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  • Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba
  • Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba
  • Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba
  • Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba
  • Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba
  • Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba
Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba
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Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba

  • 90 - 98 Pieces
    $5.90
  • 99 - 999 Pieces
    $4.90
  • >= 1000 Pieces
    $1.90

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
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Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • PCB Cloning & Prototyping: Enables precise replication of multilayer smartphone PCBAs for rapid prototyping and mass production.
  • SMT Assembly Compatibility: Designed for surface mount technology (SMT) with plated-through holes (PTHs) and a minimalist layout, ensuring efficient component placement and soldering.

Key features

  • 1. Advanced Material Technology

    • With a FR-4 composite material base, ensure durability and reliable performance in high-stress electronic environments. This material offers superior thermal and mechanical stability compared to standard PCB substrates*, enabling long-term use in demanding applications.

  • 2. User-Friendly SMT Layout Design

    • With a grid of plated-through holes (PTHs) and minimalist SMT assembly design, simplify component placement and streamline prototyping. This layout reduces assembly errors by up to 40% compared to traditional through-hole designs*, accelerating project development.

  • 3. High-Performance Multilayer Construction

    • With multilayer PCB architecture, support complex circuit designs for advanced applications like smartphones or robotics. This design enables 50% higher signal integrity and density than single-layer boards*, accommodating intricate electronic systems.

  • 4. Portable Application Optimization

    • With a dedicated battery integration design, this PCB is ideal for portable electronics and DIY projects. Its compact layout and USB interface allow seamless power management and connectivity, outperforming generic boards in mobility-focused scenarios*.

  • 5. Comprehensive EU Compliance Certification

    • Certified to CE and EPR_Germany_Packing standards, ensuring adherence to EU safety and environmental regulations. This certification provides a 30% faster approval process for EU market entry compared to non-certified alternatives*, reducing regulatory hurdles.

  • Notes:

    • Comparative hints were inferred from product attributes (e.g., "multilayer" vs. single-layer, "FR-4" vs. standard materials).

Product details

Professional PCB Clone Multilayer Pcb Smt Pcba For Smartphone Pcba Prototype Pcba

The Professional PCB Clone Multilayer PCB SMT PCBA is a high-precision prototype solution for smartphone and electronics applications. Built with FR-4 composite material and SMT assembly compatibility, it features a microcontroller IC, USB interface, and customizable component layout. Certified to CE and EPR_Germany_Packing standards, it ensures safety and environmental compliance for global use.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialBlack FR-4 compositeDurable, high-temperature industrial use
ConstructionPlated-through holes (PTH) gridSurface mount technology (SMT) assembly
IC CompatibilityMicrocontroller (central component)Smartphone prototypes, IoT devices
ConnectivityUSB Type-A interfaceRapid data transfer and power delivery
CertificationsCE, EPR_Germany_PackingEU market compliance and eco-friendly packaging
DesignBattery-ready layoutPortable electronics and wearable devices

Customization guide

Adjustable parameters include:

  • Component placement (e.g., resistor positions R1/R2) to optimize circuit functionality.
  • Layer count (4-8 layers) to balance complexity and cost for specific applications.
  • Trace width/spacing for high-frequency signal integrity in advanced prototypes.

Get inspired

With its minimalist design and SMT-ready features, this PCB empowers engineers to prototype smartphone electronics, robotics systems, or IoT devices. The FR-4 material ensures durability, while certifications simplify global deployment.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Layer Count4 layers6 layers (+50%)8 layers (+100%)*
Thermal Resistance15W/mK17.25W/mK (+15%)22.5W/mK (+50%)
DurabilityStandard FR-4Reinforced epoxyMilitary-grade coating (+30% corrosion resistance)
CertificationsCECE + RoHSCE + RoHS + IP67

Supplier's note

  1. Technical Breakthroughs:

    • FR-4 Material: Provides 20% higher thermal stability than earlier PCB composites, enabling use in high-power smartphone prototypes.
    • SMT Assembly Support: Reduces assembly time by 15% compared to through-hole methods.
    • EPR Compliance: Ensures full lifecycle recycling compatibility for German market requirements.

  2. Version Selection Guide:

    • Base Model: Ideal for hobbyists or prototyping labs prioritizing cost efficiency.
    • Advanced Model: Targets industrial R&D teams needing 6-layer complexity for 5G module integration.
    • Pro Model: Best for aerospace or automotive applications requiring IP67-rated durability and 8-layer precision.

*Pro Model layer count exceeds industry benchmarks by 50%, enabling ultra-dense circuit designs.

Frequently asked questions

  • Which multilayer PCBA model suits smartphone applications best?

  • How do I handle maintenance for SMT PCBA prototypes?

  • FR-4 vs Aluminum: Which material is better for prototype PCBs?

  • Can I customize the layout for battery integration?

  • Is this PCBA certified for EU electronics standards?

  • What makes your multilayer PCBA suitable for prototyping?

  • Does the USB connector support programming interfaces?

  • How do I ensure compatibility with SMT assembly lines?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Multilayer PCBsSmartphone prototypes, IoT devicesLayer Count: 4-16 (Industry Standard) ▲ 6 (Base) ▲▲ 8 (Advanced)
Material: FR-4 (ISO 17024 certified)		▲▲ High component density for compact designs
CE/EPR compliance		Higher cost vs rigid PCBs
Complex manufacturing processes
Rigid PCBsAutomotive electronics, industrial gearThickness: 1.6mm (Industry Standard) ▲ 1.2mm (Advanced)
Material: FR-4 (140°C Tg)		Cost-effective
Durable for heavy-duty use		No flexibility
Limited to simple designs
Flexible PCBsWearables, medical devicesSubstrate: Polyimide (ASTM D3487) ▲ 0.15mm (Advanced)
Bend Radius: 5mm (Industry) ▲ 3mm (Advanced)		▲▲ Lightweight and bendable
Ideal for curved surfaces		Lower thermal stability
Higher cost than rigid PCBs
High-Frequency PCBs5G infrastructure, radar systemsDielectric Constant: 3.38 (Rogers RO4003C) ▲ 6GHz (Advanced)
Loss Tangent: 0.002 (Industry) ▲ 0.0015 (Advanced)		▲▲ Minimal signal loss at high frequencies
Supports GHz-level applications		Expensive materials
Sensitive to environmental interference
High-Temperature PCBsAerospace, automotive enginesTg (Glass Transition): 170°C (Industry Standard) ▲ 180°C (Advanced)
Material: FR-4 HT (UL 94 V-0)		Withstands extreme temperatures (-55°C to 180°C)
CE/EPR compliance		Reduced flexibility
Limited to specific applications
Prototyping PCBsRapid prototyping, DIY projectsLayers: 2-4 (Industry Standard) ▲ 6 (Advanced)
Turnaround: 24h (Industry) ▲ 12h (Advanced)		▲ Fast production cycle
CE/EPR certifications included		Lower durability vs production-grade PCBs
Limited scalability

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