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  • Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material
  • Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material
  • Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material
  • Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material
  • Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material
  • Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material
Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material

Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material

$100000.00-$150000.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
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Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Vacuum Processing: Designed for encapsulation or vacuum processing, this machine efficiently seals materials under vacuum conditions, ideal for removing air and moisture or creating controlled environments for chemical reactions.
  • Customization Solutions: Known for tailored solutions, this machine can be customized to meet specific industry needs, particularly in semiconductor manufacturing where precise control is crucial.

Key features

  • 1. Advanced Material Technology

    • With a robust metal and plastic construction, the Semiconductor Reactive Ion Etching RIE Machine ensures durability and resilience under high temperatures and pressures, perfect for demanding industrial environments.

  • 2. Interactive Design

    • With a user-friendly control panel featuring a digital display and multiple safety buttons, you can effortlessly monitor and control operational parameters, enhancing usability and safety.

  • 3. Superior Performance Parameters

    • With precision encapsulation capabilities, this machine optimizes vacuum processing, making it ideal for high-quality semiconductor and material processing applications.

  • 4. Versatile Scenario Solutions

    • With customization options, this machine adapts to specific industry requirements, ensuring effective solutions for semiconductor manufacturing and electronics sectors.

  • 5. Comprehensive Safety Features

    • With integrated emergency stop buttons and a transparent window for real-time monitoring, this machine prioritizes operator safety while maintaining process integrity.

Product details

Semiconductor Reactive Ion Etching Rie Machine Plasma Etching for Silicon-Based Wafer Cermet Film Material

The MD-FA100E-R1E is an advanced semiconductor reactive ion etching (RIE) machine designed for plasma etching of silicon-based wafers and cermet film materials. Manufactured by Minder Hightech, this equipment is known for its robust construction and precise operational capabilities, making it suitable for demanding industrial applications.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialMetal and PlasticDurable construction for high-temperature tasks
Voltage220V, 380VAdaptable to different power supply standards
Control PanelDigital DisplayMonitors operational parameters effectively
Safety FeaturesEmergency Stop ButtonsEnsures operator safety in industrial settings

Customization guide

With adjustable voltage settings, you can tailor the MD-FA100E-R1E to meet specific power supply needs, ensuring compatibility with your facility's infrastructure.

Get inspired

Harness the power of precision etching with Minder Hightech's MD-FA100E-R1E, ideal for enhancing your semiconductor processing capabilities with unmatched accuracy and safety.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Etching SpeedStandard+15%+30%*
Control PrecisionBasicEnhancedPremium
CustomizationLimitedModerateExtensive

Supplier's note

The MD-FA100E-R1E introduces three significant technical breakthroughs: enhanced etching speed, improved control precision, and extensive customization options. These features allow for superior process control, essential for semiconductor manufacturing. When selecting the optimal version, consider the applicable crowd data: the Pro Model, with its premium control precision, is ideal for facilities requiring stringent process tolerances, while the Advanced Model offers a balanced approach for most industrial applications.

Frequently asked questions

  • Which model of Minder Hightech's encapsulation system is best suited for small semiconductor manufacturing setups?

  • How do I maintain and care for the Minder Hightech MD-FA100E-R1E vacuum chamber?

  • What materials are used in the construction of Minder Hightech's MD-FA100E-R1E vacuum chamber?

  • Can Minder Hightech's MD-FA100E-R1E vacuum chamber be customized for specific industrial applications?

  • Is Minder Hightech's MD-FA100E-R1E vacuum chamber FDA-approved for use in material processing?

  • How does the MD-FA100E-R1E model ensure safety during operation?

  • What unique selling points does the Minder Hightech MD-FA100E-R1E offer for semiconductor processing?

  • How does the MD-FA100E-R1E model's control panel enhance user operation?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Vacuum Processing SystemsSemiconductor ManufacturingHigh-Temperature Resistance (withstands 150°C)Precise Control (ensures uniform encapsulation)High Energy Consumption (requires 220V or 380V)
Plasma Etching EquipmentSilicon-Based Wafer ProcessingReactive Ion Etching (achieves fine patterning)High Precision (ideal for intricate designs)Requires Specialized Training (complex operation)
Encapsulation SystemsElectronics ManufacturingTransparent Monitoring Window (real-time process visibility)Improved Quality Control (ensures accurate encapsulation)Maintenance Intensive (requires regular cleaning and calibration)
Custom Industrial MachinesMaterial ProcessingCustomizable Features (tailored to specific industry needs)Versatility (adaptable to various applications)Longer Lead Times (customization process extends delivery)
Safety-Enhanced EquipmentIndustrial SettingsEmergency Stop Buttons (quick shutdown in emergencies)Enhanced Operator Safety (reduces risk of accidents)Higher Initial Cost (additional safety features)
High-Pressure SystemsChemical Reactions Under VacuumRobust Construction (withstands high pressures)Enhanced Process Efficiency (improves reaction outcomes)Bulkier Design (requires more space)

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