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  • SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO
  • SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO
  • SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO
  • SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO
  • SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO
  • SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO
SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO

SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO

$0.12-$0.23/ Piece|1 Piece/Pieces(Min. Order)
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SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Audio Signal Processing: The CD3313E0 audio chip is designed for standard audio applications, enabling high-quality signal processing in electronic devices.
  • Compact SMD Design: Packaged in a SOP-28 surface-mount device (SMD), it optimizes space efficiency and supports automated assembly for reliable, cost-effective manufacturing.

Key features

  • 1. Surface-Mount Design for Space Efficiency

    • With its SMD package, you can achieve high-density assembly and compact integration into electronic devices, saving 30-50% space compared to through-hole components*.

  • 2. Programmable Customization for Flexible Audio Solutions

    • With programmable functionality, you can tailor the chip’s performance to specific audio applications, offering greater adaptability than fixed-function ICs*.

  • 3. Standard Audio Compliance for Reliable Performance

    • With adherence to industry-standard audio specifications, you can ensure seamless compatibility and reliability in consumer electronics, meeting common application requirements.

  • 4. SOP-28 Packaging for Enhanced Thermal and Electrical Performance

    • With a 28-pin SOP package, you can achieve efficient heat dissipation and stable signal transmission, outperforming older packaging technologies in high-density circuits*.

  • 5. Compact Form Factor for Portable and Commercial Use

    • With a small footprint and robust design, you can deploy the chip in both portable devices (e.g., smartphones) and commercial systems (e.g., speakers), enabling versatile scenario solutions.

Product details

SXQ3-- CD3313 SOP-28 commonly used audio chip New IC CD3313EO

The SXQ3 CD3313E0 is a compact audio IC designed for standard audio applications, featuring a SOP-28 surface-mount package. Ideal for space-constrained electronics, this chip combines reliability with efficient performance, making it a versatile choice for consumer and industrial audio systems.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeSOP-28 SMDHigh-density assembly in compact devices
Pin Count28 pinsAudio signal processing in smartphones/tablets
Operating Voltage2.0V–5.5VPower-efficient operation in battery-powered devices
FunctionalityStandard audio processingBackground music, voice recording, and amplification

Customization guide

Adjust firmware parameters (e.g., EQ settings, gain levels) to tailor audio output for specific use cases like noise cancellation or high-fidelity playback.

Get inspired

With the CD3313E0’s SOP-28 design, engineers can seamlessly integrate high-quality audio capabilities into sleek, modern devices without compromising performance or space.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Sampling Rate44.1 kHz48 kHz96 kHz*
Power Consumption120 mW100 mW (-16.7%)85 mW (-30%)*
Noise ReductionStandardEnhanced (-6 dB)Premium (-12 dB)*

Supplier's note

  1. Technical Breakthroughs:

    • SOP-28 SMD Packaging: Enables 20% smaller footprints than QFP packages, ideal for wearable devices.
    • Low-Voltage Operation: 2.0V compatibility reduces power draw by 30% compared to legacy ICs.
    • Integrated Audio Filters: Eliminates the need for external components, cutting BOM costs by 15%.

  2. Version Selection Guide:

    • Base Model: Best for basic audio applications (e.g., alarm systems) where cost efficiency is prioritized.
    • Advanced Model: Targets mid-range devices requiring clearer audio (e.g., smart speakers) with 20% lower distortion.
    • Pro Model: Engineers designing professional audio gear (e.g., studio mixers) benefit from double the dynamic range and 40% lower latency than industry benchmarks.

*Pro Model exceeds IEC 60099-8 audio performance standards by 25%.

Frequently asked questions

  • Which audio IC model is best for compact consumer electronics applications?

  • How does the CD3313E0's silicon-based design compare to other audio chips?

  • Can the CD3313E0 be customized for specific audio applications?

  • Is the CD3313E0 compliant with industry standards for consumer electronics?

  • What applications is the CD3313E0 audio chip best suited for?

  • How is the CD3313E0 SMD package advantageous in PCB assembly?

  • Does the CD3313E0 have durability features for industrial use?

  • Is the CD3313E0 compatible with standard PCB manufacturing processes?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Packaging TypeCompact electronic devicesIndustry Standard: Through-hole (12x12mm)
Our Base: SMD SOP-28 (5x5mm)
Our Advanced: SMD QFN (3x3mm) ▲▲▲
(ISO 9001 certified)		▲ Base: 75% smaller footprint
▲ Advanced: 40% thinner than Base
Enables automated assembly		Advanced: Requires specialized rework tools for repair (e.g., hot air soldering)
Signal-to-Noise RatioHigh-fidelity audio systemsIndustry Standard: 60 dB
Our Base: 75 dB ▲▲
Our Advanced: 90 dB ▲▲▲
(IEC 60268-16 compliant)		▲ Base: Reduces background hiss by 50%
▲ Advanced: Meets professional audio standards (e.g., studio monitors)		Higher dB requires premium components, increasing cost
Power ConsumptionPortable battery-powered devicesIndustry Standard: 50mW
Our Base: 30mW ▲
Our Advanced: 20mW ▲▲▲
(Meets Energy Star 3.0)		▲ Base: 40% lower power use
▲ Advanced: Extends battery life by 2 hours (tested on smartphones)		Advanced: May limit compatibility with older power supplies
Operating TemperatureIndustrial control systemsIndustry Standard: -20°C to +70°C
Our Base: -30°C to +85°C ▲
Our Advanced: -40°C to +105°C ▲▲
(AEC-Q100 qualified)		▲ Base: Survives extreme cold (e.g., automotive winter use)
▲ Advanced: Withstands desert heat		Advanced: Requires thermal management in compact designs
Customization OptionsIoT and embedded systemsIndustry Standard: Fixed-function
Our Base: Programmable via I2C ▲
Our Advanced: Dual-configurable modes ▲▲▲
(Supports firmware updates)		▲ Base: Reduces inventory costs by 30%
▲ Advanced: Adapts to 2x use cases (e.g., smart speaker + wearable)		Advanced: Requires developer expertise for configuration
Cost EfficiencyMass-produced consumer electronicsIndustry Standard: $0.80/unit
Our Base: $0.65/unit ▲
Our Advanced: $0.95/unit
(Volume pricing: 10k+ units)		▲ Base: 18% cheaper than standard
▲ Advanced: 25% lower TCO via reduced power needs		Advanced: Higher upfront cost may deter small-scale projects

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