Category | Usage Scenarios | Characteristics | Advantages | Disadvantages |
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Processor Performance | Industrial automation, robotics | Industry: 1.5GHz Quad-core Cortex-A53 (e.g., RK3288) | Our Base: 2.0GHz Dual-core A72 + 1.5GHz Quad-core A53 (▲) | Our Advanced: 2.2GHz Octa-core A76 + NPU (▲▲) |
| | | Adv: Handles multi-tasking (e.g., 4K video + IoT data) | Disadv: Higher power draw vs entry-level SoCs |
| Memory & Storage | Multimedia devices, embedded systems | Industry: 1GB RAM + 8GB eMMC (Class 4) | Our Base: 2GB LPDDR3 (490MB/s) + 16GB eMMC (▲) | Our Advanced: 4GB LPDDR4 (2400MHz) + 32GB UFS (▲▲) |
| | | | Adv: Supports moderate multitasking (e.g., Android 7.1 apps) | Disadv: Cost increases with higher storage |
| Connectivity Options | IoT gateways, smart devices | Industry: USB 2.0 + 1x HDMI | Our Base: USB 3.0 + HDMI 2.0 + microSD (▲) | Our Advanced: USB-C 3.1 + dual HDMI + PCIe expansion (▲▲) |
| | | | Adv: Versatile for data transfer/storage | Disadv: Advanced ports may require custom drivers |
| Power Efficiency | Battery-powered devices, edge computing | Industry: 8W typical power | Our Base: 5W (via RK3399’s big.LITTLE architecture) (▲) | Our Advanced: 4.5W (with NPU for low-power AI tasks) (▲▲) |
| | | | Adv: Longer runtime in portable systems | Disadv: Limited cooling in compact designs |
| Customization | Development boards, prototyping | Industry: Fixed interfaces | Our Base: 10+ expansion headers (▲) | Our Advanced: 20+ customizable GPIO + FPGA compatibility (▲▲) |
| | | | Adv: Easy integration with sensors/actuators | Disadv: Requires advanced soldering skills |
| Durability | Industrial environments, rugged devices | Industry: Standard FR4 PCB | Our Base: MIL-STD-810G certified (▲) | Our Advanced: IP67-rated enclosure + conformal coating (▲▲) |
| | | | Adv: Withstands shock/vibration in factories | Disadv: Advanced versions add bulk/weight |