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  • SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic
  • SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic
  • SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic
  • SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic
  • SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic
  • SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic
SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic

SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Standard Integrated Circuit (IC) Functionality: Designed for signal processing, power management, and control systems in electronic devices.
  • DIP8 Packaging: A dual in-line package with eight pins, enabling easy integration into circuit boards for prototyping, industrial, and consumer applications.

Key features

  • 1. Durable Corrosion-Resistant Metal Leads

    • With corrosion-resistant metal leads, you can ensure long-term reliability in harsh environments, outperforming chips with less durable materials*.

  • 2. User-Friendly DIP8 Packaging

    • With the DIP8 package design, you can easily integrate the chip into standard circuit boards and handle it manually, unlike complex surface-mount alternatives*.

  • 3. Broad Compatibility for Standard Applications

    • With compatibility across standard systems, you can deploy the chip in diverse scenarios like signal processing and power management, surpassing niche-use ICs*.

  • 4. Adaptable for Both Consumer and Industrial Use

    • With its adaptable functionality, you can use the chip in consumer electronics or industrial equipment, offering flexibility unmatched by specialized ICs*.

  • 5. Manufacturing Compliance with Industry Standards

    • Certified to meet industry standards for reliability and safety*, you can trust its quality for critical applications.

Product details

SN29850P DIP8 new OriginalBOM Inventory Supporting Service SN29850P Chip ic

The SN29850P DIP8 IC is a standard integrated circuit designed for versatile electronic applications, featuring an 8-pin DIP package for easy integration into circuit boards. Crafted from high-quality silicon and metal leads, this chip ensures reliable performance in signal processing, power management, and control systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP8 (Dual In-line Package)Easy handling and compatibility with PCBs
MaterialSilicon core with tin/nickel leadsEnhanced conductivity and durability
Operating Voltage3.3V to 5VBroad application flexibility
Temperature Range-40°C to +85°CReliable operation in diverse environments
CertificationRoHS-compliantMeets global environmental safety standards

Customization guide

Adjustable parameters include pin configuration and material composition to meet specialized requirements (e.g., higher thermal resistance for industrial use).

Get inspired

With its DIP8 form factor and standard specifications, the SN29850P simplifies prototyping and mass production. Ideal for hobbyists and engineers building circuits for consumer electronics, IoT devices, or automotive systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal PerformanceStandard cooling+15% heat dissipation+30% enhanced*
Power Efficiency85% efficiencyLow-power mode95% peak efficiency
Chemical ResistanceBasic ratingIndustrial-gradeTriple-industry**

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s triple-industry chemical resistance enables safe use in corrosive environments (e.g., chemical plants).
    • The Advanced Model’s low-power mode reduces energy consumption by 20% compared to traditional ICs.
    • All versions feature RoHS compliance, aligning with global regulatory standards.

  2. Version Selection Guide:

    • Base Model: Best for basic circuits (e.g., LED controllers) where cost-efficiency is prioritized.
    • Advanced Model: Suited for industrial IoT devices needing enhanced thermal and power efficiency.
    • Pro Model: Ideal for mission-critical systems (e.g., aerospace, medical devices) requiring extreme durability and performance.

*30% improvement over industry benchmarks. **Triple the chemical resistance of standard models.

Frequently asked questions

  • Which IC suits small electronics projects needing DIP packaging?

  • Is the SN29850P DIP8 RoHS-compliant?

  • DIP8 vs QFN packaging: Which is better for prototyping?

  • Can SN29850P DIP8 be customized for bulk orders?

  • How to ensure inventory availability for SN29850P?

  • What applications use the SN29850P DIP8 chip?

  • Are DIP8 chips compatible with standard PCBs?

  • How to store DIP8 ICs to prevent damage?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
DIP ICs (SN29850P)Prototyping, low-volume production8-pin DIP package (industry standard), 5V operation (IEC 60068), 105°C max temp ▲
Advanced: 125°C (JEDEC JESD22-A110)		Easy soldering, breadboard compatibility, visible for troubleshootingLarger footprint, 150mW power (vs SMD’s 80mW), higher cost for high-volume use
Surface-Mount (SMD) ICsHigh-volume manufacturing8-pin SOP package (e.g., SOT-23), 3V operation (IEC 60068), 125°C max tempSmaller size, 80mW power, automated assembly compatibilityRequires reflow soldering, harder to repair, less visible for troubleshooting
QFN ICsHigh-frequency, thermal-sensitive appsLeadless package, thermal pad (IPC-7351), 1.2mm height, 150°C max tempSuperior thermal dissipation, compact form factorSensitive to soldering defects, requires reflow processes
PGA ICsHigh-pin-count systems40-pin PGA array (0.1" pitch), 200°C max temp (MIL-STD-883)Robust connections, easy replacement, high pin-count flexibilityBulky design, higher cost, limited to through-hole boards
BGA ICsSpace-constrained devicesBall grid array (0.8mm pitch, IPC-7351), 150°C max tempHighest density, minimal space usageDifficult to inspect, costly rework, requires specialized equipment
SOIC ICsModerate-density boards150mil body width (IPC-7351), 150°C max temp, 14-pin standardEasier handling than BGA/QFN, good thermal performanceLarger than SMD, higher cost than DIP, limited pin count

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.