All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier
  • Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR
  • Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR
  • Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR
  • Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR
  • Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR
  • Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR
Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR
Ready to Ship
In stock Fast dispatch

Screen Printing 3157 SC-70-6 Original Integrated Circuit IC Multiplex Switch IC Chip SGM3157YC6/TR

  • 5 - 499 Pieces
    $0.15
  • 500 - 2999 Pieces
    $0.09
  • 3000 - 11999 Pieces
    $0.06
  • >= 12000 Pieces
    $0.04

Screen Printing 3157 SC-70-6 Original Integrated Circuit IC Multiplex Switch IC Chip SGM3157YC6/TR

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Multiplex Switching: Enables efficient signal routing and power management in electronic circuits, ideal for applications requiring compact switching solutions.
  • Integrated Circuit Design: The SGM3157YC6/TR IC supports high-density circuit layouts, facilitating seamless integration into space-constrained devices like smartphones and portable electronics.

Key features

  • 1. Advanced Material Technology

  • With a transparent-window SC-70-6 package, ensure seamless quality inspection and robust performance in compact electronic systems. The black plastic housing combines durability with visibility for post-production verification, reducing defects in high-volume manufacturing.

  • 2. Streamlined Interactive Design

  • With surface-mount design, achieve streamlined automated assembly and reduce production time compared to through-hole alternatives*. The SC-70-6 package’s precision leads and mounting holes enable efficient integration into modern PCB layouts.

  • 3. High-Performance Switching Capabilities

  • With high-speed switching performance, enable real-time signal routing and power management in applications like smartphones and automotive systems*. The SGM3157YC6/TR outperforms legacy ICs in responsiveness and energy efficiency.

  • 4. Versatile Scenario Solutions

  • With a space-saving SC-70-6 form factor, optimize circuit density for smartphones, wearables, and automotive electronics. Its compact design accommodates tight spaces while maintaining reliability in industrial and consumer-grade environments.

  • 5. Compliance with Industry Standards

  • With compliance to industry standards (e.g., RoHS), meet regulatory requirements for global electronics manufacturing*. The IC’s design ensures compatibility with eco-friendly and safety-certified production processes.

Product details

Screen Printing  3157  SC-70-6   Original Integrated Circuit  IC  Multiplex Switch IC  Chip   SGM3157YC6/TR

The SGM3157YC6/TR Multiplex Switch IC is a compact, surface-mount integrated circuit (SC-70-6 package) designed for space-constrained applications. With a transparent inspection window and robust black plastic housing, it ensures reliable performance in power management, signal processing, and control systems.

Technical specifications

FeatureSpecificationBenefit
Packaging TypeSC-70-6 (Small Outline Surface Mount)Ultra-compact design for high-density PCBs
Mounting TypeSurface Mount (SMD)Easy automated assembly
Lead MaterialTin-Plated CopperEnhanced solderability and conductivity
Operating Temperature-40°C to +85°CReliable performance in industrial environments
Transparent WindowIntegrated on packageSimplifies pre-assembly inspection

Customization guide

Adjustable parameters include lead spacing and material plating to meet specific PCB layout requirements or corrosion-resistant needs in harsh environments.

Get inspired

The SGM3157YC6/TR’s tiny SC-70-6 footprint and multiplex switching capability make it ideal for compact devices like smartphones, wearable electronics, and automotive control modules.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temperature-40°C to +85°C-55°C to +125°C-65°C to +150°C*
Signal Handling Capacity100MHz150MHz200MHz
Chemical ResistanceStandardEnhanced (20% better)Tripled industry norm
Lead Spacing0.65mm0.5mm (denser PCBs)Customizable

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s triple chemical resistance enables safe use in corrosive industrial settings.
    • The Advanced Model’s 150MHz signal handling outperforms traditional ICs by 20%, ideal for high-speed consumer electronics.
    • The transparent window reduces pre-assembly inspection time by 30% compared to opaque packages.
  2. Optimal Version Selection:

    • Pro Model: Engineers designing automotive or industrial systems requiring extreme temperature (-65°C to +150°C) and chemical resistance.
    • Advanced Model: Developers of high-speed consumer devices (e.g., 5G modems) needing compact size and enhanced signal performance.
    • Base Model: General-purpose applications where standard specs suffice, such as basic IoT sensors or low-power wearables.

With the Pro Model’s expanded temperature range, you can deploy this IC in harsh outdoor environments. With its tripled chemical resistance, you can ensure durability in chemical processing equipment.

Frequently asked questions

  • Which multiplex switch IC model suits portable electronic devices like smartphones or wearables?

  • Is the SGM3157YC6/TR compliant with RoHS and AEC-Q100 standards?

  • How does the SC-70-6 package compare to DIP packaging for surface-mount applications?

  • Can the SGM3157YC6/TR be customized for specific voltage or thermal requirements?

  • What applications are best suited for the 3157 multiplex switch IC?

  • How do I ensure proper mounting of the SC-70-6 package on a PCB?

  • Is the SGM3157YC6/TR compatible with existing PCB designs using through-hole components?

  • What voltage and current ratings define the performance of the 3157 IC?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Surface-Mount ICs (SC-70-6)Portable devices, smartphonesPackage size: 2.9x2.2mm (SC-70-6 standard) ▲ 20% smaller than DIP (14x10mm)Compact design ▲ allows 30% higher component density (IPC-9592)Requires reflow soldering equipment ($50k+ investment)
Through-Hole ICs (DIP)Prototyping, educational kits14x10mm package, manual soldering-friendlyEasy to handle without specialized tools25% larger footprint than SC-70-6 ▼
Leadless IC Packages (QFN)Wearables, IoT devices1.5x1.5mm ▲ (no leads, solder balls)40% smaller footprint ▲; lower thermal resistanceRequires ±10μm stencil alignment precision
High-Temperature ICsIndustrial control systemsOperating temp: -40°C to +125°C ▲ (vs standard -20°C to +85°C)Withstands 50°C higher temps ▲ in harsh environments30% higher material costs
Automotive-Grade ICsAutomotive electronicsAEC-Q100 qualified, 100G vibration resistance ▲Meets ISO 26262 safety standards ▲2x longer lead times
**Miniature IC Packages (Advanced)Ultra-compact medical devicesOur Advanced: 1.2x1.2mm ▲ (vs SC-70-6's 2.9x2.2mm)57% smaller footprint ▲ enabling thinner devicesRequires 0.3mm pitch assembly equipment

Related searches

The Product Description is generated by third-party, and Alibaba.com is not liable for any risks related to inaccuracies or the infringement of third-party rights.

The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.