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PengYing ICNew and Original Chip DIP-8 U664B

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit (IC) Functionality: The PengYing ICNew U664B is an 8-pin DIP-packaged integrated circuit designed for versatile electronic applications, including logic operations, signal amplification, and control systems.
  • Surface-Mount Compatibility: Optimized for seamless integration into printed circuit boards (PCBs), enabling efficient assembly in both prototyping and mass production environments.

Key features

  • 1. Material Technology

  • With plastic encapsulation and silicon core, you can ensure robust protection against environmental factors like moisture, dust, and mechanical stress.

  • 2. Interactive Design

  • With the DIP-8 package design, you can easily integrate the chip into circuits for rapid prototyping or mass production, offering flexibility for both experimental and industrial setups.

  • 3. Performance Parameters

  • With adherence to industry-standard specifications, you can achieve stable performance across a wide range of applications, from consumer electronics to industrial control systems.

  • 4. Scenario Solutions

  • With its compact DIP-8 form factor, you can deploy the chip in both prototyping environments and high-volume manufacturing, ensuring adaptability for diverse use cases.

  • 5. Certification Standards

  • With compliance to RoHS and ISO 9001 standards, you can ensure eco-friendly and quality-assured performance, meeting global regulatory requirements.

Product details

PengYing ICNew and Original Chip  DIP-8 U664B

The PengYing ICNew and Original Chip DIP-8 U664B is a versatile integrated circuit designed for reliability and adaptability. Encapsulated in a durable plastic DIP-8 package, this chip offers a balance of cost-effectiveness and performance, making it ideal for prototyping, mass production, and applications requiring robust environmental protection.

Technical specifications

FeatureSpecificationBenefit
EncapsulationPlastic dual-in-line (DIP-8) packageProtects against moisture, dust, and mechanical damage
MaterialHigh-purity silicon semiconductorEnsures high conductivity and circuit integration
Pin Configuration8 pins (4 per side)Supports logic gates, amplifiers, and simple circuits
Operating Temp-20°C to +85°C (Pro Model)Ensures stability in harsh environments
CertificationIndustry-standard complianceGuarantees compatibility and quality

Customization guide

Adjustable pin spacing and material thickness to meet specific PCB layout or thermal management requirements.

Get inspired

The PengYing U664B chip’s modular design and DIP-8 packaging simplify integration into prototypes or high-volume production. Its silicon core delivers consistent performance, while its wide operating temperature range enables use in industrial, consumer, and automotive applications.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp Range0°C to 70°C-20°C to 85°C-40°C to 105°C*
Power Consumption100mW85mW (-15%)70mW (-30%)
Max Frequency1MHz1.2MHz (+20%)1.5MHz (+50%)

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s -40°C to 105°C operating range exceeds industry benchmarks by 40%, enabling use in extreme industrial settings.
    • The Advanced Model’s 15% lower power consumption reduces energy waste in IoT and battery-powered devices.
    • The silicon core’s enhanced conductivity improves signal integrity by 25% compared to traditional materials.
  2. Optimal Version Selection:

    • Base Model: Ideal for basic consumer electronics and prototyping where standard performance suffices.
    • Advanced Model: Suited for industrial sensors or automotive systems needing low power and moderate thermal resilience.
    • Pro Model: Best for high-reliability applications like aerospace or oil drilling, where extreme temperatures and precision are critical.

With the Pro Model’s expanded temperature range, you can ensure reliability in Arctic or desert environments. Pair its low power consumption with robust silicon conductivity to create energy-efficient, high-performance systems.

Frequently asked questions

  • Which DIP-8 IC is best for prototyping small electronics projects?

  • Is the PengYing U664B IC RoHS compliant and suitable for EU electronics projects?

  • Why is silicon used in the PengYing U664B IC compared to other semiconductor materials?

  • Can the PengYing U664B IC be customized for specific circuit needs?

  • What applications are suitable for the PengYing DIP-8 U664B IC?

  • How does the plastic encapsulation of the U664B protect against environmental factors?

  • What functions do the 8 pins of the U664B IC serve in electronic circuits?

  • Is the U664B IC suitable for mass production in consumer electronics?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Packaging TypePrototyping, Mass ProductionIndustry Standard: DIP-8 (IEC 60099-2 compliant)
Our Base: DIP-8 (RoHS compliant)
Our Advanced: QFN-8 (▲▲ Thermal Efficiency)
Easy PCB insertion/removal; cost-effective for prototyping.
QFN reduces footprint for dense boards.
DIP bulkier than SMD; QFN requires specialized soldering tools.
Encapsulation MaterialIndustrial/Outdoor UseIndustry Standard: Plastic (98% RH/96h, IEC 60068-2-78)
Our Base: Plastic (98% RH/96h)
Our Advanced: Composite (▲▲ 100% RH/168h)
Protects against moisture/dust; cost-effective.
Advanced resists extreme humidity.
Plastic less durable than ceramic; composite increases cost.
Pin ConfigurationSimple Circuits (Logic Gates, Amplifiers)Industry Standard: 8-Pin (ISO 9126)
Our Base: 8-Pin (ISO 9126)
Our Advanced: 8-Pin + 2x I/O Headers (▲ Customization)
Versatile for basic functions; industry-standard compatibility.
Advanced supports modular expansions.
Limited I/O for complex systems; headers add assembly complexity.
Operating Temp RangeHarsh EnvironmentsIndustry Standard: -40°C to 85°C (IEC 60721-3-2)
Our Base: -40°C to 85°C
Our Advanced: -55°C to 125°C (▲▲ Aerospace Grade)
Reliable in most industrial settings.
Advanced withstands extreme cold/heat.
Base may fail in Arctic/Desert conditions; Advanced requires thermal management.
Power ConsumptionBattery-Powered DevicesIndustry Standard: 100mW (IEC 62301)
Our Base: 90mW (▲ 10% Lower)
Our Advanced: 80mW (▲▲ 20% Lower)
Base extends battery life by 15%; Advanced doubles runtime.Base generates more heat; Advanced needs voltage regulation.
Signal-to-Noise RatioAudio/Telecom SystemsIndustry Standard: 45 dBA (IEC 60268-16)
Our Base: 43 dBA (▲ Quieter than Refrigerator Hum)
Our Advanced: 40 dBA (▲▲ Whisper-Quiet)
Base reduces background noise; Advanced eliminates static.Base may distort low-volume signals; Advanced requires shielding.

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