All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier

SC100203CFBE New Original Electronic Components Integrated Circuits

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Density Mounting: Designed for space-constrained electronic devices, the SC100203CFBE integrated circuit utilizes a quad flat no-lead (QFN) package for efficient heat dissipation and reliable assembly.
  • ARM Cortex-A9 Core Processor: This device features an ARM Cortex-A9 core, providing robust processing capabilities for various applications.

Key features

  • 1. Advanced Material Technology

  • With a black plastic body and tin-lead alloy leads, this IC ensures robust soldering and reliable performance in electronic assemblies.

  • 2. Interactive Design for High-Density Applications

  • With a quad flat no-lead (QFN) package, you can achieve high-density mounting, ideal for compact electronic device designs.

  • 3. Superior Performance Parameters

  • With the ARM Cortex-A9 core processor, expect efficient processing capabilities, suitable for various computational tasks.

  • 4. Versatile Scenario Solutions

  • With its QFN package design, you can easily integrate this IC into space-constrained applications, providing efficient heat dissipation and reliability.

  • 5. Certification Standards Assurance

  • With this product, you can rely on its manufacturing codes and batch identifiers for consistent quality and traceability, ensuring compliance with industry standards.*

Product details

SC100203CFBE New Original Electronic Components Integrated Circuits

The SC100203CFBE is a new original electronic component in the form of an integrated circuit with a quad flat no-lead (QFN) package. This microcontroller is part of the ARM Cortex-A9 series, well-suited for high-density mounting in electronic devices due to its compact design and reliable performance.

Technical specifications

FeatureSpecificationBenefit
Package TypeQFNHigh-density mounting, space efficiency
MaterialBlack plastic, tin-lead alloyDurable, reliable soldering
Core ProcessorARM Cortex-A9Enhanced processing power and efficiency
MarkingsSC100203, CFBE, 1M25D, CTAH1307Identification and configuration

Customization guide

Adjustable parameters include memory size configurations to meet specific application needs, ensuring optimal performance in diverse scenarios.

Get inspired

With the SC100203CFBE, you can achieve efficient heat dissipation and seamless integration into PCB designs, ideal for space-constrained applications.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing SpeedStandard+15%+30%*
Memory CapacityBasicEnhancedPremium

Supplier's note

The Pro version's processing speed, which is 30% faster than industry benchmarks, enables superior performance in data-intensive applications. When paired with its advanced memory capacity, this creates a robust solution for complex computing tasks. For users needing high efficiency in compact spaces, the Pro model is the optimal choice, offering unparalleled reliability and performance.

Frequently asked questions

  • Which microcontroller model suits space-constrained electronic devices?

  • How to ensure proper maintenance of the SC100203CFBE integrated circuit?

  • What are the benefits of using a QFN package in electronic components?

  • Can the SC100203CFBE be customized for specific electronic applications?

  • Is the SC100203CFBE IC material suitable for high-reliability applications?

  • Can I get custom configurations for the SC100203CFBE integrated circuit?

  • Is the SC100203CFBE integrated circuit suitable for high-density mounting?

  • What makes the SC100203CFBE a unique choice for electronic devices?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
MicrocontrollersEmbedded systems in automationARM Cortex-A9 core (efficient processing power)Low power consumptionLimited memory size compared to FPGAs
Integrated CircuitsHigh-density electronic devicesQFN package (compact and lead-free)Efficient heat dissipationComplex assembly process
ProcessorsGeneral computing tasksARM architecture (versatile and scalable)High performanceMay require additional cooling solutions
FPGACustom hardware logic designsReprogrammable logic gates (flexibility)Rapid prototypingHigher cost and power consumption
Memory ComponentsData storage solutionsFlash memory (non-volatile storage)Retains data without powerSlower write speeds compared to RAM
Power Management ICsBattery-operated devicesVoltage regulators (stable power supply)Extends battery lifeLimited to specific voltage ranges

Related searches

The Product Description is generated by third-party, and Alibaba.com is not liable for any risks related to inaccuracies or the infringement of third-party rights.

The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.