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  • SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit
  • SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit
  • SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit
  • SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit
  • SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit
  • SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit
SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit

SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit

  • 1 - 99 Pieces
    $0.50
  • >= 100 Pieces
    $0.40
View product details

SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuits: Designed for seamless integration into electronic circuits, providing essential processing and control functions.
  • Surface-Mount Design: Engineered for high-density board layouts, maximizing space efficiency in electronic assemblies.

Key features

  • 1. Advanced Material Technology

    • With a robust black plastic body and sturdy metal leads, ensure enhanced protection and reliable insulation for your circuit components.

  • 2. Interactive Design for High-Density Layouts

    • With a 16-Pin LCC package, achieve seamless surface mounting on PCBs, optimizing space for high-density electronic assemblies.

  • 3. Superior Performance Parameters

    • With compatibility for Surface Mount Technology (SMT), streamline your assembly process while minimizing handling damage risk.

  • 4. Versatile Scenario Solutions

    • With its adaptable design, utilize these IC chips across diverse applications, from consumer electronics to industrial systems, ensuring reliability in compact spaces.

  • 5. Customization and Certification Standards

    • With customizable white square labels, effectively manage chip identification and functionality tracking, subject to the manufacturer's specifications.

Product details

SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G& SDTNQGAMA-008G& IC chip integrated circuit

The SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G & SDTNQGAMA-008G integrated circuit (IC) chips are designed for high-density electronic applications. Encased in a durable black plastic body, these chips feature a 16-pin leaded chip carrier (LCC) package, providing reliable performance and ease of assembly in various circuit board designs.

Technical specifications

FeatureSpecificationBenefit
MaterialBlack Plastic BodyInsulation and Protection for Internal Components
Pin Configuration16-Pin LCCSuitable for High-Density Board Layouts
Connection TypeMetal LeadsSecure Electrical Connections

Customization guide

With the LCC package, you can customize the top surface with labels for easy identification and function tracking, meeting specific project requirements.

Get inspired

Explore the potential of the SDS SDP SDO SDM SDL SDZ SE3 SEA SDTNRGAMA-008G & SDTNQGAMA-008G chips in your next project. Their compact design and robust construction make them ideal for both consumer and industrial electronics.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Density SupportStandard+15%+30%*
VersatilityBasicEnhancedPremium

Supplier's note

The introduction of the 16-pin LCC package has revolutionized chip integration, enabling triple the density of traditional models. With its robust plastic body, the Pro version's enhanced versatility allows for seamless integration in high-demand scenarios. When paired with its compact design, this creates unparalleled reliability and efficiency for users in both consumer electronics and industrial applications. Choose the Pro model for projects requiring maximum density and reliability, while the Base model suits standard applications.

Frequently asked questions

  • Which IC chip model is best suited for high-density electronic board layouts?

  • How do I ensure proper maintenance and care for integrated circuit chips?

  • What are the advantages of using the LCC package in integrated circuits over other materials?

  • Can I get custom labeling or markings on the IC chips for identification?

  • Are these IC chips suitable for consumer electronics applications?

  • Is the plastic body of the IC chip resistant to environmental factors?

  • What technical validations ensure the reliability of these IC chips in industrial systems?

  • How does the surface mount technology (SMT) compatibility benefit the assembly process of these IC chips?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Integrated CircuitsConsumer Electronics16-Pin LCC Package (compact design)High-density assembly (saves PCB space)Complex repair process (requires specialized equipment)
Integrated CircuitsIndustrial Control SystemsPlastic Body (durable and insulated)Reliable in harsh environments (temperature-resistant)Limited to surface mount applications (not suitable for through-hole)
Integrated CircuitsHigh-Density PCB LayoutsMetal Leads (secure electrical connection)Versatile application (compatible with various devices)Potential for lead oxidation (requires careful handling)
Integrated CircuitsCustom Electronics ProjectsCustom Labels (identification flexibility)Easy identification (customizable labels)Risk of mislabeling (requires accurate labeling process)
Integrated CircuitsSpace-Constrained DesignsSurface Mount Technology (efficient assembly)Reduces handling damage (less manual intervention)Initial setup cost (requires SMT equipment)
Integrated CircuitsVersatile Electronic ApplicationsVersatility (wide application range)Suitable for multiple uses (consumer to industrial)Limited pin count (may require additional components for complex circuits)

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