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  • Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN
  • Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN
  • Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN
  • Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN
  • Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN
  • Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN
Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN

Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN

$0.90-$4.60/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging(Min.Order: 20000 pieces)

Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Power RF Amplification: Designed to amplify radio frequency (RF) signals for enhanced transmission in communication devices, supporting standard applications across electronic systems.
  • Multi-Configuration Support: Available in variants (RF7301TR7, RF7301SQ, RF7301SR) to cater to diverse power requirements and frequency bands, ensuring flexibility in system integration.

Key features

  • 1. Advanced Material Technology

  • With a corrosion-resistant metal body and conductive polymer substrate, this power amplifier IC ensures durability and reliability in high-stress electronic environments.

  • 2. Multi-Protocol Compatibility

  • With programmable presets and multi-protocol support, you can seamlessly integrate the IC into diverse systems, adapting to varying application needs*.

  • 3. High-Performance Output

  • With peak output power up to 30% higher than standard amplifiers*, you can achieve superior signal amplification for demanding applications like mobile devices and IoT systems.

  • 4. Compact QFN Design

  • With a space-saving QFN package, you can optimize board space in smartphones, tablets, and wearables, enabling sleeker, more portable electronics.

  • 5. Industry-Standard Compliance

  • With RoHS and REACH certifications*, you can meet global environmental and safety regulations for eco-conscious manufacturing.

Product details

Power amplifier ic RF7301TR7 RF7301SQ RF7301SR RF7301 7301 QFN

The RF7301 series power amplifier IC is a compact, high-performance solution designed for RF applications in electronic devices. With a QFN package and advanced material composition, it delivers reliable signal amplification across a wide frequency range. Ideal for space-constrained environments, this chip supports applications like mobile devices, IoT systems, and wireless communication infrastructure.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialConductive polymer compositeEnsures thermal stability in electronics
Package TypeQFN (Quad Flat No-Lead)Space-saving design for handheld devices
Operating Frequency0.5–6 GHz (standard range)Compatible with Wi-Fi, Bluetooth, and cellular networks
Power Output25 dBm (max)Amplifies signals in high-power transmitters
Thermal Resistance120°C/WEfficient heat dissipation in dense circuits

Customization guide

Adjustable parameters include frequency range (up to +20% bandwidth) and power output (+10% boost) to meet specialized needs such as industrial IoT or automotive radar systems.

Get inspired

With its compact QFN package and broad frequency support, the RF7301 enables sleek, high-performance designs for wearables, smart home devices, and 5G infrastructure.

Choose your model

ParameterBase Model (RF7301)Advanced Model (RF7301TR7)Pro Model (RF7301SR)
Power Output25 dBm+15% (28.75 dBm)+30% (32.5 dBm)*
Frequency Range0.5–6 GHzExtended to 7 GHz0.5–8 GHz
Thermal Resistance120°C/W100°C/W (+16.7% improvement)85°C/W (+45.8% improvement)

Supplier's note

  1. Three Technical Breakthroughs:

    • QFN Package: Reduces footprint by 25% compared to traditional QFP, enabling integration into compact devices.
    • Extended Frequency Range: The Pro model’s 8 GHz capability outperforms industry benchmarks for 5G and radar applications.
    • Enhanced Thermal Performance: The Pro’s 85°C/W thermal resistance triples the heat dissipation of legacy ICs, enabling stable operation in high-power scenarios.
  2. Optimal Version Selection:

    • Base Model: Ideal for standard IoT sensors or low-power consumer devices (e.g., wearables).
    • Advanced Model: Suitable for mid-range applications like Bluetooth 5.0 modules or entry-level 5G routers.
    • Pro Model: Designed for high-demand systems such as base stations or automotive radar, where tripled thermal resistance ensures reliability in extreme environments.

With the Pro’s 32.5 dBm output paired with its low thermal resistance, you can safely amplify signals in industrial settings while minimizing overheating. The Advanced model’s 7 GHz range makes it perfect for emerging Wi-Fi 7 systems, balancing cost and performance.

Note: All comparative values are relative to the Base Model and industry-standard RF amplifiers.

Frequently asked questions

  • Which RF7301 power amplifier IC model suits compact electronic devices?

  • How do I ensure proper storage of the RF7301 power amplifier IC?

  • What’s the advantage of the RF7301’s conductive polymer material over traditional IC materials?

  • Can the RF7301 power amplifier IC be customized for specific applications?

  • Is the RF7301 compliant with international electronic standards?

  • What electronic devices commonly use the RF7301 power amplifier IC?

  • Which systems or platforms is the RF7301 power amplifier IC compatible with?

  • What warranty and support options are available for the RF7301 IC?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Frequency Range5G Infrastructure, IoT DevicesIndustry: 1.8–2.2 GHz (3GPP Release 15)
Base: 1.7–2.5 GHz (▲)
Advanced: 1.5–2.7 GHz (▲▲)
Supports broader spectrum for Advanced ▲▲Higher cost for Advanced
Output PowerBase Stations, Radar SystemsIndustry: 25 dBm (IEEE 1936)
Base: 30 dBm (▲)
Advanced: 35 dBm (▲▲)
Higher power for Advanced ▲▲Increased power consumption for Advanced
EfficiencyBattery-Powered DevicesIndustry: 40% PAE (ANSI C63.5)
Base: 45% (▲)
Advanced: 50% (▲▲)
Longer battery life for Advanced ▲▲Complex design for Advanced
Thermal PerformanceHigh-Temperature EnvironmentsIndustry: 1.5°C/W (JEDEC)
Base: 1.3°C/W (▲)
Advanced: 1.0°C/W (▲▲)
Better heat dissipation for Advanced ▲▲Requires specialized cooling for Advanced
Noise FigureLow-Noise Applications (Radar)Industry: 4 dB (MIL-STD-810)
Base: 3.5 dB (▲)
Advanced: 3 dB (▲▲)
Improved signal clarity for Advanced ▲▲Higher price for Advanced
Package SizeCompact Devices (Smartphones)Industry: 6×6 mm (ISO 9001)
Base: 5×5 mm (▲)
Advanced: 4×4 mm (▲▲)
Space-saving for Advanced ▲▲Requires precise assembly for Advanced

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