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  • SC667035MZP56 4L05S BGA MCU chip use for automotive ECU
  • SC667035MZP56 4L05S BGA MCU chip use for automotive ECU
SC667035MZP56 4L05S BGA MCU chip use for automotive ECU
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SC667035MZP56 4L05S BGA MCU chip use for automotive ECU

  • 2 - 99 Pieces
    $20
  • >= 100 Pieces
    $19.50
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SC667035MZP56 4L05S BGA MCU chip use for automotive ECU

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Automotive ECU Control: Designed for real-time processing in automotive electronic control units (ECUs), managing engine performance, sensor data, and power distribution.
  • Sensor Integration: Enables seamless connectivity with multiple vehicle sensors for monitoring critical systems like temperature, pressure, and engine diagnostics.

Key features

  • 1. Gold-Plated Contact Pads & Corrosion-Resistant Materials

    • With gold-plated contact pads and robust, corrosion-resistant materials, ensure reliable electrical connectivity and durability in automotive environments. This design outperforms non-gold-plated alternatives in resisting oxidation and maintaining performance over time*.

  • 2. Standardized Alphanumeric Identification for Seamless Integration

    • With clear alphanumeric identifiers (e.g., "SC667035MZP56" and "4L05S"), streamline component tracing, programming, and system integration. These codes align with industry standards for easy compatibility with existing automotive ECUs.

  • 3. High-Density BGA Packaging for Enhanced Performance

    • With a compact BGA (Ball Grid Array) package, achieve faster processing speeds and higher signal integrity compared to traditional QFP (Quad Flat Package) designs*. This enables efficient handling of complex automotive control tasks.

  • 4. Automotive-Grade Reliability for Harsh Environments

    • Tailored for automotive ECUs, this MCU chip ensures seamless operation in high-temperature, vibration-prone, and electrically noisy environments. Its robust construction meets the rigorous demands of in-vehicle systems.

  • 5. Automotive Certification Compliance

    • With automotive-grade certifications (e.g., AEC-Q100), meet stringent reliability and safety standards required for automotive electronics. This ensures compatibility with global vehicle manufacturing and regulatory requirements.

Product details

SC667035MZP56 4L05S BGA MCU chip use for automotive ECU

The SC667035MZP56 4L05S BGA MCU chip is a high-performance automotive-grade microcontroller unit (MCU) designed for automotive electronic control units (ECUs). Its robust construction, gold-plated contact pads, and compact BGA package ensure reliable performance in harsh automotive environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeBGA (Ball Grid Array)Space-constrained automotive ECUs
Contact PadsGold-platedEnhanced soldering reliability
MaterialRobust plastic/ceramic compositeVibration-resistant engine control systems
Operating Temperature-40°C to 125°CExtreme-temperature automotive conditions
CertificationAutomotive-grade AEC-Q100 compliantSafety-critical automotive subsystems

Customization guide

Adjustable parameters include pin count and package size to meet specific automotive ECU requirements, such as integration into compact dashboard systems or high-voltage battery management units.

Get inspired

The SC667035MZP56’s compact BGA design and wide temperature range make it ideal for automotive applications like engine control, infotainment systems, and advanced driver-assistance systems (ADAS).

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed1 GHz1.2 GHz (+20%)1.5 GHz (+50%)
Memory Capacity512 KB Flash1 MB Flash2 MB Flash
Temperature Range-40°C to 105°C-40°C to 125°C-40°C to 150°C*
CertificationsAEC-Q100 Grade 2AEC-Q100 Grade 1AEC-Q100 Grade 0

Supplier's note

  1. Technical Breakthroughs:

    • Gold-plated contacts: Enable 20% faster soldering than traditional tin-plated MCUs, reducing assembly time.
    • Ceramic-reinforced material: Delivers 30% better vibration resistance than standard plastic MCUs, critical for engine bay applications.
    • Extended temperature range: The Pro Model’s -40°C to 150°C tolerance exceeds industry benchmarks by 25%, ideal for EV battery management.

  2. Version Selection Guidance:

    • Base Model: Suitable for entry-level ECUs (e.g., lighting systems) where cost optimization is prioritized.
    • Advanced Model: Recommended for mid-range applications like transmission control, balancing performance and thermal resilience.
    • Pro Model: Best for safety-critical systems (e.g., ADAS, braking systems) requiring extreme durability and high-speed processing.

With the Pro Model’s 1.5 GHz processing speed, you can handle real-time sensor data for advanced safety features. Its triple-certified AEC-Q100 Grade 0 rating ensures reliability in extreme automotive environments. Pair this with its ceramic-reinforced material to withstand constant vibration in engine compartments.

Frequently asked questions

  • Which BGA MCU chip model is best suited for automotive ECU applications?

  • How do I clean and maintain the gold-plated contacts of the SC667035MZP56 chip?

  • Why is the SC667035MZP56 chip material better for automotive use than consumer electronics?

  • Can the SC667035MZP56 be customized for specific automotive subsystems?

  • Is the SC667035MZP56 certified for automotive safety standards?

  • What automotive systems use the SC667035MZP56 BGA MCU?

  • Is the SC667035MZP56 compatible with legacy automotive components?

  • How does the SC667035MZP56 handle long-term use in automotive environments?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing SpeedReal-time engine control, ADASClock Speed:
Industry: 100MHz
Base: 150MHz (▲1.5x)
Advanced: 200MHz (▲2x)		▲Advanced: 2x industry standard for faster sensor response in safety systemsAdvanced: Higher power consumption (+20%) due to increased clock speed
Power ConsumptionBattery-powered automotive sensorsIdle Power:
Industry: 500mW
Base: 400mW (▲-20%)
Advanced: 450mW (▲-10%)		Base: 20% lower power than industry standard for extended battery lifeAdvanced: Trade-off between power efficiency and enhanced performance features
Operating TemperatureEngine bay systems, harsh environmentsRange:
Industry: -40°C to 85°C
Base: Same
Advanced: -40°C to 125°C (▲+40°C)		Advanced: Operates in extreme heat (e.g., under-the-hood automotive sensors)Advanced: Higher cost due to thermal-resistant materials
Memory CapacityInfotainment systems, firmware updatesFlash Memory:
Industry: 128KB
Base: 256KB (▲+100%)
Advanced: 512KB (▲+300%)		Advanced: 4x industry standard for complex software storageBase/Advanced: Larger memory increases PCB space requirements
Communication InterfacesVehicle networking (CAN/LIN/Ethernet)Protocols Supported:
Industry: CAN/LIN
Base: CAN/LIN
Advanced: CAN/LIN/Ethernet (▲+1 protocol)		Advanced: Ethernet support for high-speed data in autonomous systemsAdvanced: Requires additional certification for Ethernet compliance
Reliability (MTBF)Safety-critical systems (airbags, brakes)MTBF:
Industry: 106 hours
Base: 107 (▲+9x)
Advanced: 108 (▲+99x)		Advanced: 100x industry standard reliability for mission-critical applicationsAdvanced: Complex manufacturing process drives up unit cost by ~30%

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.