Packaging Type | Prototyping, Mass Production | Industry Standard: DIP-8 (IEC 60099-2 compliant) Our Base: DIP-8 (RoHS compliant) Our Advanced: QFN-8 (▲▲ Thermal Efficiency) | Easy PCB insertion/removal; cost-effective for prototyping. QFN reduces footprint for dense boards. | DIP bulkier than SMD; QFN requires specialized soldering tools. |
Encapsulation Material | Industrial/Outdoor Use | Industry Standard: Plastic (98% RH/96h, IEC 60068-2-78) Our Base: Plastic (98% RH/96h) Our Advanced: Composite (▲▲ 100% RH/168h) | Protects against moisture/dust; cost-effective. Advanced resists extreme humidity. | Plastic less durable than ceramic; composite increases cost. |
Pin Configuration | Simple Circuits (Logic Gates, Amplifiers) | Industry Standard: 8-Pin (ISO 9126) Our Base: 8-Pin (ISO 9126) Our Advanced: 8-Pin + 2x I/O Headers (▲ Customization) | Versatile for basic functions; industry-standard compatibility. Advanced supports modular expansions. | Limited I/O for complex systems; headers add assembly complexity. |
Operating Temp Range | Harsh Environments | Industry Standard: -40°C to 85°C (IEC 60721-3-2) Our Base: -40°C to 85°C Our Advanced: -55°C to 125°C (▲▲ Aerospace Grade) | Reliable in most industrial settings. Advanced withstands extreme cold/heat. | Base may fail in Arctic/Desert conditions; Advanced requires thermal management. |
Power Consumption | Battery-Powered Devices | Industry Standard: 100mW (IEC 62301) Our Base: 90mW (▲ 10% Lower) Our Advanced: 80mW (▲▲ 20% Lower) | Base extends battery life by 15%; Advanced doubles runtime. | Base generates more heat; Advanced needs voltage regulation. |
Signal-to-Noise Ratio | Audio/Telecom Systems | Industry Standard: 45 dBA (IEC 60268-16) Our Base: 43 dBA (▲ Quieter than Refrigerator Hum) Our Advanced: 40 dBA (▲▲ Whisper-Quiet) | Base reduces background noise; Advanced eliminates static. | Base may distort low-volume signals; Advanced requires shielding. |