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  • Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA
  • Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA
  • Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA
  • Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA
  • Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA
  • Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA
Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA

Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA

  • >= 10 Pieces
    $1

Customization:

One Stop OEM Service（Min.Order: 1 pieces）
View product details

Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Inverter Control Technology: Enables precise management of power inversion processes for efficient energy conversion in electronic systems.
  • Multi-Function Circuitry: Integrates power supply, signal processing, and communication modules to support diverse electronic systems, including automotive, consumer devices, and industrial applications.

Key features

  • 1. Advanced Material Technology for Durability

    • With a robust FR-4 epoxy substrate and OSP/HASL surface finishing, ensure long-term durability in harsh environments while maintaining excellent solderability. This combination provides up to 30% better corrosion resistance compared to generic PCBs*.

  • 2. Modular Interactive Design for Customization

    • With modular terminal blocks and multi-connector interfaces, customize the PCB to integrate with diverse components and power sources effortlessly. Achieve 20% faster setup compared to non-modular PCBs* for tailored solutions in industrial or consumer applications.

  • 3. High-Performance Power Management

    • With a high-efficiency power management module, deliver stable voltage output even under heavy loads, ensuring reliability in industrial and automotive applications. Supports 25% higher power throughput than conventional inverter control boards*.

  • 4. Cross-Industry Scenario Adaptability

    • Designed for cross-industry adaptability, deploy this PCB in communications systems, consumer electronics, and automotive applications with seamless compatibility. Outperforms single-use PCBs by supporting 3x more application scenarios*.

  • 5. Compliance with Global Certification Standards

    • Complies with REACH, RoHS, and UL certifications, ensuring compliance with global safety and environmental regulations. Meets stricter chemical and safety standards than 90% of non-certified PCB alternatives*.

Product details

Program Micro Logic Device Controller PCB Board Inverter Control Technology Logic PCBA

The Program Micro Logic Device Controller PCB Board is a versatile inverter control technology solution designed for high-reliability applications in communications, consumer electronics, and automotive systems. Built with FR-4 material and advanced surface finishes, it combines robust power management capabilities with modular design for easy customization.

Technical specifications

FeatureSpecificationBenefit
MaterialFR-4 epoxy laminateWithstands harsh environments and ensures mechanical durability.
Surface FinishOSP (Organic Solderability Preservative) / HASL (Lead-Free)Enhances solderability and corrosion resistance for long-term reliability.
CertificationsREACH, RoHS, ULMeets global safety and environmental compliance standards.
Power HandlingHigh-current capacity (up to 15A)Supports robust power management in industrial and automotive systems.
ConnectorsTerminal blocks and multi-pin interfacesEnables seamless integration with external devices and power sources.
Component LayoutHigh-density IC placementOptimizes signal processing and control for complex applications.

Customization guide

Adjustable parameters include connector type, component placement density, and surface finish selection (OSP or HASL) to meet specific power requirements or environmental conditions.

Get inspired

This PCB’s modular design and compliance certifications make it ideal for innovators in automotive electronics, smart home systems, and industrial control panels. Its high-power handling and customizable connectors allow seamless adaptation to diverse applications.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Handling (A)10A+15% (11.5A)+30% (13A)*
Surface FinishOSPHASLDual Finish (OSP+HASL)
Component DensityStandardEnhancedPremium (High-Density)
CertificationREACH, RoHSREACH, RoHS, ULAll certifications + ISO 9001

Supplier's note

  1. Technical Breakthroughs:

    • FR-4 Material: Withstands extreme temperatures (-40°C to +120°C), ensuring reliability in automotive and industrial environments.
    • Dual Surface Finishes: Offers flexibility between lead-free OSP for eco-friendly projects and HASL for high-solderability applications.
    • UL Certification: Enables compliance with stringent safety standards for consumer electronics.

  2. Version Selection Guidance:

    • Base Model: Ideal for low-power consumer electronics (e.g., smart home devices) requiring basic certifications.
    • Advanced Model: Suitable for automotive systems needing enhanced power handling (+15%) and UL compliance.
    • Pro Model: Best for industrial applications demanding premium power (13A), dual finishes, and ISO 9001 quality assurance.

Example: With the Pro Model’s 13A power capacity, you can safely handle high-current inverters in electric vehicles. Its dual surface finish ensures both environmental compliance and superior solder joint integrity.

Frequently asked questions

  • Which Program Micro Logic PCB model is best suited for automotive inverter control systems?

  • How do I clean and maintain the connectors on the Program Micro Logic PCB?

  • OSP vs HASL: Which surface finish is better for high-temperature consumer electronics applications?

  • Can the Program Micro Logic PCB be customized with additional connectors for industrial automation?

  • Is the Program Micro Logic PCB RoHS and UL certified for global compliance?

  • What’s the maximum power handling capacity of the Program Micro Logic PCB’s power supply section?

  • Can this PCBA be integrated into smart home devices for signal processing?

  • How does the PCB’s layout ensure reliability in high-frequency communications applications?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Certification ComplianceAutomotive, Medical DevicesIndustry: RoHS ▲ Our Base: RoHS + REACH ▲ Our Advanced: RoHS + REACH + UL (Complies with EU/US safety standards)Advanced meets stricter automotive/medical requirements (UL certification)Higher cost for certifications (UL adds ~15% to production cost)
Surface FinishingConsumer Electronics, IoT DevicesIndustry: HASL (lead-based) ▲ Our Base: HASL (lead-free) ▲ Our Advanced: OSP (lead-free, 0.5μm thickness)OSP enhances solderability and RoHS compliance (reduces environmental impact)OSP has shorter shelf life (6 months vs 12 for HASL)
Power HandlingIndustrial Inverters, Automotive SystemsIndustry: 24V (IEC 60950) ▲ Our Base: 48V ▲ Our Advanced: 60V (Supports up to 60V per IEC 60950)Advanced handles high-voltage applications (e.g., industrial inverters)Requires reinforced insulation, increasing design complexity
Component GradeAerospace, Military ElectronicsIndustry: Commercial (-20°C to 70°C) ▲ Our Base: Industrial (-40°C to 85°C) ▲ Our Advanced: Automotive (-40°C to 125°C)Automotive-grade withstands extreme environments (e.g., engine bays)Automotive-grade components cost ~30% more than commercial equivalents
Thermal ManagementHigh-Power Servers, RoboticsIndustry: Standard layout (1.2°C/W) ▲ Our Base: Thermal vias (0.8°C/W) ▲ Our Advanced: Thermal pads + layout (0.5°C/W)Advanced reduces heat buildup (0.5°C/W improves reliability)Complex manufacturing (requires precise thermal design)
Signal Integrity5G Communication, High-Speed Data SystemsIndustry: ±20% impedance ▲ Our Base: ±10% ▲ Our Advanced: ±5% + EMI shielding (IEC 61000-4-3)Advanced minimizes interference (±5% tolerance reduces crosstalk)EMI shielding adds ~10% to production cost

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