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  • Remove & Repair Machine for Motherboard BGA IC Chip Components
  • Remove & Repair Machine for Motherboard BGA IC Chip Components
  • Remove & Repair Machine for Motherboard BGA IC Chip Components
  • Remove & Repair Machine for Motherboard BGA IC Chip Components
Remove & Repair Machine for Motherboard BGA IC Chip Components

Remove & Repair Machine for Motherboard BGA IC Chip Components

  • >= 1 Sets
    $19,800.10
View product details

Remove & Repair Machine for Motherboard BGA IC Chip Components

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Removal & Repair: Designed to safely remove and rework BGA (Ball Grid Array) IC chips on motherboards using advanced thermal and mechanical systems. Equipped with a high-resolution camera and robotic arm for microscopic-level accuracy.
  • Versatile Operation: Operates at 220V, supporting both delicate component handling and robust repair processes in controlled environments. The adjustable worktable and integrated lighting ensure adaptability for varying component sizes and inspection needs.

Key features

  • 1. Material Technology

    • With a robust metal and precision-engineered plastic construction, ensure long-lasting durability in industrial environments. The corrosion-resistant materials outlast conventional plastic-only models by 40%*, providing reliable performance for heavy-duty use.

  • 2. Interactive Design

    • With an intuitive touchscreen interface and programmable presets, streamline complex BGA chip repair processes. Reduce setup time by up to 50%* compared to manual configurations, enabling quick adjustments for diverse repair scenarios.

  • 3. Performance Parameters

    • With micron-level precision robotic arms and a high-resolution camera, achieve accurate component placement and defect detection. Minimize errors by 30%* compared to manual handling, ensuring consistent quality in sensitive electronics repair.

  • 4. Scenario Solutions

    • With an adjustable worktable and integrated lighting, adapt to components of varying sizes and provide clear visibility for precise inspections. Enhance workflow efficiency by 25%* in both repair shops and manufacturing lines by accommodating diverse tasks.

  • 5. Certification Standards

    • Constructed to meet international industrial safety and precision standards, ensuring reliable operation in electronics manufacturing and repair environments. Designed for compatibility with global quality control protocols for sensitive electronic components.

Product details

Remove & Repair Machine for Motherboard BGA IC Chip Components

The Remove & Repair Machine for Motherboard BGA IC Chip Components is a high-precision industrial tool designed for electronics and semiconductor manufacturing. Built with durable metal and plastic components, it combines advanced automation, a robotic arm, and a high-resolution camera to enable precise handling, inspection, and repair of delicate BGA IC chips. With a 220V power supply and an adjustable worktable, it ensures flexibility for diverse motherboard repair tasks.

Technical specifications

FeatureSpecificationBenefit
Material ConstructionRobust metal frame with corrosion-resistant plastic componentsEnsures durability in controlled industrial environments.
Control PanelTouchscreen interface with programmable settingsEnables precise adjustments for automated workflows.
Robotic Arm6-axis precision manipulator with ±0.01mm accuracyDelivers micro-level precision for BGA chip placement and repair.
High-Resolution Camera4K microscope with 50x magnificationInspects components at microscopic levels for defect detection.
WorktableAdjustable surface with LED illumination (brightness: 500–1500 lux)Accommodates various component sizes and enhances visibility during tasks.
Power Supply220V, 50/60HzCompatible with global industrial power standards.

Customization guide

Adjustable parameters include:

  • Worktable dimensions (up to 500x500mm) to fit different motherboard sizes.
  • Camera resolution (up to 8K) for specialized inspection needs.
  • Robotic arm programming (customizable motion paths) to match specific repair workflows.

Get inspired

Optimize your electronics manufacturing process with this machine’s precision engineering. Whether repairing damaged BGA chips, assembling delicate components, or conducting quality inspections, its advanced automation and microscopic accuracy ensure reliability in high-stakes production environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Precision (Accuracy)±0.05mm±0.02mm (+60%)±0.01mm (+100%)*
Processing Speed10 components/hour20 components/hour30 components/hour (+200%)
Automation LevelSemi-automatedFully automatedAI-assisted automation
Camera Resolution1080p4K8K (+100% clarity)

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s ±0.01mm robotic arm precision exceeds industry standards by 50%, enabling repairs on ultra-fine BGA chips.
    • The 8K camera provides 4x higher resolution than competitors, detecting defects invisible to standard systems.
    • AI-assisted automation in the Pro Model reduces human error by 30%, streamlining high-volume semiconductor production.

  2. Optimal Version Selection:

    • Base Model: Ideal for small workshops or R&D labs requiring basic BGA repair capabilities.
    • Advanced Model: Suitable for mid-tier electronics manufacturers needing faster processing (20 components/hour) and 4K inspection.
    • Pro Model: Best for semiconductor factories or high-volume production lines demanding AI-driven precision and 8K clarity. With its tripled accuracy over industry benchmarks, the Pro Model ensures flawless repairs on 0.5mm pitch BGA chips—a critical feature for advanced electronics assembly.

Frequently asked questions

  • Which Remove & Repair Machine model suits small electronics repair shops for BGA IC chips?

  • How to clean the high-resolution camera lens on the motherboard repair machine?

  • Can the Remove & Repair Machine handle various BGA IC chip sizes and types?

  • Is the motherboard BGA repair machine compatible with 220V power supply for global use?

  • What’s the precision level of the robotic arm in the motherboard repair machine?

  • Does the machine support automated workflows for high-volume BGA repair tasks?

  • How does the machine ensure static-free handling of delicate motherboard components?

  • Can I customize the repair parameters for specific BGA IC chip models?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Manual BGA Repair Stations (Industry Standard)Small workshops, basic repairsManual operation (no automation), basic tools, 220V compatibilityLow cost, simple to useHigh human error risk, slower, limited precision
Semi-Automated BGA Repair Machines (Our Base)Medium-scale productionBasic automation ▲, adjustable worktable, 220V, 720p camera (ISO 13399 compliant)Faster than manual, reduces errorsRequires operator input, moderate precision
Fully Automated BGA Repair Systems (Our Advanced)High-volume manufacturingFull automation ▲▲, 4K camera (10MP, ASTM E1351 compliant), robotic arm ±0.01mm (ISO 230-2)Highest precision, fastest, minimal human interventionHigh cost, complex setup
High-Precision Inspection MachinesQuality control labs10MP camera (ASTM E1351 compliant), non-contact inspection, 43 dBA (quieter than refrigerator hum)Detailed analysis without damage, noise reductionCannot perform repairs, limited functionality
Thermal Desoldering ToolsComponent removal tasksTemperature control up to 500°C (IEC 60695-2-11 compliant), safety locksEffective desoldering, protects componentsRisk of overheating, requires skill
Robotic Assembly SystemsMass production assembly linesProgrammable robots ▲▲, high-speed (ISO 9283 compliant), repetitive precisionConsistent output, high throughputExpensive, needs expert programming

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