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  • Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic
  • Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic
  • Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic
  • Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic
  • Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic
  • Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic
Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic

Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic

$0.45-1.99/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized logo（Min.Order: 100000 pieces）
Customized packaging（Min.Order: 100000 pieces）
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Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Versatile Microcontroller Support: Integrates STM32G030C8T6 (ARM Cortex-M0+) and STM8S003K3T6 (8-bit STM8 core) for embedded systems, enabling low-power IoT, industrial control, and consumer electronics applications.
  • High-Performance Processing: Features Qualcomm 7150 (Snapdragon 7150) for advanced mobile/IoT device functionality, alongside a dedicated power IC for efficient voltage regulation and energy management.
  • Surface-Mount Design (SMT): Compact, reliable mounting type ideal for space-constrained electronics.

Key features

  • 1. Advanced SMT Mounting Technology

    • With Surface Mount Technology (SMT), you can achieve compact designs and improved thermal dissipation compared to through-hole components*.

  • 2. Programmable Multi-Function Presets

    • With customizable multi-program presets, you can adapt to diverse applications such as industrial automation or consumer electronics.

  • 3. High-Performance Processing Capabilities

    • With enhanced processing speeds, you can execute complex tasks up to 30% faster than standard ICs* (e.g., STM32G030C8T6’s Cortex-M0+ core).

  • 4. Versatile Scenario Adaptability

    • With SMT compatibility, you can integrate into space-constrained devices for commercial, industrial, or IoT applications.

  • 5. Compliance with Global Standards

    • With certifications like RoHS and ISO 9001, you can ensure eco-friendly and quality-assured manufacturing practices*.

Product details

Surprise Priceic id5s606b STM32G030C8T6 STM8S003K3T6 qualcomm 7150 power ic

The Surprise Priceic ID5S606B series integrates advanced IC solutions including STM32G030C8T6, STM8S003K3T6, Qualcomm 7150, and a high-performance power IC. Designed for SMT mounting, these chips cater to diverse applications from low-power IoT devices to high-end embedded systems.

Technical specifications

FeatureSpecificationApplication Scenario
STM32G030C8T648MHz Cortex-M0+, 32KB Flash, SMTIndustrial control, sensor nodes
STM8S003K3T68-bit MCU, 3KB Flash, SMTBasic IoT sensors, battery-operated devices
Qualcomm 7150LTE Cat.18, 2.0GHz Octa-core, SMT4G/5G modems, smart gateways
Power IC3.3V-5V input, 95% efficiency, SMTPower management in embedded systems

Customization guide

Adjustable parameters include voltage tolerance ranges (±5% to ±10%) and package types (QFN/TSSOP) to meet specific PCB layout or power density requirements.

Get inspired

Optimize your embedded system design with our versatile IC portfolio. Whether you need ultra-low power consumption for wearables or high-speed processing for industrial automation, the Surprise Priceic series delivers scalable performance.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Power32MHz (STM8S)48MHz (STM32G030)2.0GHz (Qualcomm)
Memory3KB Flash32KB Flash1GB RAM
Power Efficiency85%92%95%
ConnectivityNoneUART/I2CLTE Cat.18

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s Qualcomm 7150 achieves 20% faster data throughput than prior LTE modems.
    • The STM32G030C8T6 in the Advanced Model offers 30% lower latency than STM8S003K3T6 for real-time control.
    • All versions feature SMT compatibility, reducing assembly costs by 15% vs. through-hole alternatives.

  2. Optimal Version Selection:

    • Hobbyists/Prototypers: Base Model (STM8S003K3T6) suffices for low-cost, simple projects.
    • Industrial Users: Advanced Model (STM32G030C8T6) balances performance and cost for automation systems.
    • Telecom/5G Deployments: Pro Model (Qualcomm 7150) delivers triple the bandwidth of legacy 4G solutions, ensuring seamless IoT connectivity.

With the Pro Model’s 95% power efficiency, you can reduce thermal management costs in edge computing devices. The Advanced Model’s 32KB Flash enables complex firmware for smart home hubs. Choose SMT mounting to streamline high-volume manufacturing workflows.

Frequently asked questions

  • Which STM32G030C8T6 model suits IoT applications with limited power resources?

  • How to ensure proper storage for SMT-mounted Qualcomm 7150 ICs?

  • What certifications validate the STM8S003K3T6’s industrial use?

  • Can the Qualcomm 7150 IC be programmed for custom 5G modules?

  • Which IC is better for low-cost microcontroller projects: STM8S003K3T6 or STM32G030C8T6?

  • Does the Surprise Priceic ID5S606B support thermal management features?

  • What applications are best suited for the Qualcomm 7150 IC?

  • Are there volume discounts for bulk purchases of STM32G030C8T6 ICs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Power EfficiencyBattery-operated devices1.2mA (Std) ▲ 0.9mA (Base) ▲ 0.6mA (Adv) (IEC 60068-2-30 quiescent current)Extended battery life ▲ Lower energy consumption ▲ Optimal for IoT sensorsHigher cost for Advanced-tier components
Operating TemperatureIndustrial/automotive systems-40°C to +85°C (Std) ▲ -55°C to +150°C (Base/Adv) (MIL-STD-810H thermal)Reliable in harsh environments ▲ Base/Adv handle extreme conditionsBase/Advanced require specialized thermal management
Package TypeSpace-constrained embedded systemsQFN (Std) ▲ TQFP (Base) ▲ BGA (Adv) (IPC-7351 package standards)Smaller footprint ▲ BGA enables high-density integrationBGA requires advanced PCB assembly (e.g., reflow soldering)
Communication InterfacesIoT/hub connectivity devicesI2C/SPI (Std) ▲ +UART (Base) ▲ +USB (Adv) (ISO/IEC 11801 protocol compliance)Simplified low-speed comms ▲ Base adds serial comms ▲ Advanced supports USB 2.0Increased complexity for multi-protocol firmware development
Memory CapacityComplex code storage needs8KB Flash (Std) ▲ 32KB (Base) ▲ 128KB (Adv) (ISO/IEC 17369 memory testing)Adequate for basic tasks ▲ Base supports moderate code ▲ Advanced enables AIHigher memory increases cost and power draw
Clock SpeedHigh-performance computing tasks24MHz (Std) ▲ 48MHz (Base) ▲ 72MHz (Adv) (JEDEC JESD22-C101 speed grading)Fast enough for sensors ▲ Base handles light processing ▲ Advanced runs MLHigher speeds increase heat output and power consumption

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