to +85°C-40°C to +105°C-40°C to +125°C
I/O Pins121416
PeripheralsBasic (PWM, UART)Enhanced (SPI, I2C)Premium (CAN, USB)

Supplier's note

  1. Key Technical Breakthroughs:

    • CE Certification: Ensures regulatory compliance for EU markets.
    • SMT Design: Reduces PCB space by 30% compared to through-hole alternatives.
    • Extended Temperature Range: Operates reliably in industrial environments up to +125°C.

  2. Version Selection Guide:

    • Base Model: Ideal for basic embedded projects (e.g., sensors, LED controllers) requiring standard memory and peripherals.
    • Advanced Model: Choose for applications needing enhanced connectivity (SPI/I2C) and moderate memory (e.g., smart home devices).
    • Pro Model: Optimal for industrial automation and high-reliability systems demanding CAN/USB interfaces and extreme temperature resilience.

With the Pro version’s 22KB flash memory and CAN interface, you can develop complex IoT gateways. Its +125°C rating ensures stability in automotive or industrial settings, while SMT mounting cuts assembly costs by 20% versus traditional methods.

Frequently asked questions

  • Which PIC microcontroller is best suited for low-power embedded systems?

  • How do I ensure proper handling of the PIC16F1824T-I SL SOIC14 to avoid damage?

  • Why choose the SOIC14 package over DIP for surface-mount projects?

  • Can the PIC16F1824T-I be customized for IoT applications?

  • Is the PIC16F1824T-I SL compliant with EU safety standards?

  • What makes the PIC16F1824T-I suitable for high-reliability PCB designs?

  • Which PIC IC is best for cost-effective digital control systems?

  • Does the PIC16F1824T-I support temperature-critical applications?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeCompact PCB design, mass productionSOIC14: 14-pin Small Outline Integrated Circuit (compliant with JEDEC MO-189) ▲▲▲
(vs DIP's bulkier form factor)		▲▲▲ Space-saving: 30% smaller footprint than DIP (ideal for miniaturized devices)▲▲▲ Requires specialized SMT assembly equipment (costly for prototyping)
CertificationEU market compliance, industrial systemsCE: Meets EU RoHS, LVD, and EMC directives ▲
(vs Industry Standard: Basic FCC compliance)		▲ Global adoption: Simplifies EU market entry (e.g., medical devices)▲ Limited to regions recognizing CE certification (e.g., non-EU markets may require local testing)
Mounting TechnologyAutomated assembly linesSurface-Mount Technology (SMT) ▲▲
(vs Through-Hole Technology in DIP)		▲▲ High reliability: Reduced soldering defects (ISO 9001-certified processes)▲▲ Manual soldering difficult; requires reflow ovens (not ideal for prototyping)
Pin ConfigurationDigital logic circuits, microcontroller14-Pin: Supports 10 I/O pins, 2 power pins ▲
(vs 8-pin for basic logic ICs)		▲ Versatility: Handles complex functions (e.g., motor control, sensor interfacing)▲ Requires advanced PCB routing (increases design complexity)
Material DurabilityHarsh industrial environmentsPlastic Enclosure: Withstands -40°C to +85°C (per IEC 60747-15) ▲
(vs Metal cases for extreme temps)		▲ Cost-effective: 40% cheaper than ceramic packages (ideal for consumer electronics)▲ Limited thermal resistance (not suited for >105°C applications)
Operating VoltageBattery-powered devices3.0V to 5.5V Operation: Optimized for low-power IoT systems ▲
(vs 5V-only industry standard)		▲ Flexibility: Compatible with Li-ion (3.7V) and USB (5V) power sources▲ Requires voltage regulation in mixed-power systems (adds component cost)

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