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Insulation Materials & Elements
  • Prepreg 2116, PP, used for Multilayer PCB
  • Prepreg 2116, PP, used for Multilayer PCB
  • Prepreg 2116, PP, used for Multilayer PCB
  • Prepreg 2116, PP, used for Multilayer PCB
  • Prepreg 2116, PP, used for Multilayer PCB
Prepreg 2116, PP, used for Multilayer PCB

Prepreg 2116, PP, used for Multilayer PCB

$1.00-$10.00/ Square Meter|100 Square Meter/Square Meters(Min. Order)
View product details

Prepreg 2116, PP, used for Multilayer PCB

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Multilayer PCB Bonding: Designed to bond layers in high-performance multilayer printed circuit boards (PCBs) using a fiberglass-reinforced polypropylene (PP) composite.
  • Electrical Insulation: Provides reliable dielectric properties and thermal stability to ensure safe, efficient electrical performance in complex circuit designs.

Key features

  • 1. Material Technology

    • With a fiberglass-reinforced PP composite material, you can achieve 30% higher tensile strength than standard PP sheets*, ensuring durability in demanding PCB environments.

  • 2. Scenario Solutions

    • Optimized for multilayer PCB applications, you can support up to 12 layers compared to traditional insulation sheets limited to 8 layers*, enhancing design flexibility.

  • 3. Performance Parameters

    • With a lightweight PP composition, you can reduce PCB weight by up to 20% versus fiberglass-only insulation*, without compromising performance.

  • 4. Versatile Application

    • As a pre-fabricated insulation sheet, you can streamline assembly processes, reducing setup time by 25% compared to custom-cut solutions*.

  • 5. Cost-Effective Design

    • At a 20% lower cost than fully fiberglass-based insulation*, you can achieve comparable performance while optimizing budgets.

Product details

Prepreg 2116, PP, used for Multilayer PCB

Prepreg 2116, a fiberglass-reinforced polypropylene (PP) insulation sheet, is engineered for precision multilayer PCB fabrication. Its balanced mechanical and thermal properties ensure reliable layer adhesion and dimensional stability during high-temperature lamination processes.

Technical specifications

FeatureSpecificationBenefit
MaterialFiberglass reinforced PP matrixCombines strength with lightweight design
Thickness50-300 µm (customizable)Adapts to varying PCB layer requirements
Tg (Glass Transition Temp.)180°C (Base), 220°C (Advanced), 260°C (Pro)Ensures stability in high-temperature curing
Peel Strength≥1.2 N/mm (ISO 2758)Enhances interlayer bonding reliability

Customization guide

Adjustable parameters include thickness (to match PCB layer counts) and resin content (to optimize curing profiles). For high-frequency applications, request low dielectric constant variants.

Get inspired

Prepreg 2116 enables the creation of durable, high-density multilayer PCBs for aerospace, automotive, and telecommunications. Its thermal stability ensures performance under extreme operating conditions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Tg (°C)180+22% (220°C)+44% (260°C)*
Peel Strength1.2 N/mmEnhanced (1.5 N/mm)Premium (1.8 N/mm)
Thickness Range50-200 µmExtended (50-250 µm)Full (50-300 µm)

Supplier's note

  1. Three Technical Breakthroughs:

    • Material Synergy: Fiberglass-PP matrix reduces warpage by 30% vs. traditional epoxy prepregs.
    • High Tg Pro Model: Enables safe operation at 260°C, 50°C above industry benchmarks.
    • Precision Thickness Control: ±5 µm tolerance ensures uniform lamination in high-layer-count PCBs.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard consumer electronics (e.g., smartphones) requiring cost-effective solutions.
    • Advanced Model: Targets industrial IoT and automotive applications needing 220°C thermal resistance.
    • Pro Model: Designed for aerospace and 5G infrastructure, where extreme temperature stability and thick-layer bonding are critical.

With its 260°C Tg, the Pro Model ensures zero delamination during prolonged high-temperature soldering. Paired with ultra-low resin bleed, it maintains PCB integrity in high-density interconnect (HDI) designs.

Frequently asked questions

  • Which prepreg material is best suited for multilayer PCB fabrication?

  • How does Prepreg 2116 compare to epoxy-based prepregs in terms of flexibility?

  • What are the key advantages of fiberglass in Prepreg 2116 for insulation?

  • How should Prepreg 2116 be stored to preserve its adhesive properties?

  • Can Prepreg 2116 sheets be customized to specific PCB dimensions?

  • Is Prepreg 2116 compliant with RoHS and UL safety standards?

  • Why choose PP over other polymers for multilayer PCB insulation?

  • Does Prepreg 2116 support high-frequency PCB applications?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Epoxy Prepreg (Our Product)Multilayer PCB fabricationThermal Resistance: 180°C (Industry) ▲ 200°C (Base) ▲ 220°C (Advanced) (ASTM D648)High thermal stability for complex designsHigher cost
Polyimide FilmsFlexible circuitsThermal Resistance: 250°C (Industry) (ASTM D648)Excellent flexibility and high-temperature useLower dielectric strength
FR-4 LaminatesRigid PCBsDielectric Strength: 4 kV/mm (Industry) ▲ 5 kV/mm (Base) (ASTM D149)Cost-effective for standard PCBsLimited flexibility
Thermoset AdhesivesHigh-temperature bondingTensile Strength: 200 MPa (Industry) ▲ 250 MPa (Advanced) (ASTM D638)Strong adhesion under heatLonger curing time
Silicone Rubber SheetsShock-absorbing applicationsMoisture Absorption: 0.5% (Industry) ▲ 0.2% (Advanced) (ASTM D570)Superior moisture resistanceLower thermal resistance
PTFE MaterialsHigh-frequency circuitsDielectric Constant: 2.1 (Industry)Low signal loss for high-frequency useBrittle and prone to cracking

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