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  • Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board
  • Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board
  • Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board
  • Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board
  • Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board
  • Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board
Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board

Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board

  • 1 - 999 Pieces
    $1
  • 1000 - 4999 Pieces
    $0.50
  • >= 5000 Pieces
    $0.20

Customization:

Customized logo（Min.Order: 1000 pieces）
Customized packaging（Min.Order: 1000 pieces）
Graphic customization（Min.Order: 1000 pieces）
View product details

Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Wireless Bluetooth Connectivity: Enables seamless integration with smart earphones, supporting high-fidelity audio transmission and low-latency connectivity.
  • Customizable Design: Provides Gerber file compatibility and copy board services for tailored PCB configurations, ensuring adaptability to specific product requirements.
  • Scalable Performance: Copper thickness options (0.25–6oz) optimize power distribution and thermal management for varying electronic device needs.

Key features

  • 1. Advanced Material Technology for Enhanced Durability

    • With FR-4 epoxy substrate and copper thickness ranging from 0.25oz to 6oz, you can achieve superior thermal conductivity and current-carrying capacity compared to standard PCBs. This ensures reliable performance in high-power applications like wireless earbuds.

  • 2. Modular Design for Customization and Scalability

    • With a uniform, modular design, you can seamlessly integrate or replace PCB components to adapt to evolving product requirements. This flexibility outperforms rigid, single-use PCB solutions.

  • 3. Optimized Performance for Consumer Electronics

    • With precision-engineered traces and RoHS-compliant materials, you can ensure stable signal transmission and low power loss, critical for high-quality audio in Bluetooth earphones.

  • 4. Certified Safety and Compliance

    • With UL and RoHS certifications, you can guarantee compliance with global safety and environmental standards, reducing regulatory risks for consumer electronics manufacturers.

  • 5. Adaptability Across Power Demands

    • With adjustable copper thickness (0.25–6oz), you can accommodate diverse power requirements—from low-power sensors to high-current audio drivers—unlike fixed-copper PCB alternatives.

Product details

Professional Customized Smart Wireless Blue tooth Earphones Pcb Printed Circuit Board Need to Provide Geber File or Copy Board

Professional Customized Smart Wireless Bluetooth Earphones PCB Printed Circuit Boards are engineered for high-performance consumer electronics. Designed with modular flexibility and rigorous certifications, these PCBs support scalable configurations for wireless earphone systems.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialFR-4 epoxy laminateEnsures thermal stability in compact earphone enclosures
Copper Thickness0.25–6 oz adjustableCustomizable for power distribution needs in audio circuits
CertificationsUL, RoHS compliantMeets global safety and environmental standards for consumer devices
Design TypeModular grid layoutEnables easy integration with Bluetooth modules and sensors
Thermal ManagementOptimized trace patternsReduces heat buildup in high-frequency audio processing

Customization guide

Adjustable copper thickness (0.25–6 oz) to match power requirements, and modular component placement for tailored functionality. Ideal for customizing earphone PCBs to fit form factors or performance needs.

Get inspired

Leverage our modular PCB design to create scalable wireless earphone systems. Whether you need basic connectivity or advanced features like noise cancellation, these PCBs adapt to your technical vision.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Copper Thickness0.25–1 oz1–3 oz3–6 oz*
Layer Count2–4 layers4–6 layers6–10 layers
Thermal PerformanceStandard coolingEnhanced heat dissipation (+20% efficiency)Premium thermal management (+40% efficiency)*

Supplier's note

  1. Key Breakthroughs:

    • Modular Design: Allows rapid prototyping for earphone variants.
    • Adjustable Copper Thickness: Supports power demands from basic audio to high-fidelity streaming.
    • Premium Thermal Management: Reduces failure risks in high-usage scenarios.

  2. Version Selection Guide:

    • Base Model: Ideal for entry-level earphones requiring cost-effective solutions.
    • Advanced Model: Targets mid-range devices needing enhanced audio processing and durability.
    • Pro Model: Designed for premium earphones with demanding features like active noise cancellation. With 6 oz copper, the Pro Model handles 50% higher power loads than industry benchmarks, ensuring reliability in long-use scenarios.

Example Use Case: The Pro Model’s 6-layer design and 6 oz copper enable seamless integration of advanced sensors and extended battery life, making it perfect for high-end wireless earphones.

Frequently asked questions

  • Which PCB model suits wireless Bluetooth earphones for consumer electronics applications?

  • How to maintain and clean PCBs for Bluetooth earphones to ensure longevity?

  • What materials are used in Bluetooth earphone PCBs, and why is FR-4 preferred?

  • Can I customize PCBs for wireless earphones using Gerber files or copy boards?

  • Are these PCBs UL and RoHS certified for safety and compliance?

  • How does copper thickness impact the performance of earphone PCBs?

  • Can the modular PCB design scale for mass production of wireless earphones?

  • How does your design ensure thermal management in custom earphone PCBs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material & ConstructionWearable devices, IoT modulesIndustry Standard: Fiberglass substrate (1.6mm thickness)
Our Base: FR-4 (1.6mm) with UL certification
Our Advanced: Reinforced FR-4 (1.6mm) + RoHS compliance		▲ Base: 30% lighter than industry standard
▲▲ Advanced: 50% higher thermal stability (ASTM D648)		Advanced: 20% higher cost due to reinforced materials
Copper ThicknessHigh-power devices (e.g., gaming headsets)Industry Standard: 1oz copper (handles 20A max)
Our Base: 2oz copper (30A)
Our Advanced: 6oz copper (60A)		▲ Base: 50% higher current capacity
▲▲ Advanced: 3× industry standard load tolerance (IEC 60227)		Advanced: 40% thicker PCB, limits portability
Modular DesignCustomizable electronics (e.g., smart home systems)Industry Standard: Non-modular
Our Base: 3 modular zones (ISO 9001)
Our Advanced: Full modular architecture (12 zones)		▲ Base: 2× faster assembly vs industry
▲▲ Advanced: 90% component interchangeability (IPC-6012)		Advanced: Requires specialized tools for reconfiguration
Thermal ManagementHigh-heat applications (e.g., power amplifiers)Industry Standard: Basic thermal vias
Our Base: Thermal pads + 40°C max dissipation
Our Advanced: Active cooling loops + 80°C dissipation (ASTM E1461)		▲ Base: 25% cooler operation
▲▲ Advanced: 50% longer component lifespan under load		Advanced: Adds 15% to PCB footprint
Electrical PerformanceHigh-speed data devices (e.g., 5G modules)Industry Standard: 100MHz signal integrity
Our Base: 500MHz (ISO 11801)
Our Advanced: 1GHz (IEEE 802.3)		▲ Base: 4× faster data transmission
▲▲ Advanced: 10× lower latency (measured via TDR)		Advanced: Requires precision manufacturing (+20% cost)
CertificationsGlobal markets (EU/US/Asia)Industry Standard: Basic CE
Our Base: UL + RoHS
Our Advanced: UL/RoHS/CE/IPC-6012
(All tiers include ISO 9001)		▲ Base: 3× faster market entry in EU
▲▲ Advanced: Pre-qualified for aerospace (MIL-STD-883)		Advanced: 6-month certification cycle vs 3 months for Base

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