Mounting Type | Electronics assembly requiring compact design or high thermal performance | Through-Hole (IEC 60617) → Surface Mount (SMD, IEC 61760) ▲ → SMD with Thermal Pad (IEC 61760-2) ▲▲ | Base reduces footprint by 40% vs industry standard; Advanced improves heat dissipation by 30% | Base may handle 20% less power; Advanced requires complex assembly |
Power Rating | Low-power circuits → Moderate-power systems → High-power applications | 0.5W (IEC 60747-2) → 1W ▲ (doubles industry standard) → 2W ▲▲ (quadruples standard) | Base suits 1W applications; Advanced supports 2W loads with proper cooling | Base may underperform in high-power scenarios; Advanced needs thermal management |
Voltage Rating | 5-10V systems → 12V systems → 15V systems | 5-10V → 12V ▲▲ (240% increase) → 15V ▲▲▲ (300% increase) | Base supports 12V systems; Advanced enables 15V regulation for robust systems | Base may not suit lower-voltage needs; Advanced requires circuit redesign |
Packaging Type | Compact devices → Moderate-current applications → High-current applications | TO-92 → SMD (SOD-123) ▲ → DPAK (IEC 61760-3) ▲▲ | Base reduces size by 50%; Advanced handles 50% higher current | Base has limited current capacity; Advanced occupies 30% more board space |
Reverse Voltage | Low-voltage protection → 12V protection → 15V protection | 5V → 12V ▲▲ (240% increase) → 15V ▲▲▲ (300% increase) | Base protects 12V circuits; Advanced ensures 15V overvoltage safety | Base may fail in higher-voltage spikes; Advanced requires precise voltage control |
Forward Voltage | General circuits → Efficient power systems → Ultra-low-loss systems | 1.2V → 1.0V ▲ (16% lower) → 0.9V ▲▲ (25% lower) | Base reduces power loss by 16%; Advanced cuts losses by 25% | No significant drawbacks; ideal for energy-sensitive applications |