SC13MB C13S210057 Maintenance Box Chip for Epson SureColor F500 F570 F571 T2100 T3100 T5100 T2150 T3150 T3170 T5170 Printer Chip

Technical specifications

Customization guide

Adjustable parameters such as contact layout spacing or material thickness can be tailored to meet specialized requirements for non-standard printer models or custom ink systems.

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Elevate your printing workflow with a chip that combines rugged durability and precision engineering. Whether you need to handle high-volume print runs or maintain consistent ink flow, this chip ensures reliability without compromising performance.

Choose your model

Supplier's note

1. Technical Breakthroughs:

   • Gold-plated contacts: Provide 20% lower resistance than standard nickel plating, ensuring stable high-speed printing.
   • FR4 substrate: Withstands 30% more thermal stress compared to standard PCB materials.
   • Custom firmware compatibility: Supports real-time ink-level monitoring for Epson’s advanced print heads.

2. Version Selection Guidance:

   • Base Model: Ideal for small-scale users needing cost-effective maintenance for standard workloads.
   • Advanced Model: Targets medium-volume operations requiring extended temperature resilience (e.g., industrial workshops).
   • Pro Model: Engineered for heavy-duty environments (e.g., outdoor signage production) with extreme temperature or dust exposure.

With the Pro Model’s MIL-STD certification, you can operate reliably in harsh conditions while maintaining Epson’s print quality standards. The Advanced Model’s IP54 rating ensures dust/water resistance for workshop use, while the Base Model offers a streamlined solution for home or office setups.

Note: Comparative values are based on industry benchmarks for similar Epson-compatible chips.