Packaging Type | Compatibility with standard circuit boards | DIP package (Industry: basic; Base: silicone cover ▲; Advanced: silicone + anti-static ▲▲) | Industry-standard form factor ensures compatibility; silicone cover protects from dust (Base); anti-static coating prevents ESD (Advanced) | Bulkier than SMD packages; anti-static coating adds cost. |
Pin Material & Plating | High-conductivity or corrosive environments | Industry: Tin-plated (ASTM B209); Base: Gold-plated (1.5μm ▲); Advanced: Gold-plated (3μm ▲▲) | Gold improves conductivity/corrosion resistance over tin; thicker plating extends lifespan | Higher cost for gold plating. |
Environmental Protection | Industrial/outdoor use with dust/moisture | Industry: No cover; Base: IP54 silicone cover ▲; Advanced: IP67 silicone cover ▲▲ | IP54 protects against dust/drips; IP67 withstands immersion (1m for 30min) | Cover adds bulk; IP67 requires rigorous testing. |
Custom Labeling | Inventory management/branding needs | Industry: Basic part numbers; Base: Customizable labels (part/serial ▲); Advanced: UV-resistant labels ▲▲ | Easier tracking; UV resistance maintains label readability outdoors | Customization may delay production. |
Durability & Reliability | High-cycle applications (frequent use) | Industry: 500 insertion cycles; Base: 1000 cycles ▲; Advanced: 2000 cycles ▲▲ | Longer lifespan reduces replacements; Advanced doubles Base’s durability | Higher cost for advanced versions. |
Pin Configuration & Spacing | Compatibility with sockets/PCB layouts | Industry: 8 pins at 0.1" spacing (IPC-7351); Base: Reinforced pins ▲; Advanced: Stress-relief coating ▲▲ | Industry-standard spacing ensures compatibility; reinforced pins prevent bending | Reinforced pins may need specific sockets; coating adds cost. |