Cooling System | High-precision cutting of heat-sensitive materials (e.g., solar wafers) | Industry Standard: Passive cooling (up to 50°C) Our Base: Active air cooling (≤45°C) Our Advanced: Enhanced active cooling (≤40°C)▲ | Reduces thermal distortion (Base) Further minimizes material warping (Advanced) | Higher energy consumption (Base) Requires frequent filter maintenance (Advanced) |
Supported Graphics | Design flexibility for diverse projects | Industry Standard: 2–3 formats (e.g., DXF, SVG) Our Base: 3 formats (PLT/DWG/DXF) Our Advanced: 5+ via plugins▲▲ | Direct compatibility with CAD files (Base) Universal file support without conversion (Advanced) | Limited native support for niche formats (Base) Additional plugin costs (Advanced) |
Laser Technology | Precision cutting on reflective/fragile materials | Industry Standard: CO₂/Fiber lasers (e.g., 10.6 µm) Our Base/Advanced: YAG laser (1064 nm wavelength) | Superior absorption in solar cells/glass (Base) Minimal heat-affected zones (Advanced) | Higher cost compared to CO₂ lasers (Base) Less effective on thick plastics (Advanced) |
Material Compatibility | Versatile manufacturing across industries | Industry Standard: 5–8 materials (metals, plastics) Our Base: 8 materials (crystal, glass, wood, etc.) Our Advanced: 10+ via presets▲ | Direct support for solar wafers and composites (Base) Customizable presets for niche materials (Advanced) | Requires calibration for unconventional materials (Base) Steep learning curve for advanced settings (Advanced) |
Power Output | High-volume production of thick/thin materials | Industry Standard: 15–30W Our Base: 20W (Standard precision) Our Advanced: 50W▲▲ (Doubles cutting speed on 5mm glass) | Efficient for thin materials (Base) Rapid processing of thick substrates (Advanced) | Limited throughput for mass production (Base) Higher power consumption (Advanced) |
Wavelength | Material-specific cutting accuracy | Industry Standard: 1064 nm (YAG) or 10.6 µm (CO₂) Our Base/Advanced: 1064 nm (Optimized for solar cells/glass) | Minimal charring on delicate substrates (Base) Sharp edge quality on thin wafers (Advanced) | Poor penetration in thick plastics (Base) Not ideal for organic materials (Advanced) |