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  • Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply
  • Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply
  • Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply
  • Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply
  • Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply
Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply

Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply

  • 2 - 999 Pieces
    $10
  • 1000 - 9999 Pieces
    $5
  • >= 10000 Pieces
    $1

Customization:

Customized logo(Min.Order: 1000 pieces)
Customized packaging(Min.Order: 1000 pieces)
Graphic customization(Min.Order: 1000 pieces)

Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Processing: Equipped with the Rockchip RK3568J chip, enabling advanced multimedia applications, AI processing, 4K video playback, and high-definition graphics.
  • Modular Connectivity: Features multiple connectors and headers for seamless integration into diverse systems, supporting both internal component linking and external device expansion.

Key features

  • 1. Advanced Material Technology

  • With FR-4 substrate material, ensure durable and thermally stable performance in high-demand environments*.

  • 2. Modular Interactive Design

  • With multiple connectors and headers, easily integrate and customize the board for diverse applications like smartphones or embedded systems*.

  • 3. High-Performance Processing

  • With the Rockchip RK3568J chip, achieve seamless 4K video playback, AI processing, and advanced graphics capabilities*.

  • 4. Versatile Scenario Solutions

  • Designed for scenarios ranging from consumer electronics (smartphones/tablets) to industrial embedded systems, offering unmatched adaptability*.

  • 5. Compliance with Industry Standards

  • Meets rigorous safety and quality certifications, ensuring reliability and environmental compliance*.

Product details

Rockchip RK3568 Chip Core Board PCB Assembly and PCBA Motherboard Supply

The Rockchip RK3568 Chip Core Board PCB Assembly is a high-performance electronic motherboard designed for multimedia and embedded systems. Built with FR-4 material and Surface Mount Technology (SMT), it offers robust durability, efficient connectivity, and customizable functionality.

Technical specifications

FeatureSpecificationBenefit
ProcessorRockchip RK3568JSupports AI processing, 4K video, and HD graphics
MaterialFR-4 epoxy laminateHigh thermal stability and mechanical strength
ConnectivityMultiple headers/USB portsFlexible integration with peripherals
TechnologySurface Mount Technology (SMT)Compact design and enhanced signal integrity
CertificationRoHS-compliantEnsures environmental and safety standards

Customization guide

Adjustable parameters include component placement density, connector types, and chip configuration to meet specialized requirements such as IoT device integration or industrial automation.

Get inspired

Optimize your embedded system with this versatile PCB. Whether you need a compact design for a tablet or high-performance processing for smart devices, the RK3568J core delivers reliability and scalability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Power1.5GHz quad-core+15% (1.7GHz)+30% (2.0GHz)*
Thermal DissipationStandard FR-4Enhanced thermal padsPremium aluminum heatsink
Memory Support2GB DDR44GB DDR48GB LPDDR4X
ConnectivityUSB 2.0, GPIOUSB 3.0, PCIeUSB 3.2, Gigabit Ethernet

Supplier's note

  1. Three Breakthroughs:

    • AI-Ready Chip: The RK3568J’s neural processing unit enables real-time AI tasks like facial recognition.
    • SMT Efficiency: 20% smaller footprint than through-hole designs, ideal for space-constrained devices.
    • FR-4 Durability: Withstands temperatures up to 140°C, outperforming standard PCB materials.
  2. Version Selection Guide:

    • Base Model: Ideal for basic IoT devices or entry-level embedded systems needing cost-effective performance.
    • Advanced Model: Perfect for multimedia applications requiring faster data transfer (e.g., 4K streaming devices) with PCIe support.
    • Pro Model: Designed for industrial automation or edge computing, leveraging 8GB memory and Gigabit Ethernet for heavy workloads.

With the Pro Model’s enhanced thermal management, you can sustain high-performance tasks in harsh environments. Pair its LPDDR4X memory with the RK3568J’s AI capabilities to create smart devices that outperform industry benchmarks.

Note: Comparative values are relative to the Base Model’s specifications.

Frequently asked questions

  • Which Rockchip RK3568J PCB assembly is best suited for embedded systems applications?

  • How do I clean and maintain the PCB assembly to ensure longevity?

  • Why is FR-4 material preferred for this PCB assembly over alternatives like aluminum?

  • Can the Rockchip RK3568J board be customized for specific connectivity needs?

  • Is this PCB assembly RoHS and CE certified for compliance?

  • What applications are ideal for the Rockchip RK3568J-based PCB motherboard?

  • Does the PCB support simultaneous 4K video output and USB-C connectivity?

  • How does Surface Mount Technology (SMT) benefit this PCB assembly’s design?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processor PerformanceSmart devices, embedded systemsRockchip RK3568J (1.8GHz quad-core ARM Cortex-A55) ▲▲
Industry: Allwinner H6 (1.8GHz dual-core)
▲▲ Advanced: Overclocked to 2.0GHz (Benchmark: 15% faster AI tasks)
Industry: Basic multimedia support
Industry: Limited multi-tasking ▲ Base: Standard clock speed ▲▲ Advanced: Higher power draw
Material DurabilityIndustrial IoT, rugged devicesFR-4 with 1.6mm thickness (IEC 61249-2-8) ▲▲
Industry: 1.2mm FR-4
▲▲ Advanced: Flame retardant (UL 94 V-0) + shock resistance (MIL-STD-810G)Industry: Prone to warping ▲ Base: Thinner for cost ▲▲ Advanced: Heavier
Connectivity OptionsNetworking hubs, IoT gateways4x USB 3.0, 2x Gigabit Ethernet ▲▲
Industry: 2x USB 2.0 + 1x Ethernet
▲▲ Advanced: PCIe 3.0 expansion slot (Supports 5G modules)Industry: Limited scalability ▲ Base: Standard ports ▲▲ Advanced: Complex setup
Thermal ManagementHigh-load servers, edge computingPassive cooling (Max 65°C) ▲
Industry: No dedicated cooling
Base: Heat sinks (80°C threshold)
▲▲ Advanced: Active fan + thermal paste (50°C sustained)
Industry: Overheating risks ▲ Base: Moderate noise ▲▲ Advanced: Adds 5% power use
CertificationsMedical devices, aerospaceRoHS compliant ▲
Industry: No formal certifications
▲▲ Advanced: ISO 9001 + MIL-STD-202G (vibration/shock)Industry: Higher rejection rates ▲ Base: Basic compliance ▲▲ Advanced: Costly
Noise LevelHome automation, office devices38 dBA (Quiet fan mode) ▲▲
Industry: 52 dBA (Noisy fans)
▲▲ Advanced: Silent operation (32 dBA, < whisper)Industry: Audible in quiet spaces ▲ Base: Moderate ▲▲ Advanced: Requires premium fan

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.