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PCBA
  • Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service
  • Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service
  • Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service
  • Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service
  • Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service
  • Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service
Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service

Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service

  • 1 - 99 Pieces
    $100
  • 100 - 499 Pieces
    $90
  • >= 500 Pieces
    $80

Customization:

Customized packaging（Min.Order: 1 pieces）
View product details

Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Android 8.0 OS Integration: A high-performance mainboard designed to run Android 8.0, enabling seamless operation of smart devices, IoT applications, and multimedia systems.
  • Customizable PCB Design: Supports tailored configurations for specific hardware requirements, leveraging Gerber Design's precision in trace routing, pad sizing, and component placement.

Key features

  • 1. Material Technology

    • With an FR-4 epoxy substrate and copper traces, ensure reliable performance in high-stress electronic environments. The durable material combination guarantees longevity and optimal conductivity for complex circuitry.

  • 2. Interactive Design

    • With an intuitive Android 8.0 interface and 2GB RAM, access multi-program presets for seamless device customization. The user-friendly OS enables advanced functionality tailored to specific hardware needs.

  • 3. Performance Parameters

    • Delivering ~30% faster processing than entry-level models* with 2GB RAM, handle resource-intensive applications efficiently. [*Disclaimer: Based on internal testing; actual results may vary].

  • 4. Scenario Solutions

    • Designed for high-volume manufacturing, supports continuous operation in commercial applications while maintaining precision for home-use devices. The structured PCB layout adapts to diverse electronic product requirements.

  • 5. Certification Standards

    • Complies with international safety and durability standards for PCB manufacturing (e.g., RoHS compliance), ensuring reliability and compatibility with global market regulations.

Product details

Professional Customized PCB Android Mainboard PCBA Motherboard Electronic Products Design Assembly Turnkey Service

The Professional Customized PCB Android Mainboard offers a turnkey solution for electronic product design and assembly, featuring Android 8.0 OS and 2GB RAM. Built with high-quality FR-4 material and copper traces, this PCB is engineered for reliability and precision in manufacturing.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialFR-4 epoxy laminate, copper tracesIndustrial IoT devices, smart home systems
Operating SystemAndroid 8.0Customized embedded applications
Memory2GB RAMMultimedia streaming, basic AI processing
Design CompatibilityGerber file supportMass production of electronics

Customization guide

Adjustable parameters include trace width (0.15–0.3mm) for thermal management, pad sizes (1.5–3mm) for component compatibility, and layer count (2–4) to meet specific electrical requirements.

Get inspired

Combine the robust Android 8.0 OS with customizable hardware to innovate in smart devices, industrial controls, or wearable tech.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
RAM2GB4GB8GB
CPU PerformanceStandard ARM+20% faster+40% faster*
Storage16GB eMMC32GB eMMC64GB NVMe SSD
Thermal DissipationStandard coolingEnhanced heat sinkActive cooling

Supplier's note

  1. Technical Breakthroughs:

    • Android 8.0 Integration: Enables seamless app development for IoT and embedded systems.
    • FR-4 Material: Withstands thermal stress, ensuring longevity in industrial environments.
    • Gerber Design Compatibility: Streamlines mass production with industry-standard file formats.

  2. Optimal Version Selection:

    • Base Model: Ideal for basic applications like smart signage or entry-level IoT devices.
    • Advanced Model: Targets mid-tier needs, such as surveillance systems requiring 4K video processing.
    • Pro Model: Designed for high-performance use cases like AI-driven robotics, leveraging 8GB RAM and active cooling for sustained workloads.

*Pro Model’s CPU outperforms industry benchmarks by 30% in multi-threaded tasks.

Frequently asked questions

  • Which PCB Android mainboard model suits IoT devices with Android 8.0?

  • How is the PCB assembly validated for reliability?

  • Why is FR-4 material used for the PCB mainboard?

  • Can the PCB design be customized for specific components?

  • Is the PCB material RoHS and IPC-compliant?

  • What customization options exist for Android firmware integration?

  • Does the 2GB RAM support multitasking on the Android mainboard?

  • What services are included in the PCBA turnkey package?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Operating SystemLegacy systems (Industry), Smart homes (Base), Industrial IoT (Advanced)Android 6.0 (Industry), Android 8.0 ▲ (Google-certified), Android 10.0 ▲▲ (latest APIs)Industry: Widespread support; Base: Enhanced security; Advanced: AI/ML compatibilityIndustry: Outdated features; Advanced: Higher power/cost
RAMLow-end systems (Industry), Basic smart devices (Base), High-performance apps (Advanced)1GB DDR3 (Industry), 2GB DDR4 ▲ (ISO/IEC 17025), 4GB DDR4 ▲▲ (ISO/IEC 17025)Base: Supports multitasking; Advanced: Handles complex workflowsIndustry: Limited apps; Advanced: Higher power consumption
StorageSimple logging (Industry), Media storage (Base), Industrial data (Advanced)8GB eMMC (Industry), 16GB ▲ (ISO/IEC 16023), 32GB ▲▲ (ISO/IEC 16023)Base: Sufficient for IoT; Advanced: Large datasets (e.g., video analytics)Industry: Insufficient for modern apps; Advanced: Costlier
ConnectivityBasic wireless (Industry), Smart home (Base), Enterprise (Advanced)Wi-Fi 4/Bluetooth 4 (Industry), Wi-Fi 5/Bluetooth 5 ▲, Wi-Fi 6/Bluetooth 5.2 ▲▲Base: 3x faster speeds than Industry; Advanced: 4K streaming supportIndustry: Slow latency; Advanced: Requires compatible infrastructure
Thermal ManagementStandard offices (Industry), High-temp environments (Advanced)Passive cooling (Industry), Enhanced passive ▲, Active fan ▲▲Base: 20% better heat dissipation; Advanced: Maintains performance at 85°CIndustry: Overheating risk under load; Advanced: Adds noise/maintenance
Operating TemperatureIndoor devices (Industry/Base), Harsh environments (Advanced)-20°C to 70°C (Industry/Base), -30°C to 85°C ▲▲ (IEC 60068-2-1)Advanced: Survives Arctic/Desert conditionsIndustry/Base: Limited to moderate climates; Advanced: Higher cost

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The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.