Material Composition | Industrial automation, high-heat devices | Industry Standard: FR-4 (UL 94 V-0 flame rating) Our Base: FR-4 + 0.5mm aluminum backing (▲) Our Advanced: FR-4 + 1.2mm aluminum + ceramic filler (▲▲) | Enhanced thermal conductivity (Base: 1.5W/mK; Advanced: 2.8W/mK) Lightweight yet durable | Higher cost for Advanced tier due to premium materials |
Connectivity Options | IoT devices, robotics | Industry Standard: 5V/12V DC connectors Our Base: USB 2.0 + terminal blocks (▲) Our Advanced: USB-C + 48V industrial connectors + PoE (▲▲) | Supports high-speed data (USB-C: 10Gbps) and power delivery (PoE: 30W) Universal compatibility | Requires specialized adapters for legacy systems |
Component Integration | Embedded systems, control panels | Industry Standard: 100+ components (ISO 1189) Our Base: 250+ components in 100x100mm (▲) Our Advanced: 400+ components with microcontroller (▲▲) | High-density design reduces system size (Advanced: 40% smaller than Base) Direct microcontroller integration | Steeper learning curve for customization |
Thermal Management | Automotive, aerospace | Industry Standard: Natural convection Our Base: Thermal pads + heat sinks (▲) Our Advanced: Active fan cooling + thermal sensors (▲▲) | Maintains operation at -40°C to 85°C (Advanced: 10°C cooler under load) Real-time thermal monitoring | Adds bulk to PCB layout (Advanced: +15% thickness) |
Customization Flexibility | DIY projects, prototyping | Industry Standard: Fixed component layout Our Base: 20+ customizable footprints (▲) Our Advanced: Full-layer routing + 50+ modular slots (▲▲) | Rapid prototyping (Advanced: 80% faster design iterations) Adaptable to custom sensors/actuators | Requires advanced CAD skills for optimization |
EMI Shielding | Medical devices, avionics | Industry Standard: Basic grounding Our Base: Copper foil shielding (▲) Our Advanced: Faraday cage + EMI filter chips (▲▲) | Meets CISPR 25 Class 5 (Advanced: 20dB lower EMI emissions) Reduces signal interference | Adds 25% to manufacturing time for shielding layers |