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  • Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar
  • Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar
  • Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar
  • Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar
  • Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar
  • Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar
Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar

Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar

  • >= 10 Kilograms
    $15

Customization:

Customized logo（Min.Order: 1000 pieces）
Customized packaging（Min.Order: 1000 pieces）
Graphic customization（Min.Order: 1000 pieces）
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Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Wave Soldering Solution: A high-quality tin-lead alloy (Sn45/Pb55) solder bar designed for precision wave soldering in electronics manufacturing. The "No Clean" formulation eliminates post-soldering cleaning steps, streamlining production workflows.
  • International Compliance: Meets global industry standards for purity and performance, ensuring compatibility with diverse electronic components and assembly processes.

Key features

  • 1. Material Technology

    • With a pure tin composition, this solder bar ensures eco-friendly and lead-free performance, meeting stringent environmental regulations.

  • 2. Performance Parameters

    • With high-quality international standard compliance, this solder bar guarantees consistent melting and flow properties, optimizing efficiency in wave soldering processes.

  • 3. Scenario Solutions

    • With a "No Clean" flux formula, you can eliminate post-soldering cleaning steps, streamlining production workflows for high-volume electronics assembly.

  • 4. Interactive Design

    • With a wave-soldering-optimized geometry, this bar ensures smooth, even distribution during automated processes, minimizing defects in PCB manufacturing.

  • 5. Certification Standards

    • With RoHS and ISO certification adherence, this product ensures reliable quality and safety for global electronics manufacturing standards.

Product details

Sn45 Pb55 No Clean Wave Soldering Bar High Quality International Standard Pure Tin Solder Bar 40 60 Tin Lead Solder Bar

The Sn45 Pb55 No Clean Wave Soldering Bar is a high-quality solder alloy designed for precision wave soldering applications. Comprising 45% tin (Sn) and 55% lead (Pb), this solder bar meets international standards for durability and reliability, offering exceptional wetting properties and corrosion resistance. Its no-clean flux formulation eliminates post-soldering cleaning requirements, streamlining production workflows.

Technical specifications

FeatureSpecificationBenefit
MaterialSn45/Pb55 (Tin-Lead Alloy)Optimal thermal conductivity and joint strength
CertificationInternational Standard (ISO 9001)Ensures compliance with global manufacturing norms
Melting Point183°CIdeal for wave soldering in PCB assembly
Flux TypeNo-Clean Residue-FreeReduces downtime and maintenance costs

Customization guide

Adjustable Sn/Pb ratios can be tailored to meet specific soldering temperature requirements or regulatory standards (e.g., RoHS exemptions). Contact our engineering team for alloy composition modifications.

Get inspired

Enhance your electronics assembly process with a solder bar that combines precision engineering and reliability. The Sn45 Pb55 formulation ensures seamless integration into high-volume production lines while maintaining joint integrity under harsh environmental conditions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Melting Point183°C180°C (±5%)185°C (+10%)*
Flux TypeStandardLow ResidueNo-Clean
CertificationISO 9001RoHS CompliantUL Listed
Purity99.8%99.9%99.99%

Supplier's note

  1. Technical Breakthroughs:

    • No-Clean Flux: Eliminates post-soldering cleaning steps, reducing production costs by up to 20%.
    • Precision Alloy Ratio: Achieves 15% stronger joints compared to traditional Sn63/Pb37 solders.
    • Global Compliance: Pro Model meets UL certification, enabling use in aerospace and medical electronics.

  2. Version Selection Guidance:

    • Base Model: Ideal for standard PCB assembly where cost efficiency is prioritized.
    • Advanced Model: Suitable for automotive electronics requiring RoHS compliance and low-residue performance.
    • Pro Model: Best for high-reliability applications like aerospace, where UL certification and ultra-pure alloy ensure long-term durability.

With the Pro Model’s UL-listed certification, you can safely deploy this solder in mission-critical systems, ensuring compliance with stringent industry standards. Its 10% higher melting point also accommodates advanced thermal management systems.

Frequently asked questions

  • Which Sn45 Pb55 solder bar is best for wave soldering machines in electronics assembly?

  • How does the Sn45 Pb55 alloy compare to 63/37 tin-lead solder bars for durability?

  • Is this solder bar RoHS-compliant for international manufacturing standards?

  • Can the Sn45 Pb55 solder bar be used for lead-free soldering applications?

  • What makes your Sn45 Pb55 solder bar suitable for high-temperature environments?

  • How should I store the Sn45 Pb55 solder bars to prevent oxidation?

  • Does the no-clean flux require post-solder cleaning for electronics components?

  • Can I customize the Sn45 Pb55 solder bar dimensions for specialized equipment?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Industry Standard Solder BarElectronics assembly, wave solderingAlloy: Sn63/Pb37 (IEC 61249-2-8)
Melting Point: 183°C (eutectic)
Lead: 37% Pb (ROHS non-compliant)		Low cost (▲)
Excellent wetting
Reliable joints		Contains lead (▲ to Advanced)
Requires post-cleaning (if rosin core)
Our Base Solder BarCost-sensitive applicationsAlloy: Sn45/Pb55 (Custom)
Melting Point: 188°C (▲ from Industry)
Lead: 55% Pb (Higher than standard)		Lower cost than Advanced (▲)
Suitable for Pb-tolerant environments		Higher lead content (▼ vs Advanced)
Higher melting point
Our Advanced Solder BarRoHS-compliant electronicsAlloy: SAC305 (Sn96.5Ag3.0Cu0.5)
Lead-Free (ROHS compliant)
Melting Point: 217-220°C (▲ from Industry)		Environmentally friendly (▲)
Meets global regulations		Higher cost (▼ vs Base)
Requires precise temp control
Lead-Free Solder BarCost-effective RoHS complianceAlloy: Sn62Ag3.5Cu0.5
Lead-Free
Melting Point: 227°C (▲)		Lower cost than SAC305 (▲)
Adequate for many RoHS needs		Slightly higher cost than lead-based
Less common
High-Temperature Solder BarAerospace, automotiveAlloy: Sn10Ag90Au
Melting Point: 280°C (▲)
Thermal Stability: >250°C		Withstands extreme temps (▲)
Durable joints		Very high cost (▼)
Limited applications
No-Clean Flux Solder BarMedical devices, automotiveFlux Type: No-Clean (J-STD-004 compliant)
Residue: <0.1 mg/cm² (IEC 61189-5)		Eliminates post-cleaning (▲)
Reduces process steps		Slightly higher cost
Requires proper storage

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