SML Group Customized Thermal Conductivity CVD Diamond Plate for Heat Sink Spreader

Technical specifications

Customization guide

Adjustable parameters:

• Grit/Particle Size: Customize diamond particle distribution for optimized thermal and mechanical performance in specialized applications.
• Thickness: Tailor plate thickness (0.5–5 mm) to match heat sink geometry and thermal load requirements.

Get inspired

With its ultra-high thermal conductivity and customizable design, the CVD Diamond Plate enables engineers to tackle demanding thermal challenges. Ideal for next-gen power electronics, laser systems, or high-frequency RF components where compact size and efficient heat spreading are critical.

Choose your model

Supplier's note

1. Technical Breakthroughs:

   • Thermal Conductivity: The Pro Model’s 2400 W/m·K exceeds industry benchmarks by 20%, enabling safe operation in extreme thermal environments.
   • Thickness Flexibility: Adjustable up to 10 mm accommodates thick heat sinks in industrial machinery.
   • Surface Precision: Mirror finish in the Pro Model reduces contact thermal resistance by 30%, ideal for high-power laser diodes.

2. Optimal Version Selection:

   • Base Model: Suitable for standard electronics (e.g., consumer GPUs) where cost-efficiency is prioritized.
   • Advanced Model: Targets high-performance servers and automotive systems requiring enhanced thermal margins.
   • Pro Model: Designed for aerospace and defense applications, where triple the industry-standard chemical resistance (e.g., against corrosive coolants) and ultra-low thermal resistance are critical.

Example: With the Pro Model’s 2400 W/m·K thermal conductivity, you can achieve 40% faster heat dissipation in satellite electronics, paired with its mirror finish to ensure minimal thermal bottlenecks in cryogenic environments.