Refurbished Intel Xeon Ceramic CPU Scrap Gold Recovery Processors/Chips Used Motherboard for Computer Intel Brand

Name: Refurbished Intel Xeon Ceramic CPU Scrap Gold Recovery Processors/Chips Used Motherboard for Computer Intel Brand
Brand: INTERTRADE LIMITED
SKU: 1600794408678_1
Price: 2.00 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Performance Processing: Designed for server and computer applications, these Intel Xeon, Core, and Gold series processors deliver robust computational power for demanding tasks such as data analysis, virtualization, and multitasking.
Gold Recovery & Durability: Features gold-plated pins and ceramic materials, ensuring long-term reliability and efficient heat dissipation, ideal for sustained performance in critical environments.

Key features

1. Material Technology

With ceramic construction and gold-plated pins, ensure durability and reliable electrical connections in demanding environments. ~20% more corrosion-resistant than standard CPUs*

2. Interactive Design

With a traditional square package design, ensure seamless compatibility with standard motherboards and easy installation. Compatible with 90% of desktop motherboards*

3. Performance Parameters

With Intel Xeon multi-core architecture, achieve high-performance computing for server and heavy workloads. Delivers 30% faster processing than consumer-grade CPUs*

4. Scenario Solutions

With server and computer compatibility, handle enterprise-grade tasks and complex applications at a fraction of the cost of new models. Up to 50% cost savings compared to new Intel Xeon CPUs*

5. Certification Standards

With Intel’s rigorous quality standards, ensure reliable performance and longevity even in refurbished condition. Meets original factory specifications*

Product details

Refurbished Intel Xeon Ceramic CPU Scrap Gold Recovery Processors/Chips are high-performance computing solutions designed for servers and computers. These CPUs feature gold-plated pins for corrosion resistance and ceramic substrates for enhanced durability, offering a cost-effective alternative to new processors while maintaining premium performance.

Technical specifications

Feature	Specification	Benefit
Material	Ceramic substrate, gold-plated pins	Superior heat dissipation and corrosion resistance
Processing Type	Intel Xeon/Core/Gold series	Optimized for server-grade and multitasking workloads
Condition	Refurbished (like-new) or new	Reliable performance at a fraction of the cost
Application	Servers, high-performance computing	Ideal for data centers and enterprise systems

Customization guide

Adjustable parameters such as thermal design power (TDP) and memory compatibility can be tailored to meet specific server requirements, ensuring seamless integration into existing infrastructure.

Get inspired

With ceramic substrates and gold-plated pins, these CPUs deliver unmatched reliability for 24/7 server operations. Their Intel Xeon architecture enables efficient multitasking, making them perfect for businesses needing robust computing power without compromising on cost.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Processing Power	2.5 GHz (base)	3.0 GHz (+20%)	3.5 GHz (+40%)
Thermal Design	95W TDP	105W TDP (+10%)	120W TDP (+26%)
Memory Support	DDR4 2400MHz	DDR4 2666MHz	DDR4 3200MHz
Certification	Standard server compliance	Enhanced EMI shielding	MIL-STD-810H ruggedization

Supplier's note

Technical Breakthroughs:
- Ceramic Substrate: Reduces thermal throttling by 30% compared to aluminum-based CPUs.
- Gold-Plated Pins: Ensures 99.9% conductivity retention over 10,000+ connection cycles.
- Xeon Architecture: Delivers 15% faster multi-threaded performance than consumer-grade CPUs.
Version Selection Guide:
- Base Model: Ideal for SMEs needing budget-friendly servers (e.g., email/file servers).
- Advanced Model: Suitable for cloud computing and virtualization with its enhanced cooling and memory bandwidth.
- Pro Model: Designed for enterprise data centers requiring MIL-STD ruggedization and extreme multitasking (e.g., AI workloads).

With the Pro Model’s 3.5 GHz clock speed and 120W TDP, you can handle high-load applications like real-time analytics while maintaining stability. The Advanced Model’s DDR4 2666MHz support ensures seamless integration with modern server racks, while the Base Model offers a 40% cost reduction over new units without sacrificing core performance.

Frequently asked questions

Which Intel Xeon CPU model is best for server environments?
How to clean gold-plated CPU pins on refurbished Intel processors?
Ceramic vs Plastic: Which material ensures better heat dissipation in CPUs?
Are refurbished Intel Xeon CPUs compatible with modern motherboards?
Is the Intel Xeon CPU compliant with industry standards?
What’s the difference between refurbished and new Intel Xeon CPUs?
What applications are best suited for Intel Core Gold processors?
How does ceramic material improve durability in Intel CPUs?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Server CPUs (Intel Xeon)	Data centers, enterprise computing	Ceramic substrate (ASTM E1461 ▲), 20+ cores (ISO/IEC 2335 ▲ industry avg:16 cores)	High reliability (gold-plated pins ▲), multi-threaded workloads supported	High power consumption (45-200W ▲ industry avg:35W), costly cooling requirements
Desktop CPUs (Intel Core)	Home computers, gaming	4-12 cores (ISO/IEC 2335), aluminum heatspreader (ASTM B209)	Balanced performance/cost ratio, widespread compatibility	Limited scalability for servers, lower core count than workstation CPUs
Mobile CPUs (Intel Core i7)	Laptops, notebooks	TDP 15-45W (JEDEC JESD51-2 ▲ industry avg:28W), integrated graphics (ISO/IEC 24734)	Power-efficient (ideal for portability), compact design	Reduced performance vs desktop CPUs, thermal throttling in heavy workloads
Workstation CPUs (Intel Xeon W-series)	Professional workstations	ECC memory support (ISO/IEC 17468 ▲), 18 cores (ISO/IEC 2335)	Error correction (critical for precision tasks), thread-optimized architecture	Expensive, requires specialized cooling systems
Low-Power CPUs (Intel Celeron)	Entry-level devices, IoT	TDP <10W (JEDEC JESD51-2), 2 cores (ISO/IEC 2335)	Ultra-low power consumption (ideal for IoT), cost-effective	Underpowered for modern applications, limited multi-tasking
High-Performance Gaming CPUs (Intel Core i9)	Gaming, content creation	Turbo boost up to 5.0GHz (JEDEC JEP106 ▲ industry avg:4.8GHz), 16 cores	Peak single-threaded performance, superior multi-tasking	High heat output (requires liquid cooling), power-hungry